Halogenless fire retarded epoxy resin composition

A technology of epoxy resin and composition, applied in the field of halogen-free flame retardant epoxy resin composition, can solve the problems of releasing highly toxic substances hydrogen halide, easy discoloration of substrate, poor discoloration resistance at high temperature, etc. Ion mobility, apparent smoothing effect

Active Publication Date: 2006-11-15
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, and halogen-containing products generate a large amount of smoke during combustion. It will release the highly toxic substance hydrogen halide, and with the European Union's "Directive on Waste Electrical and Electronic Equipment" and "Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" two environmental directives will be formalized on July 1, 2006 Implementation, the development of halogen-free flame-retardant copper-clad laminates has become the focus of the industry
At present, there are two main ways to achieve halogen-free flame retardancy of copper-clad laminates. The first way is to use phosphorus-containing epoxy resin as the main resin, dicyandiamide or phenolic resin as the curing agent, and add an appropriate amount of aluminum hydroxide Or inorganic fillers such as silica powder, this way uses dicy

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Phosphorus-containing epoxy resin (epoxy equivalent 310g / eq, phosphorus content 3.0%, solid content 75%) 100 parts by weight, carboxyl-terminated nitrile rubber modified epoxy resin (product model RF928, produced by CVC Corporation of the United States) 8 parts by weight , nitrogen-containing phenolic resin (product model PS6313, nitrogen content 20%, produced by Japan Qunrong Chemical Industry Co., Ltd.) 9 parts by weight, phenol-type phenolic resin

[0016] (Solid content 100%) 13.5 parts by weight, 2 parts by weight of diaminodiphenyl sulfone, 0.15 part by weight of 2-methylimidazole, the solid content of the system was adjusted to 65% with propylene glycol methyl ether solvent, and mixed into a halogen-free flame retardant epoxy resin resin composition.

Embodiment 2

[0018] Phosphorus-containing epoxy resin (epoxy equivalent 310g / eq, phosphorus content 3.0%, solid content 75%) 100 parts by weight, carboxyl-terminated nitrile rubber modified epoxy resin (product model RF928, produced by CVC Corporation of the United States) 6 parts by weight , 9 parts by weight of nitrogen-containing phenolic resin (product model PS6313, nitrogen content 20%, produced by Japan Qunrong Chemical Industry Co., Ltd.), 13.5 parts by weight of phenolic phenolic resin (solid content 100%), 2 parts by weight of diaminodiphenyl sulfone , 0.12 parts by weight of 2-methylimidazole, the solid content of the system is adjusted to 65% with propylene glycol methyl ether solvent, and mixed into a halogen-free flame retardant epoxy resin composition.

Embodiment 3

[0020] Phosphorus-containing epoxy resin (epoxy equivalent 310g / eq, phosphorus content 3.0%, solid content 75%) 100 parts by weight, carboxyl-terminated nitrile rubber modified epoxy resin (product model RF928, produced by American CVC Company) 10 parts by weight , 11 parts by weight of nitrogen-containing phenolic resin (product model PS6313, nitrogen content 20%, produced by Japan Qunrong Chemical Industry Co., Ltd.), 17 parts by weight of phenolic phenolic resin (solid content 100%), 2.5 parts by weight of diaminodiphenyl sulfone , 0.15 parts by weight of 2-methylimidazole, adjusted with propylene glycol methyl ether solvent to adjust the solid content of the system to 65%, and mixed into a halogen-free flame retardant epoxy resin composition.

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Abstract

This invention relates to a composition used in printed circuit board domain, mainly used for making cohesive body and copper clad, and specially mean a composition of a halogen-free flame recardant epoxy resin. Accounting weight it includes 60-80 portions phosphorated ether resin, 5-11 portions carboxyl terminated acrylenitrile-buta-diene rubber, 13-27 portions composite curing agent which composed by azotic bakelite, phenol-azotic bakelite and DOS at EQU of 2:4:1, 0.01-0.3 portions iminazo curing accelerator. This invention has no any addition type flame recardant and the cohesive is very smooth. It has good ion migration resistance, thermal insulating and general property, fit for making circuit board.

Description

Technical field: [0001] The invention relates to a composition applied to the field of copper-clad laminates for printed circuits, mainly used for making adhesive sheets and copper-clad laminates, in particular to a halogen-free flame retardant epoxy resin composition. Background technique: [0002] For a long time, copper clad laminates for printed circuits have been flame retardant with bromine. However, in recent years, carcinogenic substances such as dioxin and dibenzofuran have been detected in the combustion products of electrical and electronic equipment waste containing halogens such as bromine and chlorine. It will release highly toxic substances hydrogen halide, and with the EU's "Waste Electrical and Electronic Equipment Directive" and "On the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" two environmental protection directives will be officially launched on July 1, 2006. Implementation, the development of halogen-...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K5/3445C08K5/372
Inventor 茹敬宏
Owner GUANGDONG SHENGYI SCI TECH
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