Chemical-copper plating liquid and copper plating production process

Abstract

The invention relates to chemical-copper plating liquid and a copper plating production process, which are used for copper plating of tubular steel and iron pieces and non-metal pieces, and are characterized in that: the chemical-copper plating liquid consisting of copper sulphate, a retarder, a complexant, a reductant and deionized water is used to pretreat a workpiece and then the workpiece is subjected to chemical-copper plating; an anode is 0.3 percent phosphor-containing copper plate; the area ratio of the anode and the cathode is 2:1; the current intensity in the cathode is 0.5 to 4A/dm<2>; the pH value of the copper plating liquid is 1.0 to 3.0; the temperature of the copper plating liquid is normal temperature; and the carrying capacity is 1 to 4dm<2>/kg; the copper plating time is8 to 10 minutes. The liquid and the process have the advantages of firm bonding between cladding and a substrate, stable process, high impurity resistance, long service life, crystalline simple copper cladding, fine cladding crystallization, low porosity, high anticorrosion performance, simple operation, convenient maintenance, no formaldehyde, no damages to human bodies and environment and environmentally-friendly product.

Description

technical field [0001] The invention relates to a chemical-electroplating copper solution, which is suitable for copper-plating iron and steel tubular workpieces and non-metal parts, and belongs to the field of copper-plating solutions. [0002] The invention also relates to a copper plating production process using the electroless copper plating solution. technical background: [0003] For more than 160 years of electroplating history, cyanide copper plating has been widely used in copper plating, and electroless copper plating is copper plating with formaldehyde as a reducing agent. The common defects of the two are: first, the application fields and functions are not compatible with each other. Cyanide copper plating can only electroplate copper on metal surfaces, and it is meaningless on non-metals. Electroless copper plating has no application value for copper plating on metal workpieces. The second is that they are all poisonous and harmful substances, which are very...

AI Technical Summary

Problems solved by technology

[0003] For more than 160 years of electroplating history, cyanide copper plating has been widely used in copper plating, and electroless copper plating is copper plating with formaldehyde as a reducing agent. The common defects of the two are: first, the application fields and functions are not compatible with each other

Electroless copper plating has no application value on copper plating on metal workpieces

The second is that they are all toxic and harmful substances, which are very harmful to the human body and the environment.

The third is that the deposition speed is slow, especially the deposition speed of electroless copper plating is only 0.17 μm / hour. Except for copper plating on circuit boards, copper plating in other fields has no use value

Its disadvantages are: they are all used for copper plating on circuit boards, and have no use value on steel and other non-metallic materials; second, the copper ion content is low 2 to 30 g / L, and the deposition speed is slow; third, copper plating is strong at high temperatures. In alkali, copper ions are quickly oxidized by copper hydroxide, copper oxide and monovalent copper, the solution has poor stability and difficult maintenance operations; the fourth is that the service life is short, it will be scrapped quickly, and the production cost is high; most solutions generally contain strong Complexing agent EDTA, it is difficult to treat sewage after plating, metal ions are not easy to separate, and it is easy to cause new environmental pollution

[0006] In summary, it can be seen from the patented technology of cyanide-free copper plating and formaldehyde-free copper plating at home and abroad that they are used for copper plating on iron and steel metals. The process is immature and unstable, and cannot be industrialized, and they cannot replace cyanide copper plating.