Partition-optimized ultrathin VC with thickness of 0.1-0.4 mm and preparation method

A partition-optimized, ultra-thin technology, applied in lighting and heating equipment, indirect heat exchangers, etc., can solve problems such as increased interface shear force, reduced heat pipe thickness, low water resistance, thermal resistance, etc., to reduce vapor resistance , Reduce liquid flow resistance, reduce the effect of water resistance

CN111879158APending Publication Date: 2020-11-03绍兴镭纳激光科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2020-11-03

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Abstract

The invention discloses a partition-optimized ultrathin VC with the thickness of 0.1-0.4 mm and a preparation method. The ultrathin VC comprises an upper cover plate and a lower cover plate, and the upper cover plate and the lower cover plate are welded. Each of the upper cover plate and the lower cover plate comprises an evaporation section, a heat insulation section and a condensation section; the surface of the evaporation section of the upper cover plate is of a super-hydrophilic cavity-shaped micro-nano structure, the surface of the heat insulation section of the upper cover plate is of asuper-hydrophilic equal-width groove micro-nano structure, and the surface of the condensation section of the upper cover plate is of a super-hydrophobic conical micro-nano structure; and a super-hydrophilic conical micro-nano structure is arranged on the surface of the area of the evaporation section of the lower cover plate, a super-hydrophilic cactus-like wedge-shaped groove micro-nano structure is arranged on the surface of the area of the heat insulation section, and a super-hydrophilic conical micro-nano structure is arranged on the surface of the area of the condensation section. The invention further discloses a preparation method of the ultrathin VC. A steam cavity structure, a liquid cavity structure and volume distribution in a heat pipe can be optimized, and good capillary water absorption performance and low water resistance and heat resistance of the heat pipe can be guaranteed.
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Description

technical field

[0001] The invention relates to the technical field of vapor chambers, in particular to a 0.1-0.4mm ultra-thin VC with optimized partitions and a preparation method. Background technique

[0002] With the rapid development of microelectronics technology, especially 5G technology, various electronic devices and devices, especially ultra-thin mobile devices represented by 5G smartphones and tablet computers, are constantly moving towards high performance, integration, miniaturization and thinness. With the development in the direction of globalization, the density of components increases, the endurance of power supply increases, and the power consumption of the system increases. With the continuous compression of the thickness of the fuselage, the heat generated per unit volume continues to rise. The heat dissipation problem caused by high heat flux has become a constraint on the usability of electronic equipment. , the key limiting factor of reliability and se...

Examples

Embodiment 1

[0041] A 0.1-0.4mm ultra-thin VC optimized for partitioning, including an upper cover 1 and a lower cover 2, the upper cover 1 and the lower cover 2 are connected by laser welding; the upper cover 1 includes a first evaporation section 11, a second An adiabatic section 12 and a first condensing section 13; the area surface of the first evaporation section 11 is set as a super-hydrophilic cavity-shaped micro-nano structure; the area surface of the first adiabatic section 12 is set as a super-hydrophilic equal-width groove micro-nano structure; The area surface of the first condensation section 13 is set to a superhydrophobic conical micro-nano structure; the lower cover plate 2 includes a second evaporation section 21, a second adiabatic section 22 and a second condensation section 23; the area surface of the second evaporation section 21 is set to Superhydrophilic conical micro-nano structure; the surface of the second thermal insulation section 22 is set as a super-hydrophilic...