The invention relates to the technical field of circuit board manufacturing, and discloses a
blind hole processing method of a multi-layer printed board. The
blind hole processing method comprises thefollowing steps: S1,
processing process edge; S2, windowing of PP sheet; S3, hollowing out the PP sheet; S4, pressing in the early stage; S5, first back drilling; S6, pressing all chips; S7, second back drilling; and S8, obtaining the finished product. The setting of notches and windows in the steps S1 and S2 of the processing method can ensure that the first
copper foil on the upper surface of the Nth layer core board at the notches is exposed and the pressing feet of the drilling
machine can be pressed on the first
copper foil of the Nth core plate after pressing of the core plate. Therefore, when the
drill bit contacts the first
copper foil on the upper surface of the Nth layer core plate, the press feet of the drilling
machine and the drilling bit form a circuit to generate current and the
drill bit stops drilling. Compared with the method of pressing the presser feet of the drilling
machine on the first
copper foil on the upper surface of the first layer core plate, the drillingdepth can be accurately controlled to ensure that the first
copper foil on the upper surface of the Nth layer core plate is just drilled without drilling through the
copper foil, thus ensuring the accuracy of the drilling depth and greatly improving the success rate of processing.