17results about How to "Does not affect conductivity" patented technology

The conductive light shield for a probe station of the present invention for cable connection pin clips includes a conductive shield body and a light-absorbing layer. The conductive shield body covers the outside of the pin clip on the probe station. The conductive shield body includes a top wall and side walls extending downwards from the edge of the top wall, with one end of the side wall away from the top wall contacting the probe station. The conductive shield body provides electrostatic shielding and optical protection, ensuring that the pin clip is protected from electrostatic discharge and stray light interference during testing, thereby improving testing accuracy and stability. Cable openings are provided on the side walls to accommodate the cable layout between the pin clip and the testing machine, ensuring that the cable can pass smoothly and maintain a normal connection with the testing system. The light-absorbing layer is disposed on the surface of the conductive shield body. The organic carbon black coating has good light absorption properties and can effectively absorb stray light from the environment, reducing interference from light reflection on the optical alignment system.

The invention discloses an anisotropic device manufacturing method based on laser processing. Comprising the following steps: step 1, growing a SiO2 oxide layer on the surface of n-type silicon through thermal oxidation, then annealing in an argon environment to prepare a substrate, and then cleaning the substrate; 2, depositing Au and Ni on the substrate as a bottom electrode by using a photoetching method; 3, stripping single-layer MoS2 by using a mechanical stripping method, and transferring the single-layer MoS2 to the center of the bottom electrode prepared in the step 2; and 4, performing gray processing on the single-layer MoS2 by using laser to obtain an anisotropic device finished product. Through a laser processing method, the resistivity of the MoS2 material in each direction is different, so that the MoS2 material has anisotropic properties, and the application field of isotropic materials is widened.

The invention belongs to the technical field of solar cells, and particularly relates to a preparation method of a water-based copper-doped NiOx nano-material and a product and application of the water-based copper-doped NiOx nano-material, a NiOx shell layer grows on the surface of the prepared Cu: NiOx nano-material, one or more of alcohol ether, alcohol amine, glycol and polyethylene glycol are used as surface ligands of the nano-material, the number of carbon chains is limited to be 2-4, and the water-based copper-doped NiOx nano-material is prepared. The copper-doped nickel oxide dispersion liquid is used for providing water-based groups (-OH and-NH2), aims to be dispersed in water without influencing the conductivity of the copper-doped nickel oxide dispersion liquid, and also can provide binding sites chelated with In and Sn on ITO (Indium Tin Oxide), so that the copper-doped nickel oxide dispersion liquid has relatively high oxygen affinity, relatively good leveling property, excellent film-forming property, relatively good spreadability, adhesive strength and compactness on an FTO (Fluorine-doped Tin Oxide) substrate.

The invention discloses a compound antioxidant and a preparation method thereof. The compound antioxidant comprises the following raw materials: 50-100g of copper sulfate; 150 to 200 ml of sodium sulfite; 15 to 20g of disodium ethylene diamine tetraacetate; 5-10 g of sodium dodecyl benzene sulfonate; and 500 to 1000 ml of deionized water. The composite antioxidant is prepared by the following process steps: fully dissolving 50-100g of copper sulfate in 1L of deionized water, and uniformly stirring. Slowly adding 150-200ml of sodium sulfite into the copper sulfate solution, controlling the reaction temperature within 30-50 DEG C, and continuously stirring for 1-2 hours until the reaction is complete. Adding 15-20g of disodium ethylene diamine tetraacetate into the solution, and stirring for 1 hour to improve the stability of the antioxidant. And then adding 5-10g of sodium dodecyl benzene sulfonate, and stirring for 1 hour. And finally, removing impurities in the solution in a suction filtration or filtration manner to obtain the composite antioxidant. The composite antioxidant is safe, environmentally friendly and high in applicability, oxidation reaction of copper can be effectively inhibited to a certain extent, and the shelf life of the product is prolonged.

