1211 results about "Plasma cutting" patented technology

A plasma dicing apparatus in which a semiconductor wafer with a protective sheet stuck thereonto covering the entire circuit-forming surface and with an etching-resistant mask member stuck on the back surface opposite to the circuit-forming surface is mounted on a mounting stage; plasma etching is performed using the mask member as a mask; and the semiconductor wafer is diced into plural semiconductor chips. The plasma dicing apparatus includes a ring-shaped frame member retaining the outer circumference of the mask member extending off the outer circumference of the semiconductor wafer. The mounting stage is composed of a wafer supporting part supporting a semiconductor wafer and a frame member supporting part supporting the frame member. This facilitates carrying a semiconductor wafer into and out of the vacuum chamber.

In a method in which a semiconductor wafer 1 having integrated circuits 3 formed in a plurality of chip regions and test patterns 4 formed in scribe lines 2a is divided by a plasma etching process so as to manufacture individual semiconductor chips, in the semiconductor wafer 1, a protection sheet 5 which constitutes a mask in the plasma etching process is adhered onto a front plane 1a thereof where the integrated circuits 3 have been formed; since laser light 9a is irradiated along the scribe lines 2a, only a predetermined width of the protection sheet 5 is removed so as to form a mask having a plasma dicing-purpose opening portion 5b; and also, the test patterns 4 are removed by the laser light 9a in combination with a front plane layer of the semiconductor wafer 1. As a result, the test patterns 4 can be removed in a higher efficiency and in simple steps, while the general purpose characteristic can be secured.

In a method in which a semiconductor wafer 1 having integrated circuits 3 formed in a plurality of chip regions and test patterns 4 formed in scribe lines 2a is divided by a plasma etching process so as to manufacture individual semiconductor chips, in the semiconductor wafer 1, a protection seat 5 which constitutes a mask in the plasma etching process is adhered onto a front plane 1a thereof where the integrated circuits 3 have been formed; since laser light 9a is irradiated along the scribe lines 2a, only a predetermined width of the protection seat 5 is removed so as to form a mask having a plasma dicing-purpose opening portion 5b; and also, the test patterns 4 are removed by the laser light 9a in combination with a front plane layer of the semiconductor wafer 1. As a result, the test patterns 4 can be removed in a higher efficiency and in simple steps, while the general purpose characteristic can be secured.

The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

A single phase power supply module for electric arc welders and plasma arc cutters comprising: a single phase input stage; positive and negative output terminals; a full wave rectifier connected to the input stage for rectifying the single phase voltage at the input stage; a buck converter type power factor correcting circuit for controlling current flow from the input stage to the rectifier, which buck converter has an output capacitor regulated to an intermediate voltage in the range of 100-150 volts; and, a high speed DC to DC converter having an internal transformer coupling applying voltage across the output terminals and means for regulating the applied voltage to an output voltage in the range of 0-113 volts. The module is universal and several can be connected in parallel, in series or to switch networks to construct several welders or cutters.

A welding, plasma cutting, or heat induction system to train a welding operator. The system includes a display configured to show a prerecorded video selected from multiple prerecorded videos. The prerecorded videos correspond to a welding application, a plasma cutting application, a heat induction application, or some combination thereof.

A single phase power supply module for electric arc welders and plasma arc cutters comprising: a single phase input stage; positive and negative output terminals; a full wave rectifier connected to the input stage for rectifying the single phase voltage at the input stage; a buck converter type power factor correcting circuit for controlling current flow from the input stage to the rectifier, which buck converter has an output capacitor regulated to an intermediate voltage in the range of 100-150 volts; and, a high speed DC to DC converter having an internal transformer coupling applying voltage across the output terminals and means for regulating the applied voltage to an output voltage in the range of 0-113 volts. The module is universal and several can be connected in parallel, in series or to switch networks to construct several welders or cutters.

A system, in some embodiments, includes a multi-torch power supply. The power supply has a first circuit configured to control output to a first electrical torch, and a second circuit configured to control output to a second electrical torch. The power supply also has a power source configured to supply power to the first and second circuits to enable both independent and simultaneous operation of the first and second electrical torches.

