Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Depth control method for copper block of buried copper plate

A copper block and copper plate technology, applied in electrical components, printed circuit manufacturing, printed circuit and other directions, can solve the problems of high price, low frequency of use, increase the cost of embedded copper block PCB manufacturing, etc. The effect of flatness

Inactive Publication Date: 2018-07-17
奥士康精密电路(惠州)有限公司
View PDF5 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the multi-functional development of electronic products, the application of embedding copper block PCB is more and more extensive, the demand of customers is increasing, and the requirements for copper block are also increasing, but the existing deep control machine is expensive, The frequency of use is low, and the purchase of the depth control gong for the production of a small amount of embedded copper PCB will increase the production cost of embedded copper PCB

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A method for controlling the depth of a copper block on a buried copper plate, comprising the steps of:

[0023] Depth control slot gong belt design: use a flat end milling cutter to mill the slot, set the cutting point at the center of the slot, and use a back-shaped cutting tool;

[0024] Milling the surface of the horizontal table: Before milling the groove, fix a backing plate on the production platform, and then carry out controlled deep milling on the backing plate, wherein the depth of controlled deep milling is smaller than the thickness of the backing plate, so as to eliminate the height difference of the table;

[0025] Groove milling: Groove milling is carried out in the manner of roughing first and then finishing.

Embodiment 2

[0027] A method for controlling the depth of a copper block on a buried copper plate, comprising the steps of:

[0028] Design of deep-controlled groove gong belt: use flat end milling cutter to mill the groove, set the cutting point at the center of the groove, adopt back-shaped cutting tool, when cutting, the overlapping degree between the milling cutter and the milling cutter is 40% of the diameter of the cutter ±5%;

[0029] Milling the surface of the horizontal table: Before milling the groove, fix a backing plate on the production platform, and then carry out controlled deep milling on the backing plate, wherein the depth of controlled deep milling is smaller than the thickness of the backing plate, so as to eliminate the height difference of the table;

[0030] Groove milling: Groove milling is carried out in the manner of roughing first and then finishing.

Embodiment 3

[0032] A method for controlling the depth of a copper block on a buried copper plate, comprising the steps of:

[0033] Depth control slot gong belt design: use a flat end milling cutter to mill the slot, set the cutting point at the center of the slot, and use a back-shaped cutting tool;

[0034] Milling the surface of the horizontal platform: Before milling the groove, fix a 2.0mm backing plate on the production platform, and then carry out 1.0mm controlled depth milling on the backing plate;

[0035] Groove milling: Groove milling is carried out in the manner of roughing first and then finishing.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a depth control method for a copper block of a buried copper plate. The depth control method comprises the following steps of designing a depth control groove milling tape; performing groove milling by a flat-end milling cutter, wherein a cutting point is arranged in the center of a groove, and hollow square feeding is employed; milling a horizontal tabletop, in which a cushion plate is fixed on a production platform before groove milling, depth control milling is performed on the cushion plate, the milling control depth is smaller than the thickness of the cushion plate to eliminate height difference of the tabletop; and performing groove milling, in which groove milling is performed by a mode of rough milling and fine milling. The effects of bottom smoothness andno peak are achieved by design optimization of the milling tape and by the mode of rough milling and fine milling under the condition that depth control equipment is not introduced.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a method for controlling the depth of buried copper boards and copper blocks. Background technique [0002] With the multi-functional development of electronic products, the application of embedding copper block PCB is more and more extensive, the demand of customers is increasing, and the requirements for copper block are also increasing, but the existing deep control machine is expensive, The frequency of use is low, and the purchase of the depth control gong for the production of a small amount of embedded copper block PCB will increase the production cost of embedded copper block PCB. [0003] Without introducing depth control equipment, the present invention optimizes the design of the gong belt and adopts the method of thick gong + fine gong to achieve the effect of flat bottom and no edge. Contents of the invention [0004] Based on this, it is necessary to provide a metho...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00
CPCH05K3/0044H05K2203/0214
Inventor 李宁辉贺波文国堂蒋善刚
Owner 奥士康精密电路(惠州)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com