860results about How to "Adequate heat dissipation" patented technology

A dual-band antenna is provided that combines two normally disparate communications modes into a single compact aperture minimizing overall mass and volume, while maintaining high performance efficiency and reciprocity of each individual mode. The antenna is compatible with both optical (near-IR / visible) and RF (microwave / millimeter-wave) transceiver subsystems for high bandwidth communications, applicable primarily to long- to extremely long-range (space-to-ground) link distances. The optical link provides high bandwidth while the RF provides a lower data-rate weather backup, accommodation for traditional navigation techniques, and assistance in cueing the extremely tight optical beam by matching the RF beamwidth to an optical fine-steering mechanism field-of-regard. The configuration is built around a near-diffraction-limited high performance primary mirror shared by both a direct-fed RF antenna design and a Cassegrain optical telescope. Material properties are exploited to combine the optical secondary mirror with the RF feed structure, providing a collimated optical beam interface at the antenna vertex.

The present invention relates to an LED lamp in which, because the lamp has therein a heat dissipation transfer member and the power source base thereof is made of materials including polycarbonate, etc. with a high emission rate of radiation so as to enhance its surface heat dissipation constant, the power source base has sufficient heat dissipation performance and, thus, a separate insulation circuit is not necessary, thereby improving reliability and productivity of the lamp as well as reducing the cost of manufacturing.To this end, the present invention provides an LED lamp comprising one or more LEDs mounted on a PCB, a floodlight cover that transmits light from the LEDs, and a power source base coupled to the floodlight cover and having a terminal at one end thereof, wherein the power source base is made of an insulation material; and the LED lamp also comprises a heat dissipation transfer member that has a heat sink in contact with the PCB on which the LEDs are mounted, and is formed and installed so as to overlap with and be in tight contact with the inner face of either the power source base or the floodlight cover or both.

The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation. A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.

A cooling device includes: a partition plate for partitioning an interior of a case into a first fluid passage through which first fluid having a high temperature flows and a second fluid passage through which second fluid having a low temperature flows; a heat receiving portion disposed in the first fluid passage; a heat radiating portion disposed in the second fluid passage; and a connection pipe for communicating the heat receiving portion and the heat radiating portion. The heat radiating portion is disposed at an upper side of the heat receiving portion in such a manner that the second fluid from a front side of the heat radiating portion flows into a rear side of the heat radiating portion through a pipe space between the heat radiating portion and the heat receiving portion, and further passes through the heat radiating portion from the rear side toward the front side of the heat radiating portion. Thus, the cooling device has a small size while improving the cooling capacity of the cooling device.

A prism assembly, including two or more prisms, at least one of which has or more surfaces that are used for total internal reflection or partial spectral reflection of incoming light, wherein at least a part of one of the surfaces used for reflection purposes is covered with an element that is spaced apart from the surface, such that a gap is defined in between the surface and the element, and wherein the gap is sealed with a seal that is applied on one of said prisms in order to prevent contaminants from entering the gap.

An illumination device with arms that open after passing through a hole with arms which support one or more light emitting devices, arms that pivot and / or move from a closed configuration for installation to an open configuration for function, a projected size in the closed configuration of a standard light bulb which allows passage through a mounting hole, a socket for mating to an existing wire harness for accepting standard automotive light bulb electrical power, a body to support the arms, their motion, the socket, light emitting devices, and PCBs. In a preferred embodiment, the invention comprises of three or five arms with light emitting diodes (LEDs) as the light emitting devices, springs automatically pivot the arms, printed circuit boards transmit power to the light emitting devices, and the body, arms, and socket are injection molded plastic.

A rectifier for rectifying alternating current into direct current is described, in which a three-phase generator includes a three-phase stator winding. The phases of the stator winding are triggered via switching elements of a power circuit. The power circuit is controlled via a control part, which includes a controller component. The rectifier includes a control part (control module) having control terminals and a power circuit (power module) controlled by the control module and optionally provided with a cooling device, in which all the power-conducting components are designed as power MOS components and integrated in a stacked construction.

