Low-temperature conductive printed circuit board silver slurry and preparation method thereof

Abstract

Disclosed is a low-temperature conductive printed circuit board silver slurry. The slurry is prepared by use of the following raw materials in parts by weight: 6-9 parts of indium tin oxide, 4-6 parts of 1-10 nm sheet-like silver powder, 4-6 parts of 40-50 nm spherical silver powder, 50-60 parts of 1-10 [mu]m sheet-like silver powder, 5-7 parts of an E-12 epoxy resin, 1-2 parts of a silicone resin, 12-15 parts of xylene, 7-10 parts of n-butanol, 1-2 parts of a polyurethane resin, 0.4-0.8 parts of isophorone diamine, 1-2 parts of dipentene, 2-4 parts of lignine, 0.4-0.8 parts of ethylene bis oleamide, and 11-14 parts of glass powder. According to the invention, the indium tin oxide is added to the slurry, less silver powder is consumed, the conductivity is good under the condition of a low temperature, and excellent conducting effect is achieved through matching of the silver powder in different particle sizes and different shapes; and the glass powder is low in melting point and small in heat expansion ratio, such that the circuit printing yield is high, and the conducting performance is good.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, in particular to a low-temperature conductive printed circuit board silver paste and a preparation method thereof. Background technique [0002] In the modern microelectronics industry, people have higher and higher requirements for electronic components, and the production is mostly carried out by process and standardization to reduce costs. The printed circuit board (PCB) was born to meet the needs of the microelectronics industry. Correspondingly, conduct research on new conductive pastes to match electronic pastes such as conductive pastes, electrode pastes, dielectric pastes, resistor pastes, and hole filling pastes with printed circuit boards (PCBs) that require new requirements. It is imperative. [0003] Generally speaking, the main components of electronic paste include functional phases such as metal, noble metal powder, etc., inorganic binders such as glass powder, oxide powd...