Patents
Literature
Patsnap Copilot is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Patsnap Copilot

444results about How to "Improve lighting quality" patented technology

Method for measuring object deformation in real time

The invention discloses a method for measuring object deformation in real time, which comprises the following steps: arranging and adjusting measuring equipment, namely symmetrically arranging two cameras and corresponding LED illumination lamps above a measured object, and making optical axes of the two cameras intersected in a distance of 1 meter in front of the cameras; then calibrating the cameras, namely tightly sticking mark points to the surface of an object to be measured according to the size and shape of the measured object and the measurement requirement; next, placing the measured object stuck with the mark points under the two cameras in about 1 meter or moving the whole measuring equipment to make the measured object enter a measurement range and enable each camera to acquire the mark points on the surface of the measured object, starting the two cameras to shoot sequence images, and acquiring digital images; then identifying and positioning the images; reversely solving a projection matrix according to the calibration result of the cameras, and combining image coordinates of the solved mark points on the surface of the measured object on the images of the two cameras to reconstruct a three-dimensional coordinate of the mark points; and finally, carrying out deformation analysis and calculation for the mark points on the surface of the measured object.
Owner:XI AN JIAOTONG UNIV

Surface light source unit, surface illumination device, and liquid crystal display device

Provided is a surface light source unit which has a high-directivity point light source and has a decreased thickness in the in the direction in which light is irradiated from said point light source. Also provided are a surface illumination device and a liquid crystal display device. A plurality of small chambers (311 to 322) having an opening on the top are formed in a housing (3) from side plates (3b to 3e) that have a predetermined height and partition plates (4) which partition the inside of the housing (3). Each small chamber is provided with a point light source (2) on the bottom part. The opening of each small chamber (311 to 322) is covered with a light transmitting/reflecting plate (511 to 522) which has a surface area (S), and comprises: a central reflecting section that has a surface area (ΔS), exhibits high reflectance and low transmittance, and is positioned directly above the point light source (2); and an outer reflecting section that surrounds the central reflecting section and is configured so that the light transmittance increases at distances further from the central reflecting section. The surface area (ΔS) and surface area (S) of each light transmitting/reflecting plate (511 to 522) are set in a manner such that the ratio ΔS/S is a predetermined value.
Owner:OPTO DESIGN INC

Light-emitting diode display back plate, manufacturing method and display device for light-emitting diode display back plate

The invention provides a light-emitting diode display back plate, a manufacturing method and a display device for the light-emitting diode display back plate and belongs to the field of displaying. The manufacturing method for the light-emitting diode display back plate includes steps: forming a transparent and conductive anode on a substrate; forming a pixel area defined by a first pixel defining layer and a second pixel defining layer on the substrate where the anode is formed; injecting light-emitting materials into the pixel area, and forming an light-emitting layer comprising the light-emitting materials; and forming a conductive cathode on the substrate where the light-emitting layer is formed. The second pixel defining layer made of hydrophobic materials is located above the first pixel defining layer made of hydrophilic materials. By the aid of the light-emitting diode display back plate, the manufacturing method and the display device for the light-emitting diode display back plate in the technical scheme, the light-emitting materials can be flatly laid on the light-emitting diode display back plate, and light-emitting quality of the light-emitting diode display back plate is improved.
Owner:BOE TECH GRP CO LTD

Spliced backlight module and display device

The invention discloses a spliced backlight module and a display device, and relates to the technical field of display, the spliced backlight module comprises at least two lamp panels adjacently arranged in a first direction, each lamp panel comprises a first light-emitting area and a second light-emitting area, and the first direction is parallel to the light-emitting surface of the backlight module; wherein the first light-emitting area comprises a first light-emitting element, the second light-emitting area comprises a second light-emitting element, and the light-emitting direction of the first light-emitting element is different from the light-emitting direction of the second light-emitting element; an optical film; and the orthographic projection of the light supplementing area on thelight emitting surface covers the orthographic projection of the second light emitting area on the light emitting surface in the direction perpendicular to the light emitting surface of the backlightmodule. Due to the fact that the first light-emitting element serves as the backlight source, and the second light-emitting element serves as the light supplementing light source, the emergent lightof the second light-emitting element emitting light laterally can irradiate the light supplementing area, the brightness of the abutted seam of the lamp panels is improved, dark lines are eliminated,and the light emitting quality of the backlight module is improved.
Owner:SHANGHAI AVIC OPTOELECTRONICS

Color temperature adjustable integration high-power LED medical illumination chip

The invention provides an integrated large-power LED medical illumination chip which can be used as a light source with adjustable color temperature for medical operating illumination, inspection illumination, and whole illumination in an operating room; the chip mainly comprises an LED tube core, a substrate, a heat dissipation plate, a power switchover line and an LED driving controller; LED tube cores with different colors are integrated on the substrate of a circuit board by a certain array; the substrate is connected on the heat dissipation plate; according to different colors of LED tube cores, the integrated chip is divided into a plurality of groups which are used for power supply respectively. Brightness of various colors can be adjusted independently, the integrated large power LED chip can be adjusted in the range of 3500K-6500K to have any color temperature and brightness according to the mixed color proportion of the LED tube core series of different colors, the chip can be used for illumination in operating rooms, inspection rooms, environment with special color temperature requirement and the like, is especially applicable for medical illumination and the like, and is beneficial for improving the medical illumination quality and reducing the medical negligence.
Owner:重庆邦桥科技有限公司

Transistor outline (TO)-CAN packaged semiconductor laser and fabrication method thereof

The invention proposes a transistor outline (TO)-CAN packaged semiconductor laser and a fabrication method thereof. The TO-CAN packaged semiconductor laser comprises a TO tube base, a semiconductor laser chip, a backlight detector chip, a gold bonding wire, pins and a heat sink block, wherein the heat sink block is arranged on the upper surface of the TO tube base, the pins are fixed on the TO tube base in an insulation way, the upper end of at least one pin protrudes out of the upper surface of the TO tube base, the semiconductor laser chip is fixed on the surface of the heat sink block, the upper part of the pin protruding out of the upper surface of the TO tube base is connected with a support table, and the backlight detector chip is arranged on the support table and below the semiconductor laser chip. In the TO-CAN packaged semiconductor laser, the backlight detector chip is arranged on the support table integrated and connected with the pins, thus, an independent cushion block is omitted, and the material cost of the cushion block is saved; and moreover, the gold wire bonding process between the backlight detector chip and the cushion block in one time is omitted, the gold wire bonding process is simplified, the gold wire bonding cost is saved, and the stability of a laser product is improved.
Owner:武汉海赛姆光电技术有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products