A portable personal headlamp utilizes an array of light-emitting diodes on the front face of a circuit board. Arc-shaped projections on the front face of a finned heat sink are in heat-conducting relationship with printed conductors on the rear face of the circuit board, which partially surround one lead of each light-emitting diode.

An integrated compound semiconductor light-emitting-device capable of emitting light as a large-area plane light source. The light-emitting-device includes plural light-emitting-units formed over a substrate, the light-emitting-units having a compound semiconductor thin-film crystal layer, first and second-conductivity-type-side electrodes, a main light-extraction direction is the side of the substrate, and the first and the second-conductivity-type-side electrodes are formed on the opposite side to the light-extraction direction. The light-emitting-units are electrically separated from each other by a light-emitting-unit separation-trench. An optical coupling layer is formed between the substrate and the first-conductivity-type semiconductor layer. The optical coupling layer is common to the plurality of light-emitting-units, and capable of optical coupling of the plurality of light-emitting-units and distributing a light to the entire light-emitting-device.

An LED lamp includes a post (10), a heat sink (20) enclosing the post, an LED module (30) mounted on the post, a holder (40) secured on the LED module, and a lens (50) covering the holder. The heat sink is formed by a plurality of separated fins assembled together. Each fin comprises an outer portion (22) and an inner portion (24). An inner edge of the outer portion abuts interferingly against a periphery of the post, and a bottom of the inner portion contacts a top surface of the post. Heat generated by the LED module is conducted through the post to the plurality of fins, which dissipate the heat to the ambient air.

The invention relates to a cluster task resource allocation method for a multi-core processor. In the method, CPU resource nodes are used as basic allocation units for task allocation according to operation tasks submitted by receiving users to a cluster, and a task resource allocator is formed. The task resource allocator maps resources on the cluster to an M*N matrix AR. When idle resource positions are searched for the tasks, in the method, the tasks are uniformly dispersed and required resources are allocated to the nodes, so that the resource node positions occupied by all tasks are spaced. The method avoids the problem that tasks are excessively concentrated in one certain area, a large amount of heat energy is concentrated in the area as time goes by, the temperature of a local chip is too high, and the normal operating efficiency of a computer is influenced in the traditional task allocation algorithm. The task scheduling algorithm adopted by the method is an online real-time task scheduling algorithm and has good application prospects in the operation and task management of a multi-core processor cluster system.

An integrated compound semiconductor light-emitting-device capable of emitting light as a large-area plane light source, exhibiting excellent in-plane uniformity in an emission intensity is provided. The light-emitting-device comprising a plurality of light-emitting-units formed over a substrate, wherein the light-emitting-unit has a compound semiconductor thin-film crystal layer 24, 25, 26 a first and a second-conductivity-type-side electrode 27, 28; a main light-extraction direction is the side of the substrate, and the first and the second-conductivity-type-side electrode are formed on the opposite side to the light-extraction direction; the light-emitting-units are electrically separated each other by a light-emitting-unit separation-trench which is formed by removing the thin-film crystal layer from the surface to an inside portion of the buffer layer.

The invention relates to a circuit board unit and a method for production thereof. The circuit board unit comprises a circuit board topmost laminate with conductive tracks on the upper side for mounting surface-mountable devices. The circuit board topmost laminate features a thickness dimensioned such that the anticipated heat dissipated by the surface-mountable devices is transported from the upper side to the underside of the circuit board laminate to good effect. The circuit board unit further comprises an electrically insulating laminate arranged under the circuit board topmost laminate, inserts made of a material with good heat conductivity and electrical insulation embedded in the electrically insulating laminate at sites below surface-mountable devices with high heat dissipation, and a cooling plate arranged below the electrically insulating laminate and the inserts.

