Film bulk acoustic resonator and manufacturing method thereof

A thin-film bulk acoustic wave and manufacturing method technology, applied to electrical components, impedance networks, etc., can solve problems such as elastic reflection waves in the horizontal direction, and achieve the effects of reducing energy, reducing strength, and eliminating additional standing wave oscillations

Active Publication Date: 2020-02-21
芯知微(上海)电子科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] The object of the present invention is to provide a thin film bulk acoustic resonator and its manufacturing method, which solves the problem of elastic reflection waves in the horizontal direction in the thin film bulk acoustic resonator in the prior art

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  • Film bulk acoustic resonator and manufacturing method thereof
  • Film bulk acoustic resonator and manufacturing method thereof
  • Film bulk acoustic resonator and manufacturing method thereof

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Embodiment Construction

[0085] The thin film bulk acoustic resonator of the present invention and its manufacturing method will be described in more detail below with reference to schematic diagrams, wherein a preferred embodiment of the present invention is represented, it should be understood that those skilled in the art can modify the present invention described here, and still realize Advantageous effects of the present invention. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.

[0086] In the following paragraphs the invention is described more specifically by way of example with reference to the accompanying drawings. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose ...

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Abstract

The invention discloses a film bulk acoustic resonator and a manufacturing method thereof. The film bulk acoustic resonator is characterized in that out of a cavity overlapping region and outside an electrode overlapping region, a first electrode plate body and a second electrode plate body respectively comprise a first vibration buffer strip and a second vibration buffer strip, so that the rigidity in the horizontal direction can be effectively reduced (the flexibility is enhanced) while the rigidity in the vertical direction is less influenced, and a buffering effect is achieved for horizontal elastic waves propagating along the electrode plate in the horizontal direction, so that the strength of elastic reflection waves is reduced. Besides, a piezoelectric induction oscillation plate clamped between the first electrode plate body and the second electrode plate body is integrally arranged in the cavity overlapping area, and the boundary of the piezoelectric induction oscillation plate is a polygon without any parallel opposite sides; and additional standing wave oscillation which becomes clutter in the horizontal direction is eliminated, and meanwhile energy consumed by transverse parasitic waves is reduced to the maximum extent. A corresponding manufacturing method is also disclosed.

Description

technical field [0001] The present invention relates to the technical field of filter devices, in particular to a bulk acoustic wave resonator (BulkAcoustic Wave Resonator, BAWR) and a manufacturing method thereof. Background technique [0002] With the development of mobile communication technology, the amount of mobile data transmission is also increasing rapidly. Therefore, under the premise of limited frequency resources and the use of as few mobile communication devices as possible, improving the transmission power of wireless power transmission equipment such as wireless base stations, micro base stations or repeaters has become a problem that must be considered, and it also means that the The requirements for filter power in the front-end circuit of mobile communication equipment are also getting higher and higher. [0003] At present, the high-power filters in wireless base stations and other equipment are mainly cavity filters, whose power can reach hundreds of wat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/02H03H9/17H03H9/19
CPCH03H9/02015H03H9/02047H03H9/02086H03H9/174H03H9/19H03H2009/02173
Inventor 王晓川
Owner 芯知微(上海)电子科技有限公司
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