Production line and production process of electroless nickel immersion gold

Abstract

The invention discloses a production line and a production process of electroless nickel immersion gold. The production line comprises a conveying mechanism, a pretreatment area, an electroless nickel immersion gold area and an aftertreatment area, wherein the pretreatment area, the electroless nickel immersion gold area and the aftertreatment area are adjacently arranged on a movement path of the conveying mechanism sequentially. Pretreatment, electroless nickel immersion gold treatment and aftertreatment are integrated to the same production line and operations for transferring and frequently loading and unloading boards during production are not needed, so that manpower can be saved, treatment process can be shortened, and damage such as pollution and scratching of circuit boards can be avoided; a lot of repeated cleaning equipment on the front portions of the electroless nickel immersion gold area and the aftertreatment area in the prior art is omitted, so that the objectives of simplifying equipment, shortening the production line, reducing occupied area, reducing personnel and reducing sewage discharge are achieved, and both the manufacturing cost and production cost of the production line are greatly lowered.

Description

technical field [0001] The invention relates to the technical field of electroless plating, in particular to an electroless nickel-gold production line and a production process. Background technique [0002] Electroless Nickel / Immersion Gold (ENIG) is a surface treatment process for circuit boards. It first coats a nickel-phosphorus alloy layer on the surface conductor of the circuit board, and then coats the nickel-phosphorus alloy layer with a layer of nickel-phosphorus alloy. Layer gold, in order to prevent the diffusion phenomenon between gold and conductor copper on the surface of the circuit board. Compared with the electroplating gold process, the chemical nickel-gold process has the advantages of high uniformity, good metallic gloss, good flatness, and good solderability, and has been widely used in surface treatment of circuit boards. [0003] In the prior art, the chemical nickel-gold production process mainly includes pretreatment, first re-cleaning treatment, ni...

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the chemical nickel-gold production process mainly includes pretreatment, first re-cleaning treatment, nickel-gold treatment, second re-cleaning treatment and post-treatment, wherein the pre-treatment includes sandblasting (grinding plate), three One-stage washing, micro-etching, three-stage washing; nickel-gold treatment includes degreasing (pickling), three-stage washing, micro-etching, two-stage washing, pickling, two-stage washing, pre-soaking, activation, three-stage washing, chemical Nickel, three-stage water washing, chemical gold, three-stage water washing, post-processing includes three-stage water washing, pickling, three-stage water washing, and drying. After the last three-stage water washing is completed in the pre-treatment stage, the circuit board needs to be transferred to nickel-gold Production line, due to the possible pollution caused by the transfer process, the circuit board needs to be cleaned before the nickel-gold treatment, including degreasing (pickling), three-stage water washing, micro-etching, two-stage water washing, pickling, and two-stage water washing. The first re-cleaning treatment can be carried out before the nickel-gold treatment. Similarly, after the nickel-gold treatment is completed, the second process including three-stage water washing, pickling, and three-stage water washing must be carried out before post-treatment. It can be seen from the above description that the current nickel-gold production process needs to be transferred between various production lines, which requires a lot of manpower to participate in this process, and the circuit board Scratches and other damages are prone to occur. At the same time, in order to avoid contamination of the circuit board during the transfer process, it must be re-cleaned before the next stage of treatment. The above problems not only lead to the prolongation of the treatment process, but also increase the production cost and labor cost. A large amount of sewage will be produced, polluting the environment

Images