A power supply control apparatus for controlling a power supply unit including a battery and a load is provided. The power supply control apparatus includes a main relay and a ground relay, a pre-charge relay, an inrush current limiting resistor, a first relay control section, and a time measurement section. The main relay and the ground relay are connected between the battery and the load. The pre-charge relay is connected in parallel with one of the main relay and the ground relay. The inrush current limiting resistor is connected in series with the pre-charge relay, and limits an inrush current from the battery to the load. The first relay control section temporarily turns ON the pre-charge relay and turns ON the main relay and the ground relay upon receiving a power supply connection request from the outside, and turns OFF the main relay and the ground relay upon receiving a power supply interruption request from the outside. The time measurement section chooses a time point in the period from when the pre-charge relay is turned ON to when it is turned OFF, and measures the elapsed time from the chosen time point. Before the elapsed time measured by the time measurement section reaches a predetermined reference period, the first relay control section does not turn OFF the main relay and the ground relay, but maintains the relays ON, even when receiving the power supply interruption request.

A holder in which a light emitting diode is set in an opening is fixed on a heat sink so that power feeding units of the light emitting diode are pushed toward the heat sink by metal wiring bodies. Therefore, the light emitting diode and the heat sink can be brought into close contact with each other and heat dissipation performance of the heat sink can be improved.

A display device, and a blower thereof are disclosed. The display device includes an axial flow fan within a case, which has a display panel encased therein. The axial flow fan is provided in a width direction within the case, so that, while being rotated within the case, the axial flow fan generates forced air flow suitable to the case. The forced air flow is generated in a forward direction along with air flow by natural convection within the case.

A multilayer circuit substrate includes: a laminated circuit portion in which conductive layers and resin insulating layers are alternately laminated; and a metal substrate portion, wherein the laminated circuit portion is fixed to the metal substrate portion so that at least part of a lower surface of the laminated circuit portion is in contact with at least part of an upper surface of the metal substrate portion. An electronic component is mounted on the metal substrate portion.

The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation.A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.

A rectifier for rectifying alternating current into direct current is described, in which a three-phase generator includes a three-phase stator winding. The phases of the stator winding are triggered via switching elements of a power circuit. The power circuit is controlled via a control part, which includes a controller component. The rectifier includes a control part (control module) having control terminals and a power circuit (power module) controlled by the control module and optionally provided with a cooling device, in which all the power-conducting components are designed as power MOS components and integrated in a stacked construction.

A fuel delivery system for an internal combustion engine, having a fuel feed pump, which delivers fuel which is at pilot pressure to a high-pressure fuel pump that communicates on the high-pressure side with at least one injection valve, in order to deliver fuel at high pressure to the injection valve or valves. To prevent vapor bubble development in the high-pressure fuel pump, which impairs its pumping capacity and pressure generation, a coolant medium flow can be delivered to the high-pressure fuel pump via at least one coolant conduit, in order to keep the temperature (THDP) of the high-pressure fuel pump below a critical operating temperature (Tk1).

The invention discloses an anti-collision electric power cabinet with a height adjustment function. The anti-collision electric power cabinet comprises a base, a cabinet body, screw thread rods, a first motor, belt wheels, a belt, sleeves, protection plates, a spring, a cylinder body, a piston rod and a safety airbag. By virtue of setting of the first motor, the screw thread rods, the belt wheelsand the belt, the height of the cabinet can be adjusted, and damage to the electrical power equipment in the cabinet body caused by large-area ground water accumulation can be avoided; by virtue of matching of a second motor, a circular ring, a movable rod and a fan, the fan can be driven to move left and right, so that the electric power equipment can be subjected to heat dissipation by the fan completely and uniformly in a mobile manner with a good effect, so that heat dissipation efficiency is improved; and by virtue of setting of the protection plates, the piston rod, the piston, the cylinder body and the safety airbag, the safety airbag is inflated with air when the protection plates on the two sides of the cabinet body suffer from collision, so that the electric power equipment in the cabinet body is further buffered and protected, and damage to the electrical power equipment in the cabinet body can be avoided.

