The invention relates to a bonding
copper wire and a preparation method thereof. The bonding
copper wire comprises the following components in percentage by
mass: 0.0003 percent to 0.003 percent of
lithium, 0.0002 percent to 0.002 percent of
calcium, 0.0002 percent to 0.001 percent of
aluminium, 0.0005 percent to 0.005 percent of
cerium and / or
yttrium, 0.0001 percent to 0.001 percent of other inevitable
impurity elements and the balance of
copper. The preparation method of the bonding
copper wire comprises the following steps of: preparing a middle
alloy, preparing an
alloy cast
ingot, annealing uniformly, heat
extrusion,
stress relief annealing, drawing, final annealing, winding for multiple coils, packaging, and final protective packaging, wherein in a drawing process, middle
stress relief annealing can be performed according to practical needs. The bonding
copper wire has better inoxidizability while keeping better conduction and
radiation properties; in the preparation process of the bonding
copper wire, the uniform annealing is added and the middle
stress relief annealing is performed, so that the
mechanical property of the prepared bonding copper wire is better.