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Graphene phenolic resin composite material and application thereof

A technology of phenolic resin and composite materials, which is applied in the field of phenolic resin composite materials to achieve the effects of simple operation process, reduced operation difficulty and low molding shrinkage

Inactive Publication Date: 2015-03-11
SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem that graphene is not uniformly dispersed in the preparation of graphene phenolic resin in the above prior art and causes performance to be limited, the invention provides a graphite Graphene is more evenly distributed in the phenolic resin, and the resulting graphene-phenolic resin composite material has high resin impact strength and low molding shrinkage.

Method used

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  • Graphene phenolic resin composite material and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] (1) Add 1 gram of graphene oxide, 5 grams of hydrazine hydrate, 5 grams of sodium dodecylbenzenesulfonate, and 260 grams of formaldehyde solution with a concentration of 44% into a four-necked bottle, start stirring, and slowly heat up to 100°C Down reaction 6 hours;

[0040] (2) When the temperature of the reaction solution is lowered to 75°C, add acid to adjust the pH to 2.3, then add 600g of phenol, and react at 95°C for 2 hours. After the reaction, heat up the reaction mixture and dehydrate it to a temperature of 160°C to obtain thermoplastic graphene Phenolic Resin.

Embodiment 2

[0042] Compared with Example 1, the difference is that 5 grams of graphene oxide, 25 grams of hydrazine hydrate, and 20 grams of sodium dodecylbenzenesulfonate are added.

Embodiment 3

[0044] Compared with Example 2, the difference is that 15 grams of hydrazine hydrate have been added,

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PUM

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Abstract

The invention relates to the technical field of phenolic resin composite materials, in particular to a graphene phenolic resin composite material. Oxidized graphene, hydrazine hydrate, a surfactant and a formaldehyde solution are added into a reactor, stirred and heated up to 80-100 DEG C for reaction; the obtained liquid reactant is cooled down to 60-80 DEG C, then an acid catalyst and phenol are added, the temperature is increased to 85-100 DEG C for reaction, and then heating dehydration is performed. The graphene phenolic resin composite material can be applied to bakelite powder. As the proper surfactant is adopted, the problem of dispersion of graphene in resin is solved, and uniformly mixed graphene modified phenolic resin is obtained; the oxidized graphene which is not reduced can further react with phenolic resin to obtain graphene modified phenolic resin of an inorganic complexing structure; the bakelite powder prepared by resin has relatively high impact resistance and low forming shrinkage ratio.

Description

technical field [0001] The invention relates to the technical field of phenolic resin composite materials, in particular to a graphene phenolic resin composite material, and also relates to the application of the graphene phenolic resin composite material. Background technique [0002] Phenolic resin is the earliest industrialized synthetic resin in the world. It has a history of nearly a hundred years. Due to its easy-to-obtain raw materials, low price, simple production process and equipment, and more importantly, its excellent mechanical properties, heat resistance, and Ablation performance, electrical insulation performance, formability and flame retardancy have become indispensable materials in the bakelite industry. The traditional unmodified phenolic resin has high brittleness, poor toughness and shrinkage during molding, which limit its application in high-end bakelite products. [0003] Patent CN101974199A introduces a low-shrinkage phenolic molding compound, whi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G8/10C08K9/04C08K3/04C08L61/10
Inventor 唐一林刘翠华李枝芳
Owner SHANDONG SHENGQUAN NEW MATERIALS CO LTD
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