A display device, and a blower thereof are disclosed. The display device includes an axial flow fan within a case, which has a display panel encased therein. The axial flow fan is provided in a width direction within the case, so that, while being rotated within the case, the axial flow fan generates forced air flow suitable to the case. The forced air flow is generated in a forward direction along with air flow by natural convection within the case.

A heat sink in an electric junction box has thermal diffusion portions having one of convex and concave shapes on the surface. The structure enlarges a surface area of the heat sink compared to a configuration in which a surface has no concavity or convexity, thereby allowing fast heat dissipation from the surface of the heat sink to the exterior of the junction box. Further, the heat sink has the thermal diffusion portions on the entire plate surface. The structure enlarges the surface area of the heat sink compared to a configuration in which the thermal diffusion portions are provided to only a portion of the surface, thereby further enhancing the heat dissipation.

The invention provides a plug-in hybrid electric vehicle heat management system. Relative independent systems in a plug-in hybrid electric vehicle such as an engine cooling system, a motor cooling system, a battery cooling system, a battery controller cooling system are integrated into an overall heat management system by an integrated heat exchanger. The integrated heat exchanger serves as a coreheat exchange structure, heat exchange of engine oil, engine cooling liquid, a battery cooling system, a battery controller cooling system and a motor cooling system is implemented by the aid of multiple cooling cycle paths, and optimal operating temperatures of systems are achieved. According to the system, waste heat generated by running of an engine, discharging of a battery and heat dissipation of the motor is sufficiently utilized, energy of the systems in a whole vehicle is reasonably cycled and utilized, so that energy is saved, and the efficiency of the whole vehicle heat management system is improved.

An LED illuminating device includes an optical section (10), an electrical section (30), and a heat dissipation section (20) arranged between the optical section (10) and the electrical section (30). The heat dissipation section is provided with a heat dissipation device (200) which includes a heat sink (23), a mounting seat (24), and a heat pipe (22) connecting the mounting seat with the heat sink. The heat sink includes a solid base (231) and a plurality of fins (232) extending radially and outwardly from the base. The base is provided with a through hole (233). Alight source (11) is provided in the optical section and attached to the mounting seat. The heat pipe includes an evaporating portion (222) attached to the mounting seat, and a condensing portion (221) fittingly received in the through hole of the base.

A heat dissipation structure in which an IC chip that generates heat is mounted on a substrate and a heat dissipation sheet is interposed between a cover member and the IC chip to dissipate heat, wherein chip-pressing parts (5) are provided to a cover member (4), so that IC chips (3) are pressed against heat dissipation sheets (1) by the chip-pressing parts (5), and each chip-pressing part (5) is configured from an elastic pressing part equipped with an elastically deformable elastic section (51), and a contact section (52) that comes into contact with a heat dissipation sheet (1), in order to provide an electronic device heat dissipation structure that exhibits sufficient heat dissipation properties and improves the reliability of the electronic device, and has a structure such that it is possible to reliably interpose a heat dissipation sheet between an IC chip and a cover member.

The invention relates to the technical field of substations, in particular to an integrated test system for a simulated master station for an intelligent substation. The integrated test system comprises simulated master station testers, wherein the simulated master station tester A is connected with an A-zone data communication cabinet through a router and a switch; the simulated master station tester B is connected with a B-zone data communication cabinet through the router and the switch; the A-zone data communication cabinet is in communication connection with a measuring and control device and a local monitor respectively; the B-zone data communication cabinet is also connected with a comprehensive application server of an alarm direct graphic gateway machine; the A-zone data communication cabinet and the B-zone data communication cabinet are connected with a dispatching data screen; and the dispatching data screen transmits data to a regulation and control center. Due to use of an integrated tester for the simulated master station for the intelligent substation, information check work which needs to repeat twice in the past is changed into once; the closing frequency of primary equipment is reduced; the damage to the equipment is effectively reduced; and the service lifetime of the equipment is prolonged.