Cutting quality of the product, in particular, hole cutting quality, in plasma arc cutting is improved. A control unit, which controls a plasma cutting apparatus for cutting a product from a plate material by moving a plasma torch at a cutting speed along a cutting path corresponding to the product shape to cut the plate material, while supplying an arc current and a plasma gas to the plasma torch and forming a plasma arc from a nozzle of the plasma torch to the plate material, conducts control so that, when a hole is cut, a cutting speed is lower, a value of the arc current value is smaller, and a plasma gas flow rate or pressure is less than those when a contour is cut.

An auxiliary welding heating system includes an induction heating coil disposed adjacent to a welding torch or plasma cutter. The auxiliary welding heating system further includes an induction power supply configured to generate an alternating current and a step-down transformer coupled to the induction power supply. The induction heating coil is coupled to the step-down transformer and is configured to receive the alternating current and induce eddy currents in a welding work piece to heat the welding work piece before an advancing welding arc or plasma cut to a homologous temperature of at least approximately 0.5.

A plasma cutting device performs cutting in a plurality of stages. In a first cutting sub-process, a manufactured product is cut out from a base material upon a stage according to an NC program. Next, images of respective regions in the vicinities of proper positions at two corner points of the manufactured product which has been cut out are photographed by an image sensor, the actual positions of these two corner points of the manufactured product are detected from these images which have been photographed, and the translation distances and the rotational angle between the actual positions which have been detected and the proper positions are calculated. The NC program is corrected. And, in a subsequent cutting sub-process, additional cutting for beveling is carried out upon cutting surfaces at the outer circumference of the manufactured product, according to the corrected NC program.

A system and method is described for updating firmware in a welding or plasma cutting system. A removable memory device containing updated firmware code and a set of execution instructions is interfaced with one or more component boards. The execution instructions are executed on a processor of the welding or plasma cutting system to load the updated firmware code stored on the removable memory device into memory of the welding or plasma cutting system via an interface, generally overwriting the old firmware code.

The present invention provides a method for plasma processing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing at least two cutting regions on the substrate, the cutting regions being positioned between all adjacent device structures on the substrate; generating a plasma using the plasma source; and processing the work piece using the generated plasma.

In a thermal cutting machine such as plasma cutting machine or a laser cutting machine, control of the moving speed of a cutting head (24) is improved so as to increase throughput of the cutting machine with increase in cost restricted. Products are cut out one by one from a plate member (14) while a cutting head (24) is moved relative to the plate member (14) on a table (12). In this process, when the cutting head (24) is fast-forwarded without performing cutting to a position at which cutting of each product starts, the speed of movement in the direction (Y-axis direction) along a short side of the table (12) is controlled at a speed higher than that of the movement in the direction (X-axis direction) along a long side of the table. The pattern of a sequence of cutting out the products from the plate member (14) is a meandering pattern in which reciprocation in the Y-axis direction dominates and the movement in the X-direction is one time one way. Exhaust chambers are arranged in the X-axis direction in the table (12), and the exhaust chambers are driven as the cutting head (24) moves in the X-axis direction.

The invention relates to a flame plasma cutting machine, in particular to a frame of the cantilever-typed numerical control flame plasma cutting machine. According to the technical proposal provided by the invention, a turning mechanism is arranged between an underframe and a vertical column; the bottom part of the turning mechanism is connected with the underframe; the vertical column is connected with the upper part of the turning mechanism; the upper part of the vertical column is connected with a transverse arm provided with a cross slide way; the transverse arm is provided with a lifting frame which can move on the transverse arm; the lifting frame is provided with a transverse sliding block connected with the cross slide way in a sliding way. The flame plasma cutting machine can facilitate the transportation and installation and improve the repeated precision and positioning angle.

The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

A system for providing a dynamically controlled plasma cutting system. The plasma cutting system includes a proportional valve and a sensing device arrangement and a controller connected to this arrangement. The system is configured to dynamically control gas flow in a plasma torch. The system measures gas pressure at a proportional valve and makes necessary gas pressure adjustments in the system by way of controlling a drive signal sent to the proportional valve to control gas flow.

