Heat dissipation structure for electronic device

A technology of heat dissipation structure and electronic equipment, applied in the direction of circuits, electrical components, electric solid devices, etc., can solve problems such as electronic component failures, malfunctions, and equipment changes, and achieve the effect of improving heat dissipation

Inactive Publication Date: 2013-01-30
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In addition, the electronic components used in various electronic devices correspond to the miniaturization of electronic devices, so their integration level is improved, and electronic components such as IC chips are arranged in a small space at high density, thereby making the heat radiation countermeasure against heat generation a large one. question
[0004] Electronic components such as IC chips mounted on substrates may change their characteristics due to temperature rise due to heat generated during use, causing malfunctions of equipment, or electronic components themselves may fail

Method used

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  • Heat dissipation structure for electronic device
  • Heat dissipation structure for electronic device
  • Heat dissipation structure for electronic device

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Embodiment Construction

[0076] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same reference numerals are used for the same constituent members, and detailed descriptions are appropriately omitted.

[0077] The heat dissipation structure of the electronic device of this embodiment relates to an electronic device provided with a substrate on which electronic components such as an IC chip (semiconductor chip) are mounted, for example, Figure 1A As shown, the heat sink 1 (1A, 1B) is interposed between the IC chip 3 (3A, 3B) mounted on the substrate 2 and a cover member 4 such as a substrate cover covering the mounting surface side of the substrate 2 to dissipate heat.

[0078] In addition, as the heat sink, it is preferable to have flexibility that is easily deformable in the thickness direction and is easily crimped and reliably abuts against the IC chip 3 despite the deviation in the size of the gap between the IC chip 3 and the cover me...

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Abstract

A heat dissipation structure in which an IC chip that generates heat is mounted on a substrate and a heat dissipation sheet is interposed between a cover member and the IC chip to dissipate heat, wherein chip-pressing parts (5) are provided to a cover member (4), so that IC chips (3) are pressed against heat dissipation sheets (1) by the chip-pressing parts (5), and each chip-pressing part (5) is configured from an elastic pressing part equipped with an elastically deformable elastic section (51), and a contact section (52) that comes into contact with a heat dissipation sheet (1), in order to provide an electronic device heat dissipation structure that exhibits sufficient heat dissipation properties and improves the reliability of the electronic device, and has a structure such that it is possible to reliably interpose a heat dissipation sheet between an IC chip and a cover member.

Description

Technical field [0001] The present invention relates to a heat dissipation structure used in electronic equipment such as liquid crystal display devices. Background technique [0002] In recent years, a large number of electronic devices equipped with substrates on which electronic components such as IC chips (semiconductor chips) are mounted have been put on the market. For example, the electronic components are often mounted on a substrate for driving a liquid crystal display panel of a liquid crystal display device. [0003] In addition, the electronic components used in various electronic devices correspond to the miniaturization of electronic devices. Therefore, the degree of integration is improved, and electronic components such as IC chips are arranged in a small space at a high density. As a result, the heat dissipation countermeasures against heat are increased. problem. [0004] Electronic components such as IC chips mounted on a substrate may change characteristics due ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/40H01L23/36H05K7/20
CPCH01L23/36H01L23/427H01L23/433H01L23/40H01L23/34H01L23/42H05K7/20H01L23/4338H01L2924/0002H01L2924/00
Inventor 黑田达朗
Owner SHARP KK
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