The side light-emitting panel lamp comprises an annular lamp holder, a lampshade is arranged at the bottom of an inner ring of the annular lamp holder, a lamp belt is arranged on the inner ring face of the annular lamp holder, the insulation strip is fixed to the inner ring face of the annular lamp holder, a plurality of groove holes are formed in the insulation strip, and the groove holes are communicated with the lamp belt. The side face, away from the lamp beads, of the lamp strip is attached to the insulating strip, and the mucilage glue of the lamp strip penetrates through the groove hole to be attached to the inner ring face of the annular lamp holder. The LED lamp is reasonable in structural arrangement, the insulating strip is fixed to the inner ring face of the annular lamp holder, the groove holes are formed in the insulating strip, the side face, away from the lamp beads, of the lamp strip is attached to the insulating strip, and the mucilage glue of the lamp strip penetrates through the groove holes to be attached to the inner ring face of the annular lamp holder, so that the creepage distance is increased, light leakage is prevented, and the service life of the LED lamp is prolonged. Therefore, voltage-withstanding protection is increased, luminosity irradiation is enhanced, normal electric conduction and heat dissipation connection of the lamp strip cannot be affected, using stability and reliability can be improved, and applicability is high.

The invention discloses a nickel sheet bending integrated forming die for a new energy battery, which comprises an upper die assembly and a lower die assembly, the upper die assembly and the lower die assembly are mutually inserted, guided and connected through a guide assembly, the upper die assembly comprises an upper substrate, an upper die plate is fixedly connected in the middle of the bottom surface of the upper substrate, and a lower die plate is fixedly connected in the middle of the bottom surface of the upper substrate. A plurality of upper die plate large bending forming units are downwards arranged on the upper die plate, all the upper die plate large bending forming units are integrally and evenly arranged at intervals in a horizontal row, and an upper die plate small bending forming unit is correspondingly arranged at the opposite position of each upper die plate large bending forming unit. The lower die assembly comprises a lower base plate, a lower die plate is fixedly arranged in the middle of the upper face of the lower base plate, and a 90-degree forming block is transversely arranged in the middle of the lower die plate. According to the integrated forming die, through brand-new structural design, the bending part structure of the battery connecting nickel sheet can be formed through one-time punch forming, no crack is generated, and the product percent of pass is greatly improved.

This invention relates to the field of coating preparation technology, specifically to a current-carrying friction and wear protective coating with good electrical conductivity, its preparation method, and its application. The coating is prepared by granulation, sintering, and sieving of Ti2AlC powder. The coating raw materials are Ti2AlC powder and metallic Cu powder, with the Ti2AlC phase ratio being 10%~40%. A composite coating is prepared on the surface of boiler steel using supersonic flame spraying technology. The spraying process parameters are: kerosene flow rate 23~29 L / h, oxygen flow rate 53 m³ / h. 3 With a powder feed rate of 30 g / min, a step size of 3 mm, a spraying distance of 320 mm, and a spray gun moving speed of 800 mm / min, the application of Ti2AlC phase-reinforced Cu-based composite coating under current-carrying friction and wear conditions is realized. This provides a method to improve the current-carrying friction protection performance of Cu alloy surfaces without affecting the coating conductivity, which helps to improve the reliability, efficiency, lifespan, and safety of related equipment.

The application provides a highly fluorinated flame-retardant electrolyte additive, a preparation method, a highly fluorinated flame-retardant electrolyte and application thereof in lithium batteries, and the preparation method comprises the following steps: dissolving phosphorus trichloride in a solvent and cooling to 0-5 DEG C, then adding tert-butyl alcohol and stirring, then adding trifluoroalcohol and reacting to obtain intermediate product A; then, under a nitrogen atmosphere, adding the intermediate product A into a tert-butyl alcohol potassium solution in anhydrous dimethyl sulfoxide and reacting to obtain intermediate product B; finally, under a nitrogen atmosphere, adding dichloroalkane into the intermediate product B and reacting and purifying to obtain the highly fluorinated flame-retardant electrolyte additive. The flame-retardant electrolyte additive has good compatibility with lithium salt and organic solvent, and has high contents of fluorine and phosphorus flame-retardant elements. The additive can be used together with lithium salt and organic solvent to construct a flame-retardant electrolyte for lithium batteries, and can effectively reduce the flammability of the electrolyte and enhance the safety performance without sacrificing the efficiency and performance of the electrolyte.

