Chemical nickel, palladium and gold plating technique for printed circuit board
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A printed circuit board, electroless nickel plating technology, applied in the direction of liquid chemical plating, metal material coating process, coating, etc., can solve the problems of increased surface treatment costs, connection reliability problems, low contact resistance, etc., to reduce Surface treatment cost, prevent black disk problem, good wear resistance and excellent effect
Inactive Publication Date: 2015-12-02
黄石西普电子科技有限公司
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[0002] The surface of the printed circuit board pad is the terminal point of the connection between the line and the external components. The surface of the pad is a copper conductor. Surface coating treatment is required to protect the copper surface of the connection pad from contamination and oxidation and ensure the reliability of component welding. Currently The surface treatment of printed circuit board pads includes OSP, hot air leveling, chemical tin, chemical silver and chemical nickel immersion gold, etc., while chemical nickel immersion gold has high coating flatness, good coating wear resistance and low contact resistance, etc. Superior performance, is widely used in the surface treatment of printed circuit boards of precision electronic products and the packaging technology of microelectronic chips and circuit boards. However, the electroless nickel immersion gold coating will have black disk defects during the welding process, and connection reliability problems will occur. ;In addition, if the chemical nickel gold surface treatment is used for gold wire products, a thicker gold plating layer is required to meet the requirements, which will inevitably increase the cost of surface treatment
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Embodiment 1
[0029] A kind of electroless nickel-palladium-gold process for printed circuit board, comprises the following steps:
[0030] (1) Degreasing: put the product in 80ml / L acidic cleaner, and treat it at 40°C for 4 minutes to remove oil stains and fingerprints on the board surface;
[0031] (2) Hot water washing: Put the product in a 50°C hot water bath for 1 minute to clean the residual acidic cleaner on the board surface;
[0032] (3) Double water washing: put the product into a secondary water washing tank with continuous overflow for 1 minute, and thoroughly clean the residual pre-process potion on the board surface;
[0033] (4) Microetching agent: Put the product into a mixed solution with 60g / L sodium superphosphate, 10ml / L phosphoric acid and 3g / L divalent copper ions and treat it at 20°C for 1 minute, and slightly treat the copper surface. Biting to obtain fresh copper surface and improve the bonding force of subsequent plating;
[0034] (5) Double water washing: put th...
Embodiment 2
[0048] A kind of electroless nickel-palladium-gold process for printed circuit board, comprises the following steps:
[0049] (1) Degreasing: Put the product in 120ml / L acidic cleaner and treat it at 50°C for 6 minutes to remove oil stains and fingerprints on the board surface;
[0050] (2) Hot water washing: Put the product in a 60°C hot water bath for 2 minutes to clean the residual acidic cleaner on the board surface;
[0051] (3) Double water washing: put the product into a secondary water washing tank with continuous overflow for 2 minutes, and thoroughly clean the residual pre-process potion on the board surface;
[0052] (4) Microetching agent: Put the product into a mixed solution with 100g / L sodium superphosphate, 15ml / L phosphoric acid and 15g / L divalent copper ions and treat it at 30°C for 2 minutes, and slightly treat the copper surface. Biting to obtain fresh copper surface and improve the bonding force of subsequent plating;
[0053] (5) Double water washing: p...
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Abstract
The invention discloses a chemical nickel, palladium and gold plating technique for a printed circuit board. The chemical nickel, palladium and gold plating technique for the printed circuit board comprises the steps of deoiling, hot water washing, dual water washing, micro-etching, dual water washing, presoaking, treatment through a palladium activating agent, dual water washing, deposition of chemical nickel, dual water washing, deposition of chemical palladium, dual water washing, deposition of chemical gold and the like. According to the chemical nickel, palladium and gold plating technique for the printed circuit board, chemical palladium plating is introduced, diffusion and migration of nickel are prevented by means of a palladium layer, contact between the nickel and a gold leaching solution is also prevented, and thus the common problem of black discs of existing chemical nickel and gold surface treatment techniques is effectively solved; a chemical plated palladium layer is completely dissolved in welding flux, no hyperphosphate layer appears at an alloy connector, a new chemical plated palladium layer can be exposed to be used for generating good nickel-tin alloy when the original chemical plated palladium is dissolved, and thus the reliability of welding spots is improved; a plated palladium layer with larger hardness is introduced, a thin clad layer can has good abrasion resistance and gold line printing performance, can serve as a key touch surface and is suitable for being applied to products with high connection reliability, and meanwhile surface treatment cost is reduced.
Description
technical field [0001] The invention relates to an electroless nickel-palladium-gold plating process for printed circuit boards. Background technique [0002] The surface of the printed circuit board pad is the terminal point of the connection between the line and the external components. The surface of the pad is a copper conductor. Surface coating treatment is required to protect the copper surface of the connection pad from contamination and oxidation and ensure the reliability of component welding. Currently The surface treatment of printed circuit board pads includes OSP, hot air leveling, chemical tin, chemical silver and chemical nickel immersion gold, etc., while chemical nickel immersion gold has high coating flatness, good coating wear resistance and low contact resistance, etc. Superior performance, is widely used in the surface treatment of printed circuit boards of precision electronic products and the packaging technology of microelectronic chips and circuit bo...
Claims
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Application Information
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