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45results about How to "Improve surface oxidation resistance" patented technology

Method for preparing composite membrane for improving oxidation resistance of copper lead of integrated circuit

InactiveCN101831566AImprove antioxidant capacityInhibit further oxidationOxidation resistantIntegrated circuit
The invention relates to a method for preparing a composite membrane for improving oxidation resistance of a copper lead of an integrated circuit. The method comprises the following steps of: mixing a little amount of Al and Cu, and repeatedly smelting the mixture in an electric arc furnace to form CuAl alloy; and annealing the CuAl alloy in a heating furnace under hydrogen atmosphere, preserving the heat for certain time, and cooling the annealed product to room temperature to form anti-oxidation copper. After Al element is added, the alloy is annealed in the hydrogen, the Al in the alloy is segregated to the surface of Cu through segregation action and reacts with the rest O in the annealing atmosphere to generate Al2O3 on the surface of the alloy, and a Cu-Al2O3 composite attached membrane with good mechanical property is formed on the surface of the Cu so as to block further oxidation of the Cu and well solve the problem of oxidation of a connecting wire in the copper. The encapsulation temperature of an encapsulation material in the conventional integrated circuit is below 400 DEG C, and the Cu-Al2O3 composite attached membrane formed on the surface of the integrated circuit by using the CuAl alloy as a lead frame material improves the anti-oxidation capability of the lead material and reduces the encapsulation cost.
Owner:JILIN UNIV

Chopped fiber carbon fiber composite material and preparation method thereof

The invention relates to a chopped fiber carbon fiber composite material and a preparation method thereof, and belongs to the technical field of carbon fiber composite material preparation. The preparation method comprises the following steps: 1, grinding a carbon fiber raw material; 2, carrying out short fiber deposition molding; 3, carrying out resin impregnation; 4, forming a mold and injectingliquid, namely putting the resin-infiltrated fiber blank into the mold for forming the mold, and injecting a potential mesophase pitch liquid at the same time; 5, performing high-pressure forming heat treatment: subjecting the infiltrated fiber blank containing the asphalt liquid to heat treatment under high pressure and then condensing the fiber blank to obtain a cured blank; 6, carbonization heat treatment: demolding the cured blank body and then carbonizing to obtain a carbonized blank body; and 7, high-temperature graphitization: carrying out high-temperature graphitization treatment on the carbonized blank to obtain the finished product carbon fiber composite material. The chopped fiber carbon fiber composite material prepared by the invention has high purity and greatly improved compression strength and bending strength, solves the problem of corner solid waste, realizes recycling of the material and generates good economic benefits.
Owner:江苏米格新材料股份有限公司

Nickel-chromium high-resistance electrothermal alloy wire

The invention relates to the technical field of nickel-chromium high-resistance electrothermal alloy wires, and particularly relates to a nickel-chromium high-resistance electrothermal alloy wire. Thenickel-chromium high-resistance electrothermal alloy wire is divided into five different alloy wires according to weight percent: Cr20Ni80, Cr30Ni70, Cr15Ni60, Cr25Ni35 and Cr20Ni30, wherein the Cr20Ni80 is prepared from the main chemical components: 20.0-23.0% of Cr, less than or equal to 1.0% of Fe, 0.75-1.60% of Si, less than or equal to 0.50% of Al and the balance of Ni and inevitable impurities; an element maximum service temperature is 1200 DEG C; a melting point is 1400 DEG C; the density is 8.40 cm<3>; the specific resistance at 20 DEG C is 1.09+ / -0.05 mu ohm.m; the ductility is higher than or equal to 20%; specific heat is 0.440 g.DEG C; a heat conductivity coefficient is 60.3 KJ / m.h.DEG C; a linear expansion coefficient is a*10<-6> / DEG C (20 to 1000 DEG C): 18.0; a microscopic structure of the nickel-chromium high-resistance electrothermal alloy wire is austenite and is nonmagnetic. The nickel-chromium high-resistance electrothermal alloy wire has high specific resistance, the surface oxidation resistance is good, a temperature class is high, and the nickel-chromium high-resistance electrothermal alloy wire has high strength at high temperatures.
Owner:丹阳市亚力电热合金有限公司

