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Palladium activation method for electro-less nickel immersion gold of PCB (printed circuit board)

A PCB circuit board and chemical nickel-gold technology, which is applied in the field of palladium activation of chemical nickel-gold on PCB circuit boards, can solve the problems of surface roughness, increase bonding ability, etc., achieve excellent soldering performance, eliminate false soldering, and be easy to process and use

Active Publication Date: 2021-06-29
SHENZHEN CHENGGONG CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] Step 2: pickling with pickling solution to remove surface oxides, and carry out hydrogen displacement treatment, the oxide film on the surface can be removed by pickling, and the surface can have a slight corrosion effect, making the surface rough, thereby increasing The ability to combine with palladium on the surface can reduce the stress concentration between different materials and the phenomenon of coating detachment. The hydrogen permeation during the pickling process can be dealt with through hydrogen displacement treatment, thereby reducing its stress corrosion phenomenon and hydrogen embrittlement. It has good bonding properties, thereby improving the problem of poor bonding caused by the phenomenon of high internal stress in the palladium layer;

Method used

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  • Palladium activation method for electro-less nickel immersion gold of PCB (printed circuit board)

Examples

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Effect test

Embodiment 1

[0046] Step 1: Place the product in an acidic cleaner for degreasing cleaning;

[0047] Step 2: pickling with pickling solution, the pickling solution contains substances with a concentration of 5% retarder, remove surface oxides, use pickling solution to wash and remove acid again, after hydrogen displacement treatment, heat and dry at 200°C Bake for 4 hours, wash with water and put into the electroless palladium plating tank, and electroless palladium plating for 10 minutes;

[0048] Step 3: Put the product in hot water at 50°C for cleaning, then put it in ionized water for 1-3 minutes, and drain the cleaning water;

[0049] Step 4: Microetching the product to form a microstructure;

[0050] Step 5: put in ionized water and circulate for 1 minute, then drain the cleaning water;

[0051] Step 6: After putting the product into the phosphoric acid solution for 0.5 min, transfer it to an activation tank with a palladium activator, treat it at 25°C for 1 min, and deposit activa...

Embodiment 2

[0056] Step is the same as embodiment 1;

[0057] Step 2: pickling with pickling solution, the pickling solution contains substances with a concentration of 6% retarder, remove surface oxides, use pickling solution to wash and remove acid again, after hydrogen displacement treatment, heat and dry at 190°C Bake for 3.5 hours, wash with water and put into the electroless palladium plating tank, electroless palladium plating for 8 minutes;

[0058] Step 3: Put the product in hot water at 60°C for cleaning, then put it in ionized water for 1-3 minutes, and drain the cleaning water;

[0059] Step 4 is the same as embodiment 1;

[0060] Step 5: put in ionized water and circulate for 3 minutes, and drain the cleaning water;

[0061] Step 6: After putting the product into the phosphoric acid solution for 1 min, transfer it to an activation tank with a palladium activator, treat it at 30°C for 3 min, and deposit activated palladium on the surface of the product;

[0062] Step 7: Put...

Embodiment 3

[0066] Step is the same as embodiment 1;

[0067] Step 2: pickling with pickling solution, the pickling solution contains substances with a concentration of 4% retarder, remove surface oxides, use pickling solution to wash and remove acid again, after hydrogen displacement treatment, heat and dry at 180°C Bake for 3 hours, wash with water and put into the electroless palladium plating tank, and electroless palladium plating for 5 minutes;

[0068] Step 3: Put the product in hot water at 55°C for cleaning, then put it in ionized water for 1-3 minutes, and drain the cleaning water;

[0069] Step 4 is the same as embodiment 1;

[0070] Step 5: put in ionized water and circulate for 2 minutes, and drain the cleaning water;

[0071] Step 6: After putting the product into the phosphoric acid solution for 0.8 minutes, transfer it to an activation tank with a palladium activator, treat it at 28°C for 2 minutes, and deposit activated palladium on the surface of the product;

[0072]...

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Abstract

The invention relates to the technical field of printed circuit boards, in particular to a palladium activation method for electro-less nickel immersion gold of a PCB (printed circuit board). The palladium activation method for electro-less nickel immersion gold of the PCB comprises the following steps of: putting a product into an acid cleaning agent for de-oiling and cleaning; pickling with a pickling solution to remove surface oxides, and performing hydrogen removal treatment; putting the product into hot water of 50-60 DEG C for cleaning, then putting the product into ionized water for circularly cleaning for 1-3 minutes, and draining the cleaning water; carrying out micro-etching on the product to form a microstructure; putting the product into ionized water for circularly cleaning for 1-3 minutes, and draining the cleaning water; putting the product into a phosphoric acid solution for 0.5-1 minutes, transferring the product into an activation tank with a palladium activator, treating the product at 25-30 DEG C for 1-3 minutes, and depositing activated palladium on the surface of the product; putting the product into ionized water for circularly cleaning for 1-3 minutes, and draining cleaning water; and adding a chemical palladium plating solution into a product chemical palladium plating tank for palladium plating, and then transferring to a subsequent process.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a palladium activation method for chemical nickel and gold on PCB circuit boards. Background technique [0002] With the increasing of printed circuit boards, high integration and densification, the soldering requirements and reliability of soldering in the surface packaging of Wu devices are also getting higher and higher. At present, most printed circuit boards use electroless palladium-gold plating . To improve the soldering performance of the surface packaging of components, but the electroless palladium-gold plating has the following serious shortcomings: 1) At present, the electroless palladium-gold plating, in which the electroless gold-plating mostly adopts the chemical replacement reaction method, in view of the large difference in the atomic size of palladium and gold, As a result, there is a large gap in the atomic crystallization interface of the repla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18C23C18/42H05K3/18
CPCC23C18/1889C23C18/42H05K3/181
Inventor 姚吉豪陈建龙
Owner SHENZHEN CHENGGONG CHEM
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