Air-cooling and water-cooling hybrid radiating module for large-power series connected IGBT (Insulated Gate Bipolar Translator)

A heat dissipation module, air-cooled and water-cooled technology, applied in the direction of cooling/ventilation/heating transformation, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problems of single structure, large volume, concentrated heat generation, etc., and achieve super heat dissipation performance, the effect of ensuring thermal conductivity

Inactive Publication Date: 2017-05-24
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In high-power applications, the heat loss of a single IGBT is usually greater than 1 kilowatt, and the heat is concentrated. The traditional radiator is air-cooled or water-cooled radiator, which has a single structure and a large volume. No longer suitable for power IGBT series applications

Method used

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  • Air-cooling and water-cooling hybrid radiating module for large-power series connected IGBT (Insulated Gate Bipolar Translator)
  • Air-cooling and water-cooling hybrid radiating module for large-power series connected IGBT (Insulated Gate Bipolar Translator)
  • Air-cooling and water-cooling hybrid radiating module for large-power series connected IGBT (Insulated Gate Bipolar Translator)

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Embodiment 1

[0026] Example 1, such as Figure 5 Shown is a schematic diagram of the air-cooled water-cooled hybrid heat dissipation of the present invention; its structure includes a first radiator body 501, a first heat-conducting material 502, and a first fan 504; the first radiator body 501 includes an air-cooled channel and a water-cooled channel The IGBT module is installed on the front of the radiator through the first heat-conducting material 502; when performing heat dissipation, the air duct on the side of the radiator matches the size of the air outlet of the fan, and the air outlet of the first fan is sealed with the heat sink. Form forced air-cooled heat exchange. The water-cooling channels on the side of the radiator are arranged in parallel with the air-cooling channels with a constant distance. However, during operation, the wind direction of the air duct and the water flow direction of the water cooling channel are perpendicular to each other, forming a complementary heat...

Embodiment 2

[0029] Example 2, such as Figure 6 Shown is a schematic diagram of water cooling and heat dissipation. In the figure, the water cooling channel is always open, and the fan on the air cooling channel is removed, and the air cooling channel does not work. The IGBT module is installed on the front of the radiator through heat-conducting materials; the water-cooling channels are interconnected in a bow-shaped arrangement. The side of the radiator is fed with water flow at a fixed velocity to form forced water cooling and heat exchange. And the circuitous flow mode is adopted, which can slow down the water flow speed, so that the heat of each part can be fully taken away by the water flow.

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Abstract

The invention discloses an air-cooling and water-cooling hybrid radiating module for a large-power series connected IGBT (Insulated Gate Bipolar Translator). The radiating module comprises a radiator body, a heat-conducting material, and a fan, wherein the radiator body comprises an air-cooling channel and a water-cooling channel; an IGBT module is installed on the frontage of a radiator through the heat-conducting material; a sealed water-cooling water inlet and a sealed water-cooling water outlet are formed in a side face the radiator; and the fan is installed on the side face vertical to the water inlet-outlet; the side face of the radiator is matched with an air outlet side of the fan in size, the seal connection is formed between the air outlet of the fan and a heat sink, thereby forming the forced air-cooling heat exchange. The air-cooling and water-cooling hybrid radiating module disclosed by the invention can select the radiating way and flexibly control the heat release, and the volume of the radiating equipment is reduced to a large extent. The radiating demand in the large-power IGBT parallel application occasion can be satisfied.

Description

technical field [0001] The invention belongs to the technical field of heat dissipation of power electronic equipment, and relates to an air-cooled and water-cooled hybrid heat dissipation module, in particular to a hybrid heat dissipation module with series-connected IGBTs having the same heat dissipation conditions. Background technique [0002] IGBT (Insulated Gate Bipolar Transistor) is a composite fully-controlled voltage-driven power semiconductor device composed of BJT (Bipolar Transistor) and MOS (Insulated Gate Field Effect Transistor). It is very suitable for AC motors, frequency converters, switching power supplies, traction drives and other fields. [0003] The IGBT itself will generate a lot of heat during use, and it needs to be assisted by a radiator to dissipate heat. In high-power applications, the heat loss of a single IGBT is usually greater than 1 kilowatt, and the heat is concentrated. The traditional radiator is air-cooled or water-cooled radiator, whi...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/46H01L23/467H01L23/473H05K7/20
CPCH01L23/367H01L23/46H01L23/467H01L23/473H05K7/20H05K7/20136H05K7/20145H05K7/20218H05K7/20272
Inventor 秦飞赵静毅安彤别晓锐方超
Owner BEIJING UNIV OF TECH
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