Disclosed is a low-temperature conductive printed circuit board silver slurry. The slurry is prepared by use of the following raw materials in parts by weight: 6-9 parts of indium tin oxide, 4-6 parts of 1-10 nm sheet-like silver powder, 4-6 parts of 40-50 nm spherical silver powder, 50-60 parts of 1-10 [mu]m sheet-like silver powder, 5-7 parts of an E-12 epoxy resin, 1-2 parts of a silicone resin, 12-15 parts of xylene, 7-10 parts of n-butanol, 1-2 parts of a polyurethane resin, 0.4-0.8 parts of isophorone diamine, 1-2 parts of dipentene, 2-4 parts of lignine, 0.4-0.8 parts of ethylene bis oleamide, and 11-14 parts of glass powder. According to the invention, the indium tin oxide is added to the slurry, less silver powder is consumed, the conductivity is good under the condition of a low temperature, and excellent conducting effect is achieved through matching of the silver powder in different particle sizes and different shapes; and the glass powder is low in melting point and small in heat expansion ratio, such that the circuit printing yield is high, and the conducting performance is good.