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10results about How to "Does not affect conductivity" patented technology

A probe station electrically conductive light baffle for a cable connection pin card

PendingCN122283196Asmooth connectionsmooth throughLens hoodLight reflection
The conductive light shield for a probe station of the present invention for cable connection pin clips includes a conductive shield body and a light-absorbing layer. The conductive shield body covers the outside of the pin clip on the probe station. The conductive shield body includes a top wall and side walls extending downwards from the edge of the top wall, with one end of the side wall away from the top wall contacting the probe station. The conductive shield body provides electrostatic shielding and optical protection, ensuring that the pin clip is protected from electrostatic discharge and stray light interference during testing, thereby improving testing accuracy and stability. Cable openings are provided on the side walls to accommodate the cable layout between the pin clip and the testing machine, ensuring that the cable can pass smoothly and maintain a normal connection with the testing system. The light-absorbing layer is disposed on the surface of the conductive shield body. The organic carbon black coating has good light absorption properties and can effectively absorb stray light from the environment, reducing interference from light reflection on the optical alignment system.
Owner:CHONGQING XINLIAN MICROELECTRONICS CO LTD

Side light-emitting panel lamp with insulating strip

ActiveCN224065373UDoes not affect conductivityDoes not affect connectivityElongate light sourcesLight fasteningsLED lampElectrically conductive
The side light-emitting panel lamp comprises an annular lamp holder, a lampshade is arranged at the bottom of an inner ring of the annular lamp holder, a lamp belt is arranged on the inner ring face of the annular lamp holder, the insulation strip is fixed to the inner ring face of the annular lamp holder, a plurality of groove holes are formed in the insulation strip, and the groove holes are communicated with the lamp belt. The side face, away from the lamp beads, of the lamp strip is attached to the insulating strip, and the mucilage glue of the lamp strip penetrates through the groove hole to be attached to the inner ring face of the annular lamp holder. The LED lamp is reasonable in structural arrangement, the insulating strip is fixed to the inner ring face of the annular lamp holder, the groove holes are formed in the insulating strip, the side face, away from the lamp beads, of the lamp strip is attached to the insulating strip, and the mucilage glue of the lamp strip penetrates through the groove holes to be attached to the inner ring face of the annular lamp holder, so that the creepage distance is increased, light leakage is prevented, and the service life of the LED lamp is prolonged. Therefore, voltage-withstanding protection is increased, luminosity irradiation is enhanced, normal electric conduction and heat dissipation connection of the lamp strip cannot be affected, using stability and reliability can be improved, and applicability is high.
Owner:郭建科

Nickel sheet bending integrated forming die for new energy battery

PendingCN121797834AAchieve one-time bending and forming processingIncrease productivityShaping toolsCell component detailsElectrical batteryNew energy
The invention discloses a nickel sheet bending integrated forming die for a new energy battery, which comprises an upper die assembly and a lower die assembly, the upper die assembly and the lower die assembly are mutually inserted, guided and connected through a guide assembly, the upper die assembly comprises an upper substrate, an upper die plate is fixedly connected in the middle of the bottom surface of the upper substrate, and a lower die plate is fixedly connected in the middle of the bottom surface of the upper substrate. A plurality of upper die plate large bending forming units are downwards arranged on the upper die plate, all the upper die plate large bending forming units are integrally and evenly arranged at intervals in a horizontal row, and an upper die plate small bending forming unit is correspondingly arranged at the opposite position of each upper die plate large bending forming unit. The lower die assembly comprises a lower base plate, a lower die plate is fixedly arranged in the middle of the upper face of the lower base plate, and a 90-degree forming block is transversely arranged in the middle of the lower die plate. According to the integrated forming die, through brand-new structural design, the bending part structure of the battery connecting nickel sheet can be formed through one-time punch forming, no crack is generated, and the product percent of pass is greatly improved.
Owner:HUANGSHI XUXIN PRECISION MOULD CO LTD

