The application relates to the technical field of
electronic component connection, in particular to a micro light-emitting
diode chip carrier for vehicle lamps, which comprises a carrier plate, a first surface and a second surface of the carrier plate are each provided with a first
signal area and a second
signal area which are symmetrically arranged relative to a first central axis of the carrier plate, and a first power area and a second power area which are symmetrically arranged relative to a second central axis of the carrier plate. A plurality of interfaces are arranged in the first
signal area, the second signal area, the first power area and the second power area, the plurality of interfaces on the first surface are used for connecting chips, the plurality of interfaces on the second surface are used for connecting
light source plates, and the plurality of interfaces on the first surface are correspondingly connected with the plurality of interfaces on the second surface to transmit signals and
electric energy between the chips and the
light source plates. The first signal area, the second signal area, the first power area and the second power area which are symmetrically arranged can improve the transmission efficiency of signals and
electric energy between the chips and the
light source plates, and the unified and standardized design facilitates production and manufacturing.