The invention discloses a bipolar current collector with double copper layers and a preparation method thereof, and relates to the field of battery current collectors, the current collector takes an aluminum foil as a substrate, and a compact first copper layer prepared by magnetron sputtering and a thickened second copper layer prepared by electroplating are sequentially arranged on one side of the substrate. The first copper layer is prepared by adopting an intermittent deposition method, a pause interval is set in the deposition process, and substrate heating and low-energy ion beam bombardment are assisted, so that the compactness and the bonding strength of a plating layer are remarkably improved; and the second copper layer is prepared by adopting a pulse electroplating method, so that the non-porous and uniform structure is further ensured. Through a sputtering and electroplating composite process, a copper-aluminum interface which is high in binding force and free of defects is successfully constructed, electrolyte permeation is effectively blocked, and generation of lithium-aluminum alloy is prevented, so that the use safety of the bipolar current collector is greatly improved, and the cycle life of a battery is greatly prolonged.

The application discloses a manufacturing method of a single-layer circuit flexible circuit board for an intelligent vision module, takes a copper layer and respectively pastes a first dry film and a protective film, a window is made on the first dry film corresponding to a hollow circuit pattern, a tin plating layer is formed, a tin plating plate is formed; a single-sided copper-clad plate is taken, a circuit pattern is made corresponding to the tin layer area, a copper pattern of the copper-clad plate is formed, a first pattern plate is formed; the tin plating plate is correspondingly pressed with the first pattern plate to form a pressed plate; the protective film in the pressed plate is removed, a circuit pattern is made, a copper layer window pattern and a hollow circuit pattern are formed, and a second pattern plate is formed; the area corresponding to the copper pattern of the copper-clad plate of the insulating medium layer in the second pattern plate is removed, then tin removal processing is performed, after processing, the hollow circuit pattern forms a hollow circuit, and a flexible circuit board is formed; the tin layer provides protection for etching, creates a release condition for the copper pattern of the copper-clad plate, and lays a foundation for uncovering the insulating layer, and finally realizes efficient and high-precision processing of the flexible circuit board.

The invention relates to the technical field of aluminum alloy conducting bars, and discloses a high-conductivity aluminum alloy conducting bar and a preparation method thereof. According to the method, the content of alloy components is accurately controlled, specific aluminum bar homogenizing temperature and cooling speed requirements are adopted, specific extrusion temperature and speed are adopted, cold deformation is performed before and after aging, and a two-stage aging process is adopted; the aluminum alloy conducting bar has the comprehensive performance of high conductivity (greater than or equal to 62% IACS), high thermal conductivity (greater than or equal to 220W / (mK)), high strength (tensile strength greater than or equal to 110MPa and yield strength greater than or equal to 110MPa) and good toughness (ductility greater than or equal to 12% and hardness greater than or equal to 30HV), meets the requirements of the field of electrical materials for high-conductivity aluminum alloy, and has wide application prospects. The problems that the material strength is reduced, the process is complex, the cost is high and the like when the electric conductivity is improved in the prior art are solved, and the method has remarkable superiority and wide application prospects.

The invention provides a high-reliability electric signal vertical lead-out method of a vacuum sealing MEMS chip, which comprises the following steps: S1, carrying out metal layer or dielectric layer deposition, photoetching and etching on the bottom surface of a vertical lead layer of the MEMS chip to form a bonding pattern layer; wherein the vertical lead layer is a TGV layer or a TSV layer; s2, performing alignment eutectic bonding sealing packaging on the silicon wafer containing the silicon microstructure and the bonding pattern layer; wherein a sealing support sheet is arranged at the bottom of the silicon wafer; and S3, depositing a metal film layer on the top surface of the bonded vertical lead layer, and forming an electrode bonding pad through photoetching and wet etching, so that the electrode bonding pad is conducted with a silicon lead of the silicon wafer. A graphical bonding sealing process is combined with the TSV or the TGV containing the metallized filler with good conductivity, so that the air tightness process requirements of the metallized filled TGV and the TSV are favorably relaxed, and a process scheme which gives consideration to the high vacuum sealing performance of the MEMS chip and the high-reliability vertical extraction of an electric signal is provided.

