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Anti-spattering soldering tin wire structure

A solder wire, anti-spatter technology, applied in welding medium, welding equipment, welding/cutting medium/material, etc., can solve the problems of spatter or porosity, poor surface oxidation resistance, and difficulty in releasing internal pressure, so as to alleviate internal pressure. Pressure, prevent splash phenomenon, improve the effect of surface oxidation resistance

Inactive Publication Date: 2013-12-11
KUNSHAN HONGJIA SOLDER MFG
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The solder wire in the prior art, due to thermal expansion of the flux, makes it difficult to release the internal pressure, which is easy to cause spatter or porosity, and the oxidation resistance of the surface is poor.

Method used

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  • Anti-spattering soldering tin wire structure

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Embodiment Construction

[0013] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0014] see figure 1 , figure 1 It is a structural schematic diagram of an anti-spatter solder wire structure of the present invention.

[0015] The anti-splash solder wire structure includes a soldering flux layer 1, a tin layer 2 and an anti-oxidation layer 4, wherein the material of the soldering flux layer 1 is a mixture of rosin as the main component, and its components include organic solvents, rosin resins And its derivatives, synthetic resin surfactants, organic acid activators, anti-corrosion agents, co-solvents, film-forming agents. During the welding process, the solder flux layer 1 ca...

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Abstract

The invention relates to an anti-spattering soldering tin wire structure which comprises a soldering-aid layer, a tin layer and an anti-oxidation layer. The tin layer wraps the surface of the soldering-aid layer, and the anti-oxidation layer evenly coats the surface of the tin layer. The tin layer comprises a transverse tin layer body and a longitudinal tin layer body which are arranged in the soldering-aid layer, the soldering-aid layer is divided into four arc soldering-aid layer bodies by the transverse tin layer body and the longitudinal tin layer body, and at least one through hole is formed in the tin layer. By the arrangement of the through hole, internal pressure is effectively relieved, and the spattering phenomenon is avoided; by the arrangement of the transverse tin layer body and the longitudinal tin layer body, a soldering flux does not need to be additionally added in the soldering process, and the surface anti-oxidation performance is improved.

Description

technical field [0001] The invention relates to an anti-splash solder wire structure. Background technique [0002] Solder is an important industrial raw material for connecting electronic components in welding lines, and is widely used in electronics industry, home appliance manufacturing, automobile manufacturing, maintenance industry and daily life. Solder wire is the most convenient solder for manual soldering of circuit boards. Solder wire can be divided into lead-free solder wire and lead solder wire according to its metal composition. Solder wire with different components has different melting points and uses. [0003] In the solder wire in the prior art, due to thermal expansion of the flux, it is difficult to release the internal pressure, which may easily cause spatter or porosity, and the oxidation resistance of the surface is poor. Contents of the invention [0004] The object of the present invention is to provide an anti-spatter solder wire structure in ord...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/14
Inventor 易升明
Owner KUNSHAN HONGJIA SOLDER MFG
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