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A chemical nickel-gold process with ultra-low nickel corrosion

An electroless nickel-gold and nickel corrosion technology, applied in metal material coating process, liquid chemical plating, coating and other directions, can solve the problem that the performance has not been greatly improved, and achieve low corrosion potential and corrosion current density, The effect of long replacement cycle and long service life

Active Publication Date: 2021-09-24
广州皓悦新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, although this technology reduces the corrosion of nickel through the pre-treatment of the production line process, the amount of micro-etching and the control of the nickel cylinder, the performance of the actual application has not been greatly improved because the corrosion of nickel has always existed, " Nickel corrosion" technology is still a difficult point in chemical nickel gold that needs to be broken through

Method used

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  • A chemical nickel-gold process with ultra-low nickel corrosion
  • A chemical nickel-gold process with ultra-low nickel corrosion
  • A chemical nickel-gold process with ultra-low nickel corrosion

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0055] A chemical nickel-gold process for ultra-low nickel corrosion, comprising the following steps:

[0056] S1) Pretreatment: take the substrate and carry out the steps of degreasing, washing twice, micro-etching, washing twice, pickling, washing twice, pre-soaking, washing twice, activation, washing twice and post-dip step, to obtain the pre- processing substrates;

[0057] Degreasing is soaking for 4 minutes with an aqueous solution containing 5wt% phosphoric acid and 5wt% sulfuric acid. The microetching is soaked in an aqueous solution containing 5wt% sulfuric acid and 5wt% sodium persulfate for 1 min. Pickling, pre-soaking and post-soaking are all soaked in an aqueous solution containing 0.5wt% sulfuric acid for 1 min. Activation is soaking for 1 min with an aqueous solution containing 0.5 wt % sulfuric acid and 20 mg / L palladium sulfate.

[0058] S2) Electroless nickel plating; immersing the pretreated copper sheet in step S1 in an electroless nickel plating solutio...

Embodiment 2

[0066] A chemical nickel-gold process for ultra-low nickel corrosion, comprising the following steps:

[0067] S1) Pretreatment: take the substrate and carry out degreasing, water washing twice, micro-etching, water washing twice, pickling, water washing three times, pre-soaking, water washing twice, activation, water washing twice and post-soaking steps to obtain the pre- processing substrates;

[0068] Oil removal is soaked for 5 minutes with an aqueous solution containing 5wt% phosphoric acid and 5wt% sulfuric acid. The microetching is soaked in an aqueous solution containing 5wt% sulfuric acid and 5wt% sodium persulfate for 1 min. Pickling, pre-soaking and post-soaking are all soaked in an aqueous solution containing 0.5wt% sulfuric acid for 1 min. Activation is soaking for 1 min with an aqueous solution containing 0.5 wt % sulfuric acid and 25 mg / L palladium sulfate.

[0069] S2) Electroless nickel plating; immersing the pretreated copper sheet in step S1 in an electro...

Embodiment 3

[0077] A chemical nickel-gold process for ultra-low nickel corrosion, comprising the following steps:

[0078] S1) Pretreatment: Take the substrate and carry out degreasing, water washing twice, micro-etching, water washing three times, pickling, water washing three times, pre-soaking, water washing three times, activation, water washing two times and post-soaking steps successively to obtain the pre- processing substrates;

[0079] Oil removal is soaked for 5 minutes with an aqueous solution containing 6wt% phosphoric acid and 5wt% sulfuric acid. The microetching is soaked in an aqueous solution containing 5wt% sulfuric acid and 8wt% sodium persulfate for 1 min. Pickling, pre-soaking and post-soaking are all soaked in an aqueous solution containing 0.5wt% sulfuric acid for 1.5min. Activation is soaking for 1 min with an aqueous solution containing 1 wt % sulfuric acid and 25 mg / L palladium sulfate.

[0080] S2) Electroless nickel plating; immersing the pretreated copper sh...

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Abstract

The invention belongs to the technical field of chemical nickel and gold, and in particular relates to an ultra-low nickel corrosion chemical nickel and gold process. An ultra-low nickel corrosion chemical nickel-gold process is characterized in that it comprises the following steps: S1) pretreatment; S2) chemical nickel plating; S3) water washing; S4) chemical gold plating; S5) post-treatment. The plating layer obtained by the chemical nickel gold process of the present invention has high corrosion resistance, and the chemical gold plating solution in the chemical nickel gold process has good stability and long service life, which meets the quality requirement of PCB "nickel corrosion".

Description

technical field [0001] The invention belongs to the technical field of chemical nickel and gold, and in particular relates to an ultra-low nickel corrosion chemical nickel and gold process. Background technique [0002] In the PCB industry, in order to ensure the reliability and operability of downstream assembly, surface treatment of PCB boards is required. Among them, the surface-treated chemical nickel gold is first coated with a layer of metal nickel on the basis of the original base material, and then coated with a layer of metal gold, which has: 1) high temperature non-oxidation, good solderability; 2) high flatness , suitable for the assembly of highly integrated products; 3) the advantages of low contact resistance, so chemical nickel gold is widely used. [0003] At present, although chemical nickel gold has various advantages, there are also technical problems that are difficult to overcome in its process, that is, nickel corrosion will occur in the actual process...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/42C23C18/44C23C18/32H05K3/18
CPCC23C18/1651C23C18/32C23C18/42C23C18/44H05K3/181
Inventor 丁先峰魏振峰钟文波
Owner 广州皓悦新材料科技有限公司
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