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Copper alloy and copper alloy plate and preparation method and application thereof

A copper alloy and plate technology, applied in the field of metal materials, can solve problems such as environmental pollution, and achieve the effects of solving environmental pollution, good corrosion resistance, and improving surface oxidation resistance.

Active Publication Date: 2019-12-20
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a copper alloy, a copper alloy plate and its preparation method and application, aiming to solve the technical problem of environmental pollution caused by the use of electroplating for anticorrosion of existing copper products proposed in the above background technology

Method used

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  • Copper alloy and copper alloy plate and preparation method and application thereof
  • Copper alloy and copper alloy plate and preparation method and application thereof
  • Copper alloy and copper alloy plate and preparation method and application thereof

Examples

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Embodiment 1

[0033] A copper alloy containing 0.2wt% of Ti and the remainder consisting of Cu and unavoidable impurities.

[0034] In the present embodiment, the preparation method of described copper alloy, the steps are as follows:

[0035] 1) Mix 0.2g of granular titanium with a purity of 99.99% and 99.8g of granular pure copper with a purity of 99.99% to obtain a mixture, wherein the titanium is a cylinder with a diameter of 3mm and a height of 5mm, and the specifications of pure copper are the same , it should be noted that block or granular samples must be used for smelting, one is that block or granular samples are easy to melt uniformly, and the other is because the samples required by the embodiment of the present invention have higher purity, so the melting furnace used is argon Gas shielding gas vacuum melting furnace, the instantaneous high temperature of the melting furnace will make the powder sample volatilize, which is prone to danger;

[0036] 2) The mixture is placed in ...

Embodiment 2

[0043] A copper alloy containing 2 wt % of Ti and the remainder consisting of Cu and unavoidable impurities.

[0044] In the present embodiment, the preparation method of described copper alloy, the steps are as follows:

[0045] 1) Mix 2g of granular titanium with a purity of 99.99% and 98g of granular pure copper with a purity of 99.99% to obtain a mixture, wherein the titanium is a cylinder with a diameter of 3mm and a height of 5mm, and the specification of pure copper is the same as that of pure copper. It should be noted that block or granular samples must be used for smelting, one is that block or granular samples are easy to melt evenly, and the other is because the samples required by the embodiment of the present invention have high purity, so the melting furnace used is protected by argon Gas vacuum melting furnace, the instantaneous high temperature of the melting furnace will make the powder sample volatilize, which is prone to danger;

[0046] 2) Put the mixed m...

Embodiment 3

[0051] A copper alloy containing 1 wt% of Ti and the remainder consisting of Cu and unavoidable impurities.

[0052] In the present embodiment, the preparation method of described copper alloy, the steps are as follows:

[0053] 1) Mix 1g of granular titanium with a purity of 99.99% and 99g of granular pure copper with a purity of 99.99% to obtain a mixture, wherein the titanium is a cylinder with a diameter of 3mm and a height of 5mm, and the specification of pure copper is the same as that of pure copper. It should be noted that block or granular samples must be used for smelting, one is that block or granular samples are easy to melt evenly, and the other is because the samples required by the embodiment of the present invention have high purity, so the melting furnace used is protected by argon Gas vacuum melting furnace, the instantaneous high temperature of the melting furnace will make the powder sample volatilize, which is prone to danger;

[0054] 2) Put the mixed ma...

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Abstract

The invention relates to the field of metal materials, and particularly discloses a copper alloy and a copper alloy plate and a preparation method and application thereof. The copper alloy has good corrosion resistance, the trace titanium element and the metal copper are melted into an alloy, Ti is segregated to the surface of the alloy by a heat treatment process and annealing in a mixed gas composed of argon and hydrogen, so that the surface of the metal copper is attached to TiO2 composite films, therefore, the internal metal copper can be well protected from reacting with surrounding oxygen, water vapor and the like, so that the surface oxidation resistances of automobile parts with copper as main raw materials can be improved, corrosion prevention is not needed by using an electroplating method, the performance is excellent, and the technical problem of environmental pollution caused by the fact that existing copper products are corroded by adopting electroplating is solved.

Description

technical field [0001] The invention relates to the field of metal materials, in particular to a copper alloy, a copper alloy plate and a preparation method and application thereof. Background technique [0002] In the current social and economic development, metal copper materials are widely used in the manufacture of components and parts in industries such as vehicles, machine tools, thermal energy, chemicals, aerospace, construction, and electronics because of their excellent mechanical and physical properties. However, copper products made of metallic copper materials are mostly used in atmospheric environments. Due to their relatively active chemical properties, they are easy to oxidize with surrounding media such as water and oxygen to cause corrosion or rust, thereby causing losses to people. [0003] Many auto parts are copper products. In order to reduce the loss of copper products due to corrosion, an effective method is to use electrochemical methods to cover a la...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/00C22C1/02C22F1/08C22F1/02
CPCC22C1/02C22C9/00C22F1/02C22F1/08
Inventor 朱永福张健李春赫冀政潼郎兴友金波杨春城蒋青
Owner JILIN UNIV
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