Antioxidant heat plate liquid-suction core and preparation method thereof

An anti-oxidation and liquid-absorbing core technology, applied in the direction of using liquid cooling for modification, cooling/ventilation/heating transformation, etc., can solve the problems of capillary capacity decline, oxidation, etc., to improve the binding force, improve the surface oxidation resistance, and ensure The effect of thermal conductivity

Inactive Publication Date: 2019-02-01
江西华度电子新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the final surface of the current electroplating method is copper, which will be oxidized, resulting in a decrease in capillary capacity

Method used

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  • Antioxidant heat plate liquid-suction core and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A preparation method for an anti-oxidation hot plate liquid-absorbent core, comprising the steps of:

[0023] (1) Prepare electroplating bath solution I. The composition of electroplating bath solution I is copper sulfate 50g / L, concentrated sulfuric acid 100ml / L, bath temperature 20-30 ℃;

[0024] (2) Preparation of electroplating bath II. The composition of electroplating bath II is copper sulfate 250g / L, sulfuric acid 75ml / L, bath temperature 20-30°C;

[0025] (3) Preparation of electroplating bath III: the composition of electroplating bath III is nickel sulfate 250g / L, nickel chloride 20g / L, boric acid 40g / L, bath temperature 20-30°C;

[0026] (4) Copper plating:

[0027] For the first copper plating, phosphor copper is used as the anode, the workpiece is used as the cathode, the electroplating process parameters are current density 2A / dm2, and the electroplating time is 5min;

[0028] For the second copper plating, take out the workpiece that has been copper-p...

Embodiment 2

[0034] A preparation method for an anti-oxidation hot plate liquid-absorbent core, comprising the steps of:

[0035] (1) Preparation of electroplating bath I: the composition of electroplating bath I is copper sulfate 50g / L, concentrated sulfuric acid 200ml / L, bath temperature 50-60°C;

[0036] (2) Preparation of electroplating bath II: the composition of electroplating bath II is copper sulfate 300g / L, sulfuric acid 100ml / L, bath temperature 50--60°C;

[0037] (3) Preparation of electroplating bath III: the composition of electroplating bath III is nickel sulfate 300g / L, nickel chloride 10g / L, boric acid 25g / L, bath temperature 30-40°C;

[0038] (4) Copper plating:

[0039] For the first copper plating, phosphor copper is used as the anode, and the workpiece is used as the cathode. The electroplating process parameters are current density 4A / dm2 and electroplating time 5min;

[0040] For the second copper plating, take out the workpiece that has been copper-plated for the f...

Embodiment 3

[0046] A preparation method for an anti-oxidation hot plate liquid-absorbent core, comprising the steps of:

[0047] (1) Prepare electroplating bath solution I: the composition of electroplating bath solution I is copper sulfate 20g / L, concentrated sulfuric acid 300ml / L, bath temperature 20-30 ℃;

[0048] (2) Preparation of electroplating bath II: the composition of electroplating bath II is copper sulfate 300g / L, sulfuric acid 120ml / L, bath temperature 20-30°C;

[0049] (3) Preparation of electroplating bath III: the composition of electroplating bath III is nickel sulfamate 250g / L, nickel chloride 10g / L, boric acid 40g / L, bath temperature 55-60°C;

[0050] (4) Copper plating:

[0051] For the first copper plating, phosphor copper is used as the anode, and the workpiece is used as the cathode. The electroplating process parameters are current density 1A / dm2 and electroplating time 10min;

[0052] For the second copper plating, take out the workpiece that has been copper-pla...

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Abstract

The invention relates to an antioxidant heat plate liquid-suction core. The antioxidant heat plate liquid-suction core comprises a workpiece, a copper layer which covers the surface of the workpiece and a nickel layer which covers the surface of the copper layer; the copper layer covers the workpiece through an electroplating process; and the nickel layer covers the copper layer through the electroplating process. The surface of the workpiece of the liquid-suction core is covered with the copper layer, the surface of the copper layer is covered with the nickel layer, the heat conductivity of the liquid-suction core can be guaranteed, and furthermore the surface antioxidant capacity can be improved; and firstly, the particle copper layer with a rich capillary structure is electroplated on the workpiece, then the nickel layer is electroplated on the surface of the particle copper layer, thus the function of fixing the particle copper layer can be achieved, the binding force of the particle copper layer and the workpiece is improved, and the surface antioxidant capacity can be improved as well.

Description

technical field [0001] The invention relates to the manufacture of a hot plate liquid-absorbing core, in particular to an anti-oxidation hot plate liquid-absorbing core and a preparation method thereof. Background technique [0002] The hot plate is widely used as a heat transfer device of electronic products, and the liquid-absorbing core inside the hot plate contains rich capillary structure. [0003] Invention application number: 201711137877.5, using electroplating method to prepare ultra-thin hot plate liquid-absorbing core. The liquid-absorbing core prepared by the electroplating method has strong capillary capacity, high production efficiency and low cost, and can be mass-produced. However, the final surface of the current electroplating method is copper, which will be oxidized, resulting in a decrease in capillary capacity. Contents of the invention [0004] Aiming at the deficiencies of the prior art, the present invention aims to provide an anti-oxidation hot p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/12C25D3/38C25D3/12C25D7/00H05K7/20
CPCC25D3/12C25D3/38C25D5/12C25D7/00H05K7/2029
Inventor 邵志松周韦曹经倩史少欣
Owner 江西华度电子新材料有限公司
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