Method for removing burrs of metallized half-hole of gold plating plate

Abstract

The invention discloses a method for removing burrs of a metallized half hole of a gold plating plate. The method comprises the following steps of: drilling a hole in a production board, and then metallizing the hole through copper deposition and full-plate electroplating in sequence; plating a tin layer on the board surface of the production board; forming half holes in the production board through a forming process; removing burrs in the holes and at the hole openings through alkaline etching, and then removing the tin layers; pasting a film on the production board, and then sequentially performing exposure and development to form an outer layer circuit pattern; carrying out chemical nickel-gold treatment on the production board; pasting a second layer of film on the production board, and windowing the position, needing gold plating, of the corresponding outer layer circuit pattern; carrying out local gold plating treatment on the production board, and retreating the film; and etching the production board to form an outer-layer circuit. According to the method, a tin plating procedure, half-hole milling and alkaline etching are added before outer layer circuit manufacturing, under the condition of tin layer protection, half-hole burrs are etched and removed firstly, and metalized half-hole manufacturing is achieved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for removing the metallized half-hole edge of an electric gold plate. Background technique [0002] In the PCB production process, the metallized half hole of the electric gold plate is generally drilled on the PCB first, and then the through hole is sequentially subjected to copper sinking, board electricity, graphic nickel gold, etc. to metallize the through hole and plate it with gold. layer, and then form the through-hole gong in half to form a metallized half-hole. Its main process flow is: pre-process→drilling→copper sinking, board electricity→outer layer graphics→graphic nickel gold→outer layer graphics (2)→partial electro-gold→forming (half hole)→alkaline etching (removing film , etching) → next process [0003] There is following shortcoming in prior art: [0004] It is relatively easy to etch the copper wire at the half-hole position...

AI Technical Summary

Problems solved by technology

[0004] It is relatively easy to etch the copper wire at the half-hole position by alkaline etching, but because of the nickel and gold anti-alkaline etching potion, the nickel wire and gold wire at the half-hole position cannot be etched clean, forming a metal ridge; these metal drape The front will seriously affect the efficiency of the client's delivery and will not be accepted by customers. For manufacturing companies, there are also problems such as repair difficulties and waste of labor costs, which will eventually lead to a decline in the yield and increase the cost of the company.