A current-carrying friction and wear protective coating with good electrical conductivity, a preparation method and applications thereof

PendingCN122358110Alow densityGood resistance to high temperature oxidationKerosenePhysical chemistry
This invention relates to the field of coating preparation technology, specifically to a current-carrying friction and wear protective coating with good electrical conductivity, its preparation method, and its application. The coating is prepared by granulation, sintering, and sieving of Ti2AlC powder. The coating raw materials are Ti2AlC powder and metallic Cu powder, with the Ti2AlC phase ratio being 10%~40%. A composite coating is prepared on the surface of boiler steel using supersonic flame spraying technology. The spraying process parameters are: kerosene flow rate 23~29 L / h, oxygen flow rate 53 m³ / h. 3 With a powder feed rate of 30 g / min, a step size of 3 mm, a spraying distance of 320 mm, and a spray gun moving speed of 800 mm / min, the application of Ti2AlC phase-reinforced Cu-based composite coating under current-carrying friction and wear conditions is realized. This provides a method to improve the current-carrying friction protection performance of Cu alloy surfaces without affecting the coating conductivity, which helps to improve the reliability, efficiency, lifespan, and safety of related equipment.
Owner:STATE GRID SHANGHAI MUNICIPAL ELECTRIC POWER CO +1

Highly fluorinated flame-retardant electrolyte additives, methods of making, and highly fluorinated flame-retardant electrolytes and their use in lithium batteries

The application provides a highly fluorinated flame-retardant electrolyte additive, a preparation method, a highly fluorinated flame-retardant electrolyte and application thereof in lithium batteries, and the preparation method comprises the following steps: dissolving phosphorus trichloride in a solvent and cooling to 0-5 DEG C, then adding tert-butyl alcohol and stirring, then adding trifluoroalcohol and reacting to obtain intermediate product A; then, under a nitrogen atmosphere, adding the intermediate product A into a tert-butyl alcohol potassium solution in anhydrous dimethyl sulfoxide and reacting to obtain intermediate product B; finally, under a nitrogen atmosphere, adding dichloroalkane into the intermediate product B and reacting and purifying to obtain the highly fluorinated flame-retardant electrolyte additive. The flame-retardant electrolyte additive has good compatibility with lithium salt and organic solvent, and has high contents of fluorine and phosphorus flame-retardant elements. The additive can be used together with lithium salt and organic solvent to construct a flame-retardant electrolyte for lithium batteries, and can effectively reduce the flammability of the electrolyte and enhance the safety performance without sacrificing the efficiency and performance of the electrolyte.
Owner:XIAMEN UNIV OF TECH

Bipolar current collector with double copper layers and preparation method thereof

PendingCN122061158ADoes not affect conductivityHigh bonding strengthElectrode carriers/collectorsVacuum evaporation coatingSputteringPulse electroplating
The invention discloses a bipolar current collector with double copper layers and a preparation method thereof, and relates to the field of battery current collectors, the current collector takes an aluminum foil as a substrate, and a compact first copper layer prepared by magnetron sputtering and a thickened second copper layer prepared by electroplating are sequentially arranged on one side of the substrate. The first copper layer is prepared by adopting an intermittent deposition method, a pause interval is set in the deposition process, and substrate heating and low-energy ion beam bombardment are assisted, so that the compactness and the bonding strength of a plating layer are remarkably improved; and the second copper layer is prepared by adopting a pulse electroplating method, so that the non-porous and uniform structure is further ensured. Through a sputtering and electroplating composite process, a copper-aluminum interface which is high in binding force and free of defects is successfully constructed, electrolyte permeation is effectively blocked, and generation of lithium-aluminum alloy is prevented, so that the use safety of the bipolar current collector is greatly improved, and the cycle life of a battery is greatly prolonged.
Owner:YANGZHOU NANOPORE INNOVATIVE MATERIALS TECH LTD