In order to increase the flow rate of coolant liquid supplied to the nozzle (88) of a plasma torch (10) and to extend the life of the plasma torch (10), within the plasma torch (10), an electrode coolant liquid passage (60, 84, 85, 86, and 64 which supplies coolant liquid to an electrode (80), and a nozzle coolant liquid passage (56, 70, 92, 72 and 68) which supplies coolant liquid to the nozzle (88), are provided separately as independent coolant liquid passages which extend in parallel, and which are mutually electrically insulated from one another. Moreover, the flow rate of coolant liquid in the nozzle coolant liquid passage is greater than the flow rate of coolant liquid in the electrode coolant liquid passage.

A plasma torch system and method is provided, in which the system utilizes a number of pressure sensors throughout the system and the torch to detect the flow / pressure of shield and plasma gas during operation. The detected pressures are used by the system to dynamically control the system pressures to optimize the cutting operation.

The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.

The invention provides a double-direction synchronous rotating and clamping device for steel pipe cutting. The technical problem that in the cutting process of a steel pipe, clamping and rotating can not be achieved is solved. The device comprises a clamping mounting frame, a rotary disc mechanism, a clamping mechanism and a double-direction synchronous clamping drive connection mechanism; a lifting mechanism is arranged at the rear end of the clamping mounting frame, and the clamping mechanism comprises a fine adjustment mechanism; a turnover discharging device is arranged in front of the rotating and clamping mechanism; the device has the beneficial effects that in the process of using a plasma cutting machine for cutting the steel pipe, the steel pipe is synchronously clamped in a double-direction manner and driven to rotate, and the steel pipe cutting process is more efficient.

A system is provided that includes a torch power unit. The torch power unit includes a monitor and / or control configured to determine a temperature of a component of the torch power unit based on the one or more inputs without a direct temperature measurement of the component. A method of operation is provided that includes receiving one or more inputs associated with a device, and estimating a temperature of the device based on the one or inputs without directly measuring temperature of the device. A tangible machine-readable medium is provided that includes code for determining a thermal capacity of the device, code for determining a thermal resistance of the device, and code for determining a temperature of the device based on thermal capacity and the thermal resistance method.

The invention discloses a spinning machining method for an aluminium alloy thin-walled revolution body. The spinning machining method comprises the following steps: producing an aluminium alloy spun blank with required dimensions, and carrying out annealing treatment on the aluminium alloy spun blank; carrying out shearing spinning on the aluminium alloy spun blank to obtain a primary conical barrel; carrying out annealing treatment on the primary conical barrel, and cutting a process allowance at a large end to form a secondary conical barrel; carrying out common spinning on the secondary conical barrel on a spinning machine to obtain a pre-spun aluminium alloy thin-walled revolution body; and carrying out annealing treatment and surface polishing treatment on the pre-spun blank, and then cutting process allowances at the two ends of a spun part by using a plasma cutting machine, so as to obtain the aluminium alloy thin-walled revolution body meeting process requirements. According to the invention, the aluminium alloy thin-walled revolution body is machined by virtue of the technologies of shearing spinning and common spinning; the dimension and structural performance requirements of a bullet shell are met; a machining method and a stamping-welding method can be replaced; and a low-cost and efficient machining method is provided for machining for an aluminium alloy shell of a bullet.

A system and method for limiting welding output and ancillary features is provided. In one embodiment, a portable generator system includes a power generator configured to generate electrical power appropriate for welding or plasma cutting. The generator system also includes power conversion circuitry coupled to the power generator and configured to receive power from the power generator and to provide output power. The generator system includes at least operator accessible input for receiving an operator input parameter. The generator system also includes an output power limiting device not adjustable by the operator and configured to selectively limit output power from the power conversion circuitry.

The present invention is directed to a system and method for a plasma cutting system including a plasma cutting power source and a plasma torch operationally connected to the plasma cutting power source. A processing unit is disposed within the plasma torch and is configured to control the plasma cutting power source during a plasma cutting process based on operational feedback gathered of the plasma cutting process.

The present invention is directed to a system including a plasma cutting torch having an output electrode and a plasma cutter starting circuit configured to generate a pilot arc at the output electrode.

The present invention provides a method for plasma processing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing a cover ring above the work piece, the cover ring having at least one perforated region, and at least one non-perforated region; generating a plasma using the plasma source; and processing the work piece using the generated plasma.