Halogenless fire retarded epoxy resin composition

Abstract

This invention relates to a composition used in printed circuit board domain, mainly used for making cohesive body and copper clad, and specially mean a composition of a halogen-free flame recardant epoxy resin. Accounting weight it includes 60-80 portions phosphorated ether resin, 5-11 portions carboxyl terminated acrylenitrile-buta-diene rubber, 13-27 portions composite curing agent which composed by azotic bakelite, phenol-azotic bakelite and DOS at EQU of 2:4:1, 0.01-0.3 portions iminazo curing accelerator. This invention has no any addition type flame recardant and the cohesive is very smooth. It has good ion migration resistance, thermal insulating and general property, fit for making circuit board.

Description

Technical field: [0001] The invention relates to a composition used in the field of copper-clad laminates for printed circuits, and is mainly used for making adhesive sheets and copper-clad laminates, in particular to a halogen-free flame-retardant epoxy resin composition. Background technique: [0002] Traditionally, copper clad laminates for printed circuits have been flame retardant with bromine. However, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, and halogen-containing products generate a large amount of smoke during combustion. It will release the highly toxic substance hydrogen halide, and with the European Union's "Directive on Waste Electrical and Electronic Equipment" and "Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" two environmental directiv...

AI Technical Summary

Problems solved by technology

However, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, and halogen-containing products generate a large amount of smoke during combustion. It will release the highly toxic substance hydrogen halide, and with the European Union's "Directive on Waste Electrical and Electronic Equipment" and "Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment" two environmental directives will be formalized on July 1, 2006 Implementation, the development of halogen-free flame-retardant copper-clad laminates has become the focus of the industry

At present, there are two main ways to achieve halogen-free flame retardancy of copper-clad laminates. The first way is to use phosphorus-containing epoxy resin as the main resin, dicyandiamide or phenolic resin as the curing agent, and add an appropriate amount of aluminum hydroxide Or inorganic fillers such as silica powder, this way uses dicyandiamide as the curing agent of phosphorus-containing epoxy resin, the heat resistance of the board is poor,

[0003] The resistance to ion migration decreases; using phenolic resin as the curing agent, the heat resistance of the board is better, but the appearance of the bonding sheet is poor and the board is more brittle; although the addition of aluminum hydroxide can improve the flame retardancy of the board, it will cause The heat resistance and alkali resistance of the plate are greatly reduced

The second way to achieve halogen-free flame retardancy of copper-clad laminates is to use benzoxazine resin as the main resin, add an appropriate amount of phosphorus-containing epoxy resin or phosphorus-containing nitrogen-containing flame retardants, so that the flame retardancy of the board can be improved. Reaching UL94V-O level, benzoxazine resin has good flame retardancy and heat resistance, but the high-temperature discoloration resistance of benzoxazine resin is poor, and the copper-clad laminate made of it can withstand high temperature Substrates are prone to discoloration

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