Chip on film (COF) substrate and manufacturing method thereof and display panel

Abstract

The invention is suitable for the technical field of displays, and provides a chip on film (COF) substrate, which comprises a substrate, a protective layer and a metal film protective layer, wherein a welding wire is arranged on the surface of the substrate; the protective layer is arranged in the preset position of the welding wire; the metal film protective layer is arranged on the part, uncoated with the protective layer, of the welding wire. The active metal film protective layer is plated on the welding wire partially exposed in the air on the COF substrate, conduction is not affected, the time of copper corrosion is delayed, and the speed of copper corrosion is slowed. By applying the COF substrate and the manufacturing method thereof and the display panel, disclosed by the invention, the fracture risk of the welding wire on the COF substrate due to corrosion is effectively reduced, thus the using time of a product is increased, and the service life of the product is prolonged.

Description

technical field [0001] The invention belongs to the technical field of displays, and in particular relates to a chip-on-chip film substrate, a manufacturing method thereof, and a display panel. Background technique [0002] When the TFT-LCD (Thin Film Transistor Liquid Crystal Display, Thin Film Transistor Liquid Crystal Display) panel is displayed normally, it is necessary to use a COF substrate (chip on film, chip on film) to connect the PCB board (Printed Circuit Board, printed circuit board) and the LCD panel , so that the signals on the PCB can be conducted to the panel. [0003] Such as figure 1 As shown, a welding lead 2 is provided on a COF substrate 1 , and a protective layer 3 is coated on the welding lead 2 . Because copper has good electrical and thermal conductivity and good flexibility, copper is often used as a material for making welding leads. On the COF substrate, the welding leads not coated with the protective layer 3 are reserved for welding to the we...

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Problems solved by technology

[0007] The object of the present invention is to provide a chip-on-chip film substrate and its manufacturing method and display panel, aiming to solve the existing problem in the prior art that the welding leads on the COF will be partially exposed in the air, but will be exposed in the environment where ions exist. Electrochemical reactions occur and will be corroded, thus affecting the transmission of signals

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