A rotation type reflow soldering furnace comprises a furnace body, a furnace door, an impeller, a rotation control device, a tray, a tray position adjusting device, a vacuum pump and a temperature controller. The rotation type reflow soldering furnace is characterized in that the furnace body is formed by intersection of a cylinder and a cuboid equal in height, the furnace door is arranged on the wall of the furnace body, the furnace body is divided into a loading zone, a heating zone, a buffering zone and a cooling zone, a hot plate is arranged in the heating zone, a cold plate is arranged in the cooling zone, the impeller is arranged in the furnace body and connected with the rotation control device in a circuit manner, a to-be-soldered electronic component and a solder tray are placed between two blades, a vacuum pipe is connected with the heating zone via a pipeline, and the temperature controller is connected with the hot plate and the cold plate via circuits. The rotation type reflow soldering furnace has the advantages that the rotation type reflow soldering furnace has an independent heating system and an independent cooling system, and can perform non-interfering heating and cooling processes in a vacuum or protective atmosphere