Antioxidant heat plate liquid-suction core and preparation method thereof
An anti-oxidation and liquid-absorbing core technology, applied in the direction of using liquid cooling for modification, cooling/ventilation/heating transformation, etc., can solve the problems of capillary capacity decline, oxidation, etc., to improve the binding force, improve the surface oxidation resistance, and ensure The effect of thermal conductivity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0022] A preparation method for an anti-oxidation hot plate liquid-absorbent core, comprising the steps of:
[0023] (1) Prepare electroplating bath solution I. The composition of electroplating bath solution I is copper sulfate 50g / L, concentrated sulfuric acid 100ml / L, bath temperature 20-30 ℃;
[0024] (2) Preparation of electroplating bath II. The composition of electroplating bath II is copper sulfate 250g / L, sulfuric acid 75ml / L, bath temperature 20-30°C;
[0025] (3) Preparation of electroplating bath III: the composition of electroplating bath III is nickel sulfate 250g / L, nickel chloride 20g / L, boric acid 40g / L, bath temperature 20-30°C;
[0026] (4) Copper plating:
[0027] For the first copper plating, phosphor copper is used as the anode, the workpiece is used as the cathode, the electroplating process parameters are current density 2A / dm2, and the electroplating time is 5min;
[0028] For the second copper plating, take out the workpiece that has been copper-p...
Embodiment 2
[0034] A preparation method for an anti-oxidation hot plate liquid-absorbent core, comprising the steps of:
[0035] (1) Preparation of electroplating bath I: the composition of electroplating bath I is copper sulfate 50g / L, concentrated sulfuric acid 200ml / L, bath temperature 50-60°C;
[0036] (2) Preparation of electroplating bath II: the composition of electroplating bath II is copper sulfate 300g / L, sulfuric acid 100ml / L, bath temperature 50--60°C;
[0037] (3) Preparation of electroplating bath III: the composition of electroplating bath III is nickel sulfate 300g / L, nickel chloride 10g / L, boric acid 25g / L, bath temperature 30-40°C;
[0038] (4) Copper plating:
[0039] For the first copper plating, phosphor copper is used as the anode, and the workpiece is used as the cathode. The electroplating process parameters are current density 4A / dm2 and electroplating time 5min;
[0040] For the second copper plating, take out the workpiece that has been copper-plated for the f...
Embodiment 3
[0046] A preparation method for an anti-oxidation hot plate liquid-absorbent core, comprising the steps of:
[0047] (1) Prepare electroplating bath solution I: the composition of electroplating bath solution I is copper sulfate 20g / L, concentrated sulfuric acid 300ml / L, bath temperature 20-30 ℃;
[0048] (2) Preparation of electroplating bath II: the composition of electroplating bath II is copper sulfate 300g / L, sulfuric acid 120ml / L, bath temperature 20-30°C;
[0049] (3) Preparation of electroplating bath III: the composition of electroplating bath III is nickel sulfamate 250g / L, nickel chloride 10g / L, boric acid 40g / L, bath temperature 55-60°C;
[0050] (4) Copper plating:
[0051] For the first copper plating, phosphor copper is used as the anode, and the workpiece is used as the cathode. The electroplating process parameters are current density 1A / dm2 and electroplating time 10min;
[0052] For the second copper plating, take out the workpiece that has been copper-pla...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com