The invention discloses a PCBA (
Printed Circuit Board Assembly) warping degree detection method, which comprises the following steps of: 1, manufacturing a matched PCBA bearing jig according to the structure of a PCBA to be detected; 2, providing a detection
system, making a to-be-detected PCBA warping degree
test point map according to the structure of the to-be-detected PCBA, generating
test point coordinates, formulating a to-be-detected PCBA warping degree standard, and inputting the
test point coordinates and the warping degree standard into the detection
system; step 3, placing the PCBA to be tested on the PCBA bearing jig for positioning; 4, the detection
system controls the photoelectric
distance measurement module to measure the distance of the corresponding test point according to the coordinate information of the test point of the PCBA to be tested, so as to obtain the data of each test point; and step 5, the detection system processes the obtained data to obtain height data of each test
point location, obtains warping degree data by combining the distance between any two test point locations, compares the obtained warping degree data with a warping degree standard, and judges whether the warping degree of the PCBA to be detected is qualified or not. Compared with the prior art, the method has the beneficial effects that a
machine testing mode is adopted, the error problem of
manual testing can be avoided, the testing efficiency is greatly improved, full inspection of the PCBA warping degree can be realized, and loss caused by poor FOB bonding due to the fact that the warping degree exceeds the standard is avoided.