260 results about "Bakelite" patented technology

This invention is attributed to the technology of nano-composite materials and specifically relates to a method to prepare nano-sized silicon dioxide / boron phenolic resin nano-composite materials. In this method, solution blending and ultrasonic wave-aided dispersion are combined so as to ensure nano-sized dispersion of the nano-particles in composite materials. The nano-sized silicon dioxide is surface treated so as form good interfaces with boron phenolic resin matrix and to adequately take advantages of nano-sized silicon dioxide and boron phenolic resin. This invention aims at preparing boron phenolic resin nano-composites with different nano-sized silicon dioxide content by reasonable technique control. The rigidity, wear resistance and thermo-chemical stability of nano-sized silicon dioxide and good mechanical properties, thermo resistance and ablation resistance of boron-modified phenolic resin are utilized, and therefore the prepared nano-sized silicon dioxide / boron phenolic resin nano-composite materials can be widely used in high-temperature abrasion materials, ablation resistant materials, special structural materials and thermo resistant materials.

The present invention relates to welding and cutting equipment technology, and is especially one plasma cutting torch collision preventing device for numerically controlled plasma cutting machine. The plasma welding torch collision preventing device includes one turning plate and one bottom ring connected together, one lower clamping ring with permanent magnet and inductor type approach sensor, one blocking iron set between the bottom ring and the lower clamping ring, one electrically insulating bakelite sleeve inside the conic hole of the lower clamping ring, and one upper clamping ring set around the upper end of the bakelite sleeve and connected to the lower clamping ring; and the plasma cutting torch is set inside the upper clamping ring and the bakelite sleeve. The present invention protect the plasma cutting torch by means of the inductor type approach sensor to send out signal, the control system to perform corresponding commands, and detection coil and the lower clamping ring to separate or displace.

The invention relates to a preparation method for a formed catalyst for directly catalyzing N2O to decompose, and belongs to the technical field of environment protection catalytic materials and air pollution control. According to the catalyst, a compound material is used as a carrier to load metal oxide. The main active components are oxides of Zn and Ni, and one or two types from the oxides of Cu, Fe, Sr, La, Co, K, Na, Zr, Y or Ba are simultaneously loaded. The catalyst is characterized in that the compound material comprises two or more substances including clay, active carbon, bakelite powder, sesbania powder, special pseudo-boehmite powder, SiO2, TiO2, ZrO2, sandy soil and zinc oxide; the catalyst is columnar, clover-shaped or takes the shape of geranium nepalense sweet; the external diameter is 1-20 mm. The metal oxides accounts for 30-55% of the total weight of the catalyst, wherein the nickel oxide accounts for 1-5%, and the zinc oxide accounts for 30-45%. The catalyst can be widely used for removal and decomposing of N2O in a nitric plant, an adipic acid plant and other industrial process generating N2O.

The invention discloses a segmented liquid level sensor based on the capacitance-to-digital conversion technology. A seven-segment sensor inner pole cylinder is a copper foil electrode bonded onto bakelite. An outer pole cylinder is a stainless steel sensor shell, the copper foil electrode is connected with a waterproof sensor junction box through a lead, the copper foil electrode is sleeved with a polytetrafluoroethylene insulation layer, an aviation plug is arranged on one side of the waterproof sensor junction box, and the top of the waterproof sensor junction box is provided with a sensor upper cover. According to the segmented liquid level sensor, a capacitance-to-digital conversion technology chip PCAPO1 is used in the capacitance detection method, the problem of stray capacitance of capacitance measurement is solved, the problem of measurement of multiple sections of capacitance at the same time is solved, compensation calibration can be performed on the stray capacitance in the chip through a circuit and an algorithm, and the compensation result is that gain offset within a proper temperature range can be achieved. Exchange between data and a host can be performed conveniently through an SPI or IIC data serial interface. The segmented liquid level sensor is low in noise, low in power consumption and simple in peripheral circuit, and microminiaturization and integration can be achieved easily.

The invention relates to the technical field of phenolic resin composite materials, in particular to a graphene phenolic resin composite material. Oxidized graphene, hydrazine hydrate, a surfactant and a formaldehyde solution are added into a reactor, stirred and heated up to 80-100 DEG C for reaction; the obtained liquid reactant is cooled down to 60-80 DEG C, then an acid catalyst and phenol are added, the temperature is increased to 85-100 DEG C for reaction, and then heating dehydration is performed. The graphene phenolic resin composite material can be applied to bakelite powder. As the proper surfactant is adopted, the problem of dispersion of graphene in resin is solved, and uniformly mixed graphene modified phenolic resin is obtained; the oxidized graphene which is not reduced can further react with phenolic resin to obtain graphene modified phenolic resin of an inorganic complexing structure; the bakelite powder prepared by resin has relatively high impact resistance and low forming shrinkage ratio.

The invention relates to the technical field of phenolic resin composite materials, in particular to a graphene phenolic resin composite material. Oxidized graphene, hydrazine hydrate, a surfactant and a formaldehyde solution are added into a reactor, stirred and heated up to 80-100 DEG C for reaction; the obtained liquid reactant is cooled down to 60-80 DEG C, then an acid catalyst and phenol are added, the temperature is increased to 85-100 DEG C for reaction, and then heating dehydration is performed. The graphene phenolic resin composite material can be applied to bakelite powder. As the proper surfactant is adopted, the problem of dispersion of graphene in resin is solved, and uniformly mixed graphene modified phenolic resin is obtained; the oxidized graphene which is not reduced can further react with phenolic resin to obtain graphene modified phenolic resin of an inorganic complexing structure; the bakelite powder prepared by resin has relatively high impact resistance and low forming shrinkage ratio.

The invention discloses a molecular structure modified rigid polyurethane foam thermal insulation material and relates to the field of thermal insulation materials. The molecular structure modified rigid polyurethane foam thermal insulation material is prepared from polymerization polyisocyanates, bakelite, brominated epoxy resin, catalysts, a halogen-free flame retardant, cyclopentane, methylsilicone oil and polyether polyol. The molecular structure modified rigid polyurethane foam thermal insulation material has high mechanical strength and thermostability, and is safe and free of pollution.

The invention discloses a bakelite-structured optical and electrical cable delivery pallet and a preparation method thereof, and relates to a bakelite-structured optical and electrical cable delivery pallet, particularly an all-wood structured optical and electrical cable delivery pallet, which is characterized in that fixing grooves for cable extending out of the front end of the optical and electrical cable are formed on the inner sides of discs, and a preparation method thereof. The structure comprises discs, a central cylinder body and a plurality of disc fixing bolts; the discs are mounted at the two ends of the central cylinder body; a plurality of disc fixing bolts for connecting and fixing the central cylinder body are mounted inside the central cylinder body; the discs are mounted at the two ends of the central cylinder body; disc fixing bolts are mounted inside the central cylinder body; fixing grooves for cable extending out of the front end of the optical and electrical cable are formed on the inner sides of the discs; and central shaft holes and holes for disc fixing bolts are formed on the discs. The preparation method comprises the following steps: preparing the discs by crushing the off-cuts of lumber from a wood-working factory, churning with waterproof adhesive, placing into a die, and compressing by using a compressor to obtain the discs; arranging fixing grooves for cable extending out of the front end of the optical and electrical cable on the inner side plates of the discs; preparing the central cylinder body; and assembling the bakelite-structured optical and electrical cable delivery pallet.