A method for manufacturing a single-layer circuit flexible circuit board for an intelligent vision module

ActiveCN121510469Bavoid offsetSolve problems such as poor processingLithography/patterningConductive material chemical/electrolytical removalFlexible circuitsTin plating
The application discloses a manufacturing method of a single-layer circuit flexible circuit board for an intelligent vision module, takes a copper layer and respectively pastes a first dry film and a protective film, a window is made on the first dry film corresponding to a hollow circuit pattern, a tin plating layer is formed, a tin plating plate is formed; a single-sided copper-clad plate is taken, a circuit pattern is made corresponding to the tin layer area, a copper pattern of the copper-clad plate is formed, a first pattern plate is formed; the tin plating plate is correspondingly pressed with the first pattern plate to form a pressed plate; the protective film in the pressed plate is removed, a circuit pattern is made, a copper layer window pattern and a hollow circuit pattern are formed, and a second pattern plate is formed; the area corresponding to the copper pattern of the copper-clad plate of the insulating medium layer in the second pattern plate is removed, then tin removal processing is performed, after processing, the hollow circuit pattern forms a hollow circuit, and a flexible circuit board is formed; the tin layer provides protection for etching, creates a release condition for the copper pattern of the copper-clad plate, and lays a foundation for uncovering the insulating layer, and finally realizes efficient and high-precision processing of the flexible circuit board.
Owner:深せん市実锐泰科技有限公司

High-reliability electric signal vertical lead-out method of vacuum sealing MEMS chip

PendingCN121941398ADoes not affect conductivityLess stringent requirementsPrecision positioning equipmentDecorative surface effectsEtchingMetal membrane
The invention provides a high-reliability electric signal vertical lead-out method of a vacuum sealing MEMS chip, which comprises the following steps: S1, carrying out metal layer or dielectric layer deposition, photoetching and etching on the bottom surface of a vertical lead layer of the MEMS chip to form a bonding pattern layer; wherein the vertical lead layer is a TGV layer or a TSV layer; s2, performing alignment eutectic bonding sealing packaging on the silicon wafer containing the silicon microstructure and the bonding pattern layer; wherein a sealing support sheet is arranged at the bottom of the silicon wafer; and S3, depositing a metal film layer on the top surface of the bonded vertical lead layer, and forming an electrode bonding pad through photoetching and wet etching, so that the electrode bonding pad is conducted with a silicon lead of the silicon wafer. A graphical bonding sealing process is combined with the TSV or the TGV containing the metallized filler with good conductivity, so that the air tightness process requirements of the metallized filled TGV and the TSV are favorably relaxed, and a process scheme which gives consideration to the high vacuum sealing performance of the MEMS chip and the high-reliability vertical extraction of an electric signal is provided.
Owner:XIAN FLIGHT SELF CONTROL INST OF AVIC

Graphite bipolar plates, their preparation methods and applications

This invention provides a graphite bipolar plate, its preparation method, and its application. The preparation method includes: expanding graphite raw material to obtain graphite worms, mixing them with reinforcing materials and binders, performing mechanochemical activation treatment to obtain a modified graphite substrate, molding, and sequentially performing resin impregnation and curing treatments to obtain impregnated monopolar plates, which are then bonded together to obtain a graphite bipolar plate. The reinforcing material includes carbon materials, and the binder includes one or more of polyarylacetylene, polyurethane, dicyandiamide, and resorcinol. This invention introduces a mechanochemical activation process in the preparation of graphite bipolar plates for fuel cells. It utilizes reinforcing materials to improve the bending resistance of the final product, and uses binders to increase the density and formability of the substrate and further increase its mechanical strength, resulting in a modified graphite substrate for electrode preparation. This significantly improves the bending strength of the electrode without affecting its conductivity, thereby increasing the overall lifespan of the fuel cell system.
Owner:FTXT ENERGY TECH CO LTD