Method and system for forming blind gongs on printed circuit board (PCB) and circuit board

Abstract

The invention discloses a method and system for forming blind gongs on a printed circuit board (PCB) and a circuit board to improve the precision of machining the blind gongs on the PCB. The method comprises the following steps: forming at least two blind gong locating holes on the PCB and obtaining the location information of the first blind gong locating hole; installing a pin in each blind gong locating hole and inserting each pin into a corresponding pin clip on a bench of a blind gong forming machine, wherein the pin in the first blind gong locating hole is inserted into the pin clip on the location of an origin of the bench; and determining the machining origin according to the location information of the first blind gong locating hole and the origin on the bench and beginning machining the blind gongs on the PCB from the machining origin to form corresponding gong slots.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method, system and circuit board for forming blind gong processing of printed circuit boards. Background technique [0002] At present, the production process of a typical printed circuit board (PCB) is as follows: blanking→inner layer production→pressing→drilling→copper plating→outer layer production→solder resist printing→text printing→surface Processing → shape processing. Because some products need to install part of the components into the PCB board, therefore, in the shape processing process of these PCBs, it is necessary to carry out gong grooves on the PCB board, that is, blind gong processing. [0003] Generally, blind gong processing is carried out on PCB by blind gong forming machine, see figure 1 , fix the auxiliary platform bakelite board 102 on the machine table 101 of the blind gong forming machine, then implant pins 103 on the auxiliar...

AI Technical Summary

Problems solved by technology

The machining accuracy of the blind gong molding machine is high, but there are some problems with the auxiliary platform bakelite board, for example: the thickness of the auxiliary platform bakelite board has a tolerance of ±0.1mm, or the auxiliary platform bakelite board is easy to warp

In this way, it is difficult to control the depth of blind gongs during PCB blind gong processing, which seriously affects the accuracy of blind gong processing.

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