Tin-plated copper alloy conductor production process and tin-plated structure

The invention discloses a tinned copper alloy conductor production process and a tinned structure, and relates to the technical field of conductors, the tinned copper alloy conductor production process specifically comprises the following steps: step 1, removing surface oxides of a copper-aluminum-rare earth alloy blank by a polisher to obtain a copper-aluminum-rare earth alloy ingot; secondly, the aluminum alloy cast ingot is stretched through a water tank type drawing machine, drawing oil is sprayed synchronously during stretching, the drawing speed is 400 m / min, a bus is obtained, and the diameter of the bus is 2.05 mm; 3, a wire drawing machine carries out wire drawing treatment on the bus to obtain a wire rod, and the wire diameter of the wire rod is 0.8 mm; through the mode, the copper-aluminum rare earth alloy is replaced by the copper alloy wire, under the corrosion resistance of the copper element in the copper-aluminum rare earth alloy and the synergistic effect of the copper element and the aluminum element, the conductivity is not reduced while the surface oxidation resistance is improved, the weldability and the signal transmission of the wire are ensured, and meanwhile, the copper alloy wire has the advantages of being simple in structure and low in cost. And the soft wire can be conveniently mounted in the tinning structure during tinning.
Owner:常熟市普华电工材料有限公司

Constant-temperature and constant-pressure circulation supply system for copper wire drawing oil

The invention discloses a constant-temperature and constant-pressure circulation supply system for copper wire drawing oil. The constant-temperature and constant-pressure circulation supply system comprises a wire drawing oil tank, a cooling water tank and a heat exchanger; the wire drawing oil tank and the cooling water tank are connected with the heat exchanger through pipelines; the wire drawing oil in the wire drawing oil tank is cooled by the heat exchanger, enters a wire drawing machine and then is circulated by the wire drawing machine to return into the wire drawing oil tank; the constant-temperature and constant-pressure circulation supply system is characterized in that the wire drawing oil in the wire drawing oil tank is pumped into the wire drawing machine under the constant pressure by the aid of a first variable-frequency pump; the cooling water tank comprises a cold water zone and a hot water zone which are separated from each other; a refrigerating unit is connected onto the cold water zone and the hot water zone; water in the cold water zone flows back to the hot water zone after passing through the heat exchanger; and water in the hot water zone returns to the cold water zone after being refrigerated by the refrigerating unit. By the aid of the system, the surface oxidation resistance of wire-drawing products can be improved effectively.
Owner:佛山市祥盈盛金属实业有限公司

Method for preparing composite membrane for improving oxidation resistance of copper lead of integrated circuit

InactiveCN101831566BOxidation rate is fastPrevent oxidationElectric arc furnaceHydrogen atmosphere
The invention relates to a method for preparing a composite membrane for improving oxidation resistance of a copper lead of an integrated circuit. The method comprises the following steps of: mixing a little amount of Al and Cu, and repeatedly smelting the mixture in an electric arc furnace to form CuAl alloy; and annealing the CuAl alloy in a heating furnace under hydrogen atmosphere, preservingthe heat for certain time, and cooling the annealed product to room temperature to form anti-oxidation copper. After Al element is added, the alloy is annealed in the hydrogen, the Al in the alloy issegregated to the surface of Cu through segregation action and reacts with the rest O in the annealing atmosphere to generate Al2O3 on the surface of the alloy, and a Cu-Al2O3 composite attached membrane with good mechanical property is formed on the surface of the Cu so as to block further oxidation of the Cu and well solve the problem of oxidation of a connecting wire in the copper. The encapsulation temperature of an encapsulation material in the conventional integrated circuit is below 400 DEG C, and the Cu-Al2O3 composite attached membrane formed on the surface of the integrated circuit by using the CuAl alloy as a lead frame material improves the anti-oxidation capability of the lead material and reduces the encapsulation cost.
Owner:JILIN UNIV
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