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Conductive glue, preparation method thereof and circuit board

A technology of conductive adhesive and conductive particles, applied in conductive adhesives, printed circuit parts, adhesives, etc., can solve the problem of high cost, and achieve the effect of improving solderability and reducing production costs

Active Publication Date: 2015-05-20
LANGFANG GAOCI NEW MATERIALS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to provide a conductive adhesive, its preparation method and circuit board, so as to improve the problem of using gold powder, silver powder and other precious metals as conductive particles in the prior art, and the problem of high cost

Method used

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  • Conductive glue, preparation method thereof and circuit board
  • Conductive glue, preparation method thereof and circuit board
  • Conductive glue, preparation method thereof and circuit board

Examples

Experimental program
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preparation example Construction

[0033] At the same time, the present invention also provides a method for preparing the above-mentioned conductive glue, which includes the following steps: taking the conductive particles for standby; mixing the resin matrix with the conductive particles to obtain the precursor of the conductive glue; conducting the conductive glue precursor Cured to form a conductive adhesive. In this preparation method, a conductive adhesive with better performance can be obtained through a simple mixing step and then curing.

[0034] In a more preferred embodiment of the present invention, when the conductive adhesive also includes a diluent and / or a coupling agent, the above step S2 includes: S21, performing a first Mixing for the first time to obtain the first mixture; S22, mixing the first mixture with the conductive particles for the second time to obtain the conductive adhesive precursor. By step-by-step mixing, the mixed conductive particles can be more uniformly mixed with the resi...

Embodiment 1

[0043] Take 50g 300-mesh copper powder and 50g tin powder, mix them evenly to obtain mixed metal powder, set aside;

[0044] 10 g of epoxy resin E-51 with an epoxy equivalent of 100 and 4 g of ethylene glycol ether were mechanically stirred for 15 min and mixed uniformly to obtain the first mixture;

[0045] Then add 100g mixed metal powder to the above-mentioned first mixture, fully mix in the banbury mixer, obtain the conductive glue precursor;

[0046] Add 3 g of a polyamide curing agent with a molecular weight of 800 to the conductive adhesive precursor and cure at 150° C. for 40 minutes to prepare the conductive adhesive.

Embodiment 2 to Embodiment 12

[0048] According to the steps identical with embodiment 1, carry out the preparation of conductive adhesive with the raw material shown in table 1 and the preparation parameter shown in table 2, obtain the conductive adhesive of each embodiment, and the performance of the conductive adhesive of each embodiment The test was carried out, and the test results are shown in Table 3.

[0049] Table 1: (raw materials)

[0050]

[0051] Table 2:

[0052]

[0053]

[0054] table 3:

[0055]

[0056] It can be seen from the above Comparative Example 1 and Examples 1-12 that the resistance of the conductive adhesive prepared by the preparation method of the present invention is much smaller than that of Comparative Example 1, which greatly improves the conductivity of the conductive adhesive. Moreover, the shear strength of the conductive adhesive of the present invention is much larger than that of Comparative Example 1, indicating that the conductive adhesive of the prese...

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Abstract

The invention discloses conductive glue, a preparation method thereof and a circuit board. The conductive glue comprises a resin base body as well as conductive particles mixed in the resin base body, wherein the conductive particles comprise first conductive particles which are tin powder particles. The conductive glue disclosed by the invention substitutes noble metals by tin powder, so that the production cost is reduced on the premise of not affecting the conductive performances. Meanwhile, tin powder is added to substitute noble metals to effectively improve weldability of a printed circuit, so that the conductive glue is more suitable for welding production.

Description

technical field [0001] The invention relates to the field of conductive adhesive preparation, in particular to a conductive adhesive, a preparation method thereof and a circuit board. Background technique [0002] Conductive adhesive is an adhesive with certain conductivity after curing or drying. It has the advantages of low bonding temperature, high resolution and simple use steps, and can better meet the needs of the modern microelectronics industry for conductive connections. Therefore, in recent years, in the microelectronics assembly and manufacturing industry, more and more researchers have turned their interest to conductive adhesives. Conductive adhesive can be divided into two categories: structural type and filling type according to the composition of the matrix. The structural type refers to the conductive adhesive in which the polymer material itself is conductive as the matrix of the conductive adhesive; the filled type refers to the conductive adhesive that ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00C09J163/04H05K1/11
Inventor 王治虎王庆杰孙芳钟华宇
Owner LANGFANG GAOCI NEW MATERIALS TECH CO LTD
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