Processing method for nickel gold immersion at bottom of PCB step groove

A processing method, immersion nickel-gold technology, applied in the field of immersion nickel-gold at the bottom of PCB step grooves, can solve problems such as unsatisfactory, achieve mass production and avoid glue residue

Active Publication Date: 2020-10-02
BOMIN ELECTRONICS CO LTD
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  • Abstract
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  • Application Information

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Problems solved by technology

The other category is filling/embedded gasket pressing plate. For the method of filling/embedding gasket pressing plate to make stepped plate mainly depends on the control method of glue flow, the reliability of the graphics and

Method used

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  • Processing method for nickel gold immersion at bottom of PCB step groove
  • Processing method for nickel gold immersion at bottom of PCB step groove

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Embodiment Construction

[0014] In the processing method for making the bottom of the PCB step groove as immersion nickel gold according to the present invention, before the multi-layer board is pressed, the first core board corresponding to the bottom of the step groove is first selected for immersion nickel gold, and the second core board corresponding to the step groove body is first selected. The core board is mirrored and pre-controlled deep electric milling blind grooves, and at the same time, PP with low flow glue is prepared, and the electric milling through grooves are first positioned to obtain the PP composite layer. Then, lamination is carried out, and a PP composite layer is placed between the first core board and the second core board, and is produced according to the conventional process after pressing. After the surface treatment is done, control the depth and uncover the cover and conduct electric milling and electric milling. The final product forms a step groove, and realizes the PAD...

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Abstract

The invention discloses a processing method for nickel gold immersion at the bottom of a PCB step groove. The method comprises the steps: carrying out selective gold immersion on a first core plate, and carrying out pre-controlled deep electric milling of a blind groove on a second core plate; respectively carrying out browning treatment on the first core plate and the second core plate; carryingout electric milling through groove treatment on a pp composite layer; enabling the gold immersion PAD of the first core plate, the through groove of the pp composite layer and the blind groove of thesecond core plate to correspond in position; sequentially laminating the first core plate, the pp composite layer and the second core plate to obtain a PCB inner plate; carrying out post-processing on the PCB inner plate; and carrying out depth-controlled uncovering electric milling treatment on the second core plate to expose the gold immersion PAD of the first core plate. The method has the advantages that the depth of the step groove is accurately controlled, the problem of residual glue at the bottom of the step groove is avoided, and the requirement of a PAD at the bottom of the PCB stepgroove for chemical nickel-gold plating is met; and according to the detailed processing steps of the invention, no special high-standard requirement on equipment exists, the method is suitable for the existing conditions of general factories, and batch production can be realized without adding other equipment.

Description

technical field [0001] The invention relates to a PCB processing technology, in particular to a processing method for making immersion nickel gold at the bottom of a PCB stepped groove. Background technique [0002] For the immersion nickel gold at the bottom of the PCB step groove, the processing technology of different manufacturers in the industry is different: one type is mechanically controlled depth milling. The other major category is the filled / embedded gasket pressing plate. For the filling / embedded gasket pressing method, the production of the stepped plate mainly depends on the control method of the amount of glue flowing, the reliability of the graphics and holes near the stepped groove, and the above two processing methods can be used. The shape of the stepped groove can be realized, but it cannot meet the needs of the PAD at the bottom of the PCB stepped groove to be electroless nickel gold. SUMMARY OF THE INVENTION [0003] The purpose of the present invent...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4697H05K3/146H05K3/1216H05K3/06
Inventor 吴发夫陈世金梁鸿飞郭茂桂韩志伟叶新锦徐缓
Owner BOMIN ELECTRONICS CO LTD
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