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A conductive copper paste and its preparation method

A technology of copper paste and silver-coated copper powder, which is applied in the direction of cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, circuits, etc. Long and other problems, to achieve the effect of good product quality, high production efficiency, and short curing time

Inactive Publication Date: 2018-12-21
郑胜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing conductive paste has the following disadvantages when used: long curing time, low adhesion, poor solderability, no resistance to solder resist ink erosion, poor printability, low printing yield and high resistivity, etc.

Method used

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  • A conductive copper paste and its preparation method
  • A conductive copper paste and its preparation method
  • A conductive copper paste and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Embodiment 1 of the present invention provides a conductive copper paste, which is mainly made of the following components in proportion by weight: 14 parts of trimethylolpropane triacrylate, 26 parts of N-vinylpyrrolidone, and 10 parts of butyl acetate , 5 parts of secondary alcohol, 10 parts of dimethylformamide, 10 parts of divalent acid ester, 2 parts of azobisisobutylcyanide, 50 parts of epoxy acrylic resin, 3 parts of fatty alcohol polyoxyethylene ether, 3 parts of imidazole and 250 parts of silver-clad copper powder.

[0044] The preparation method of the conductive copper paste of the present embodiment is as follows:

[0045] Under normal temperature and normal pressure, first mix trimethylolpropane triacrylate and N-vinylpyrrolidone in the weight parts of the above ratio and stir together for about two minutes, so that they are fully mixed and uniform to obtain mixture A; Add butyl acetate to mixture A and stir for about two minutes to ensure that butyl aceta...

Embodiment 2

[0051] Embodiment 2 of the present invention provides a conductive copper paste, which is mainly made of the following components in proportion by weight: 12 parts of trimethylolpropane triacrylate, 25 parts of N-vinylpyrrolidone, and 8 parts of butyl acetate , 3 parts of secondary alcohol, 8 parts of dimethylformamide, 8 parts of divalent acid ester, 1 part of azobisisobutylcyanide, 45 parts of epoxy acrylic resin, 2 parts of fatty alcohol polyoxyethylene ether, 2 parts of imidazole and 260 parts of silver-clad copper powder.

[0052] The preparation method of the conductive copper paste of the present embodiment is as follows:

[0053]Under normal temperature and normal pressure, first mix trimethylolpropane triacrylate and N-vinylpyrrolidone in the weight parts of the above ratio and stir together for about two minutes, so that they are fully mixed and uniform to obtain mixture A; Add butyl acetate to mixture A and stir for about two minutes to ensure that butyl acetate an...

Embodiment 3

[0060] Embodiment 3 of the present invention provides a conductive copper paste, which is mainly made of the following components in proportion by weight: 16 parts of trimethylolpropane triacrylate, 28 parts of N-vinylpyrrolidone, and 12 parts of butyl acetate , 6 parts of secondary alcohol, 12 parts of dimethylformamide, 12 parts of divalent acid ester, 3 parts of azobisisobutylcyanide, 55 parts of epoxy acrylic resin, 5 parts of fatty alcohol polyoxyethylene ether, 5 parts of imidazole and 240 parts of silver-clad copper powder.

[0061] The preparation method of the conductive copper paste of the present embodiment is as follows:

[0062] Under normal temperature and normal pressure, first mix trimethylolpropane triacrylate and N-vinylpyrrolidone in the weight parts of the above ratio and stir together for about two minutes, so that they are fully mixed and uniform to obtain mixture A; Add butyl acetate to mixture A and stir for about two minutes to ensure that butyl aceta...

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Abstract

The invention discloses a conductive copper paste and a preparation method thereof, belonging to the technical field of electronic paste, wherein the electrically conductive copper paste mainly comprises the following components in parts by weight: 12-16 parts of trimethylolpropane triacrylate, 25-28 parts of N-vinyl pyrrolidone, 8-12 parts of butyl acetate, 3-6 parts of secondary alcohol, 8-12 parts of dimethylformamide, 8-12 parts of divalent acid ester, 1-3 parts of azo initiator, 45-55 parts of epoxy acrylic resin, 2-5 parts of fatty alcohol polyoxyethylene ether, 2-5 parts of curing agentand 240-260 parts of silver-coated copper powder. The conductive copper paste has excellent printing property, short solidification time, strong adhesion, low electrical resistivity, excellent solderability, high temperature resistance, resistance to solder ink corrosion. The preparation method of the conductive copper paste has the advantages of simple process, convenient preparation, high production efficiency, good product quality and low production cost.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a conductive copper paste and a preparation method thereof. Background technique [0002] The circuit board is the carrier of electronic components. At present, there are many ways to produce printed circuit boards. One of the production methods is to print conductive paste directly on the substrate to make circuit boards. The printed circuit boards produced in this way are The quality of the conductive circuit layer directly affects the performance of the circuit board. The existing conductive paste has the following disadvantages when used: long curing time, low adhesion, poor solderability, no resistance to solder resist ink erosion, poor printability, low printing yield and high resistivity. Contents of the invention [0003] The purpose of the embodiments of the present invention is to provide a conductive copper paste, which can better improve the ab...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00C08F283/10C08F222/14C08F226/10H05K1/09
CPCC08F283/105H01B1/22H01B13/00H05K1/092C08F222/103
Inventor 郑胜
Owner 郑胜
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