This invention provides a graphite bipolar plate, its preparation method, and its application. The preparation method includes: expanding graphite raw material to obtain graphite worms, mixing them with reinforcing materials and binders, performing mechanochemical activation treatment to obtain a modified graphite substrate, molding, and sequentially performing resin impregnation and curing treatments to obtain impregnated monopolar plates, which are then bonded together to obtain a graphite bipolar plate. The reinforcing material includes carbon materials, and the binder includes one or more of polyarylacetylene, polyurethane, dicyandiamide, and resorcinol. This invention introduces a mechanochemical activation process in the preparation of graphite bipolar plates for fuel cells. It utilizes reinforcing materials to improve the bending resistance of the final product, and uses binders to increase the density and formability of the substrate and further increase its mechanical strength, resulting in a modified graphite substrate for electrode preparation. This significantly improves the bending strength of the electrode without affecting its conductivity, thereby increasing the overall lifespan of the fuel cell system.

The embodiment of the utility model provides an electroosmosis anode connection structure, and relates to the field of electroosmosis anode installation. The electroosmosis positive electrode connection structure comprises a mounting wall and a positive electrode mounting wire, a positive electrode titanium wire is firstly placed in a mounting frame, elastic concave plates are made to be close to the positive electrode titanium wire, the elastic concave plates are gradually extruded by the positive electrode titanium wire, the elastic concave plates slide into a positive electrode groove, and the elastic concave plates have elasticity; the elastic concave plate releases part of elastic force, so that the positive titanium wire is clamped in the elastic concave plate, the corners of the four-corner elastic frame body are bent, the four-corner elastic frame body can be plugged into the positive groove, the position of the four-corner elastic frame body in the positive groove is adjusted, the four-corner elastic frame body is located in the middle of the positive groove, and then the corners of the four-corner elastic frame body are loosened; and the four-corner elastic frame body automatically recovers, so that the four-corner elastic frame body is clamped in the middle position of the positive electrode groove, and the positive electrode titanium wire is clamped in the middle position of the positive electrode groove.

The invention belongs to the technical field of thin film sensors, and relates to a high-temperature thin film thermocouple and a preparation method thereof.The high-temperature thin film thermocouple comprises a ceramic substrate, a bonding layer, a sensitive thin film functional layer and an aluminum oxide protective layer which are sequentially arranged from bottom to top, and electrode layers are arranged on the two sides of a wiring end in the sensitive thin film functional layer; the electrode layer is located between the bonding layer or the ceramic substrate and the aluminum oxide protection layer, the electrode layer comprises a GaOx layer printed at normal temperature and an ultrathin layer Au prepared through deposition, and the ultrathin layer Au is arranged above the GaOx layer. The oxidation layer printed on the ceramic substrate or the bonding layer can improve the adhesion of gold, so that the metal-modified electrode layer has excellent conductivity, thermal stability and mechanical stability, and the thickness of the aluminum oxide monolayer arranged on the electrode layer is controlled to be nanoscale, so that the conductivity of the electrode is not influenced, and the conductivity of the electrode is improved. And oxidation of a transition region of the sensitive film functional layer and the electrode layer under a high-temperature condition is effectively inhibited.

The application relates to the technical field of electrochromic lenses, in particular to a vehicle-mounted electrochromic lens and a preparation method thereof, wherein the vehicle-mounted electrochromic lens comprises a lens main body and an ultraviolet-proof film. The ultraviolet-proof film is formed on one side of the lens main body. In this way, the ultraviolet-proof film can effectively block the penetration of ultraviolet rays, improve the ultraviolet resistance of the lens, guarantee the high transmittance of visible light, and improve the visual clarity of the lens in daily use. Meanwhile, the ultraviolet-proof film has good adhesion to the lens main body and strong weather resistance. The ultraviolet-proof film is located on the outer surface of the lens main body and does not contact and react with the internal structure of the lens main body, does not affect the electrochromic response speed, the conductivity and the reflection performance of the lens, and ensures the normal core function of the lens.