The invention relates to chemical-
copper plating liquid and a
copper plating production process, which are used for
copper plating of tubular steel and iron pieces and non-
metal pieces, and are characterized in that: the chemical-
copper plating liquid consisting of copper sulphate, a
retarder, a complexant, a reductant and deionized water is used to pretreat a workpiece and then the workpiece is subjected to chemical-
copper plating; an
anode is 0.3 percent
phosphor-containing copper plate; the
area ratio of the
anode and the
cathode is 2:1; the current intensity in the
cathode is 0.5 to 4A / dm<2>; the pH value of the
copper plating liquid is 1.0 to 3.0; the temperature of the copper plating liquid is normal temperature; and the
carrying capacity is 1 to 4dm<2> / kg; the copper plating time is8 to 10 minutes. The liquid and the process have the advantages of firm bonding between cladding and a substrate, stable process, high
impurity resistance, long service life, crystalline simple copper cladding, fine cladding
crystallization, low
porosity, high anticorrosion performance, simple operation, convenient maintenance, no
formaldehyde, no damages to human bodies and environment and environmentally-friendly product.