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Preparation method of electroless nickel immersion gold for printed circuit board

An electroless immersion nickel gold and printed circuit board technology, which is applied in the manufacturing of printed circuits, the formation of printed circuits, and the formation of electrical connection of printed components, to achieve the effects of good heat dissipation, good appearance and long storage life.

Inactive Publication Date: 2018-05-04
江西鑫力华数码科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] At present, there is a lack of a method for preparing electroless nickel-gold for printed circuit boards with a long storage life

Method used

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  • Preparation method of electroless nickel immersion gold for printed circuit board

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Such as figure 1 Shown is a schematic diagram of the nickel-immersion gold of the printed circuit board of the present invention. A kind of preparation method of the electroless nickel deposition of printed circuit board of the present invention comprises the following steps:

[0031] (1) The circuit board is pretreated; the pretreatment steps include grinding the board, sandblasting and baking the board. Grinding, roughening the surface of the copper plate, removing impurities and oxides on the copper surface, and increasing the bonding force of the plate surface; sandblasting, using the impact of high-speed sand flow to clean and roughen the surface of the plate, and performing two sandblasting treatments; The board is heated to eliminate the residual stress in the board. In the grinding plate, the grinding marks in the pretreatment step are 16mm.

[0032] (2) Upper board;

[0033] (3) Immerse the circuit board into the exchange tank, so that the board surface of ...

Embodiment 2

[0040] The difference between embodiment 2 and embodiment 1 is:

[0041] A kind of preparation method of the electroless nickel deposition of printed circuit board of the present invention comprises the following steps:

[0042] In step (1), in the grinding plate, the grinding marks in the pretreatment step are 14mm.

[0043] In step (3), the circuit board is immersed in the exchange tank to wet the surface of the circuit board; oil is removed to remove the oxide layer and oil stain on the surface of the circuit board; the dripping time of the exchange tank is 10 seconds.

[0044] In step (4), acid washing is used to clean the board surface of the circuit board with an acidic liquid; the acidic liquid is hydrochloric acid, the concentration range of the hydrochloric acid is 4%, and the temperature range is 43°C. The time for the activation treatment is 10 minutes.

[0045] In step (8), the thickness of the gold layer of the nickel-immersion gold is 0.05um.

Embodiment 3

[0047] The difference between embodiment 3 and embodiment 1 is:

[0048] In step (1), in the grinding plate, the grinding marks in the pretreatment step are 15mm.

[0049] In step (3), immerse the circuit board into the exchange tank to wet the surface of the circuit board; degrease, remove the oxide layer and oil stain on the circuit board surface; the dripping time of the exchange tank is ≤ 10 seconds.

[0050] In step (4), pickling is to use an acidic liquid to clean the surface of the circuit board; the acidic liquid is hydrochloric acid, the concentration range of the hydrochloric acid is 6%, and the temperature range is 40°C. The time of the activation treatment is 8 minutes.

[0051] In step (8), the thickness of the gold layer of the nickel-immersion gold is 0.12um.

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Abstract

The invention discloses a preparation method of electroless nickel immersion gold for a printed circuit board. The preparation method comprises the following steps of 1, pretreatment of the circuit board; 2, circuit board installation; 3, immersion and oil removing, wherein the circuit board is immersed into a exchange tank, so that the board surface of the circuit board is wetted, and an oxide layer and oil dirt on the board surface of the circuit board are removed; 4, acid washing; 5, pre-immersion; 6, activation; 7, post-immersion; 8, electroless deposition of nickel, palladium and gold, wherein a nickel layer is deposited on a copper surface of the circuit board by using sodium dihydric hypophosphite and hydrochloric nickel, a palladium layer is electrolessly deposited on the nickel layer of the circuit board, a gold layer is immersed into the palladium layer so as to form a gold layer on the nickel layer of the circuit board, and the electroless nickel immersion gold is prepared.

Description

technical field [0001] The invention relates to the technical field of printed circuits, in particular to a method for preparing chemically deposited nickel and gold for printed circuit boards. Background technique [0002] Printed circuit boards (PCBs) are commonly required components for various electronic devices in the information society. The PCB is generally provided with through holes and blind holes for circuit connection. For the treatment of blind holes in the PCB manufacturing process, operations such as electroless copper plating and nickel-gold deposition (gold plating) are required. [0003] However, at present, there is a difficulty in applying gold to electroless nickel gold in blind holes. The applicant has found through research that the reason for the above-mentioned difficulty in applying gold is that there are bubbles in the blind holes during gold melting, which hinders the exchange of liquid medicine. In the process of leaching gold, there is also th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42
CPCH05K3/421
Inventor 刘新华李真瑞
Owner 江西鑫力华数码科技有限公司
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