Partition-optimized ultrathin VC with thickness of 0.1-0.4 mm and preparation method

Abstract

The invention discloses a partition-optimized ultrathin VC with the thickness of 0.1-0.4 mm and a preparation method. The ultrathin VC comprises an upper cover plate and a lower cover plate, and the upper cover plate and the lower cover plate are welded. Each of the upper cover plate and the lower cover plate comprises an evaporation section, a heat insulation section and a condensation section; the surface of the evaporation section of the upper cover plate is of a super-hydrophilic cavity-shaped micro-nano structure, the surface of the heat insulation section of the upper cover plate is of asuper-hydrophilic equal-width groove micro-nano structure, and the surface of the condensation section of the upper cover plate is of a super-hydrophobic conical micro-nano structure; and a super-hydrophilic conical micro-nano structure is arranged on the surface of the area of the evaporation section of the lower cover plate, a super-hydrophilic cactus-like wedge-shaped groove micro-nano structure is arranged on the surface of the area of the heat insulation section, and a super-hydrophilic conical micro-nano structure is arranged on the surface of the area of the condensation section. The invention further discloses a preparation method of the ultrathin VC. A steam cavity structure, a liquid cavity structure and volume distribution in a heat pipe can be optimized, and good capillary water absorption performance and low water resistance and heat resistance of the heat pipe can be guaranteed.

Description

technical field [0001] The invention relates to the technical field of vapor chambers, in particular to a 0.1-0.4mm ultra-thin VC with optimized partitions and a preparation method. Background technique [0002] With the rapid development of microelectronics technology, especially 5G technology, various electronic devices and devices, especially ultra-thin mobile devices represented by 5G smartphones and tablet computers, are constantly moving towards high performance, integration, miniaturization and thinness. With the development in the direction of globalization, the density of components increases, the endurance of power supply increases, and the power consumption of the system increases. With the continuous compression of the thickness of the fuselage, the heat generated per unit volume continues to rise. The heat dissipation problem caused by high heat flux has become a constraint on the usability of electronic equipment. , the key limiting factor of reliability and se...

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Problems solved by technology

[0004] The development of 5G technology requires that the heat dissipation capacity of the vapor chamber be further improved and the thickness be further reduced. Especially when the thickness of the vapor chamber is less than 0.4mm, the thickness of the liquid-absorbing core will be thinner, and its capillary performance will be significantly reduced. The interfacial shear force caused by high-speed gas-liquid convection increases, the water resistance and air resistance increase significantly, and the heat transfer efficiency decreases rapidly

[0006] In summary, the existing mechanical manufacturing methods of ultra-thin heat pipe mesh, powder spraying, and high-temperature brazing packaging are difficult to further reduce the thickness of heat pipes. Laser methods are effective in preparing hydrophilic, superhydrophilic, hydrophobic, and superhydrophobic structures There are advantages in structural layout, but the existing patents using the laser method are generally aimed at heat pipes with a thickness of 0.5mm and above, and hardly involve heat pipes with a thickness of 0.1-0.4mm

However, when the thickness of the heat pipe is further reduced to below 0.4 mm, how to optimize the structure of the vapor cavity and liquid cavity and volume distribution inside the heat pipe, and how to ensure its good capillary water absorption performance and low water resistance and thermal resistance are still a big problem. challenge

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