Resistance copper slurry and preparation method thereof

A technology of resistance and copper paste, which is applied in the direction of electrical components, printed circuits, printed circuit parts, etc., can solve the problems of complex fixed resistance components, complex production process of components, long curing time of paste, etc., and achieve production cost Low, short curing time, high production efficiency

Inactive Publication Date: 2019-01-15
郑胜
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] A resistor is a current-limiting element in an electronic circuit, which acts as a shunt or a voltage divider. At present, the resistance element is usually fixed on the circuit board by welding. This method is not only complicated in fixing the resistance element, but also high in cost. , the production process of components is also complicated and a time-consuming and consumable process; printing resistance paste directly on the circuit board instead of resistance components can save labor and material costs and improve production efficiency; but the existing resistance paste When screen printing is used, the printing performance is poor, and the paste curing time is long, resulting in low production efficiency, low adhesion, and poor resistance stability under high temperature impact

Method used

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  • Resistance copper slurry and preparation method thereof
  • Resistance copper slurry and preparation method thereof
  • Resistance copper slurry and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0036] Embodiment 1 of the present invention provides a resistance copper paste, which is mainly made of the following components in proportion by weight: 14 parts of trimethylolpropane triacrylate, 26 parts of N-vinylpyrrolidone, 5 parts of dibasic acid ester 40 parts, 40 parts of epoxy acrylic resin, 3 parts of fatty alcohol polyoxyethylene ether, 2 parts of sodium dodecylbenzenesulfonate, 10 parts of tert-butyl peroxybenzoate and 90 parts of silver-coated copper powder.

[0037] The preparation method of the resistance copper paste of the present embodiment is as follows:

[0038] Under normal temperature and pressure, trimethylolpropane triacrylate and N-vinylpyrrolidone were mixed together and stirred together for about five minutes according to the weight parts of the above ratio, so that they were fully mixed to obtain mixture A; Add the divalent acid ester to the mixture A and stir for about five minutes to ensure that the divalent acid ester and the mixture A are full...

Embodiment 2

[0044] Embodiment 2 of the present invention provides a resistance copper paste, which is mainly made of the following components in proportion by weight: 12 parts of trimethylolpropane triacrylate, 25 parts of N-vinylpyrrolidone, 3 parts of dibasic acid ester Parts, 38 parts of epoxy acrylic resin, 2 parts of fatty alcohol polyoxyethylene ether, 1 part of surfactant, 8 parts of initiator and 100 parts of silver-coated copper powder.

[0045] The preparation method of the resistance copper paste of the present embodiment is as follows:

[0046] Under normal temperature and pressure, trimethylolpropane triacrylate and N-vinylpyrrolidone were mixed together and stirred together for about five minutes according to the weight parts of the above ratio, so that they were fully mixed to obtain mixture A; Add the divalent acid ester to the mixture A and stir for about five minutes to ensure that the divalent acid ester and the mixture A are fully mixed to obtain the mixture B; then ad...

Embodiment 3

[0052] Embodiment 3 of the present invention provides a resistance copper paste, which is mainly made of the following components in proportion by weight: 16 parts of trimethylolpropane triacrylate, 28 parts of N-vinylpyrrolidone, 6 parts of dibasic acid ester parts, 45 parts of epoxy acrylic resin, 5 parts of fatty alcohol polyoxyethylene ether, 3 parts of surfactant, 13 parts of initiator and 80 parts of silver-coated copper powder.

[0053] The preparation method of the resistance copper paste of the present embodiment is as follows:

[0054]Under normal temperature and pressure, trimethylolpropane triacrylate and N-vinylpyrrolidone were mixed together and stirred together for about five minutes according to the weight parts of the above ratio, so that they were fully mixed to obtain mixture A; Add the divalent acid ester to the mixture A and stir for about five minutes to ensure that the divalent acid ester and the mixture A are fully mixed to obtain the mixture B; then ad...

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Abstract

The invention discloses resistance copper slurry and a preparation method thereof, and belongs to the technical field of electronic slurry. The resistance copper slurry is mainly prepared from the following components in parts by weight: 12-16 parts of trimethylolpropane triacrylate, 25-28 parts of N-vinyl pyrrolidone, 3-6 parts of bivalent acid ester, 38-45 parts of epoxy acrylic resin, 2-5 partsof fatty alcohol polyoxyethylene ether, 1-3 parts of a surfactant, 8-13 parts of an initiator and 80-100 parts of silver-coated copper powder. The resistance copper slurry has the advantages of excellent printability, short curing time, strong adhesion force, high temperature resistance, moisture resistance, resistance to solder resist ink erosion, and stable resistance value. The preparation method of the resistance copper slurry is simple in process, easy to prepare and high in production efficiency; the produced product has good quality and low production cost.

Description

technical field [0001] The invention belongs to the technical field of electronic paste, and in particular relates to a resistance copper paste and a preparation method thereof. Background technique [0002] A resistor is a current-limiting element in an electronic circuit, which acts as a shunt or a voltage divider. At present, the resistance element is usually fixed on the circuit board by welding. This method is not only complicated in fixing the resistance element, but also high in cost. , the production process of components is also complicated and a time-consuming and consumable process; printing resistance paste directly on the circuit board instead of resistance components can save labor and material costs and improve production efficiency; but the existing resistance paste When screen printing is used, the printing performance is poor, and the paste curing time is long, resulting in low production efficiency, low adhesion, and poor resistance stability under high te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/102C09D11/03H05K1/09
CPCC09D11/03C09D11/102H05K1/092
Inventor 郑胜
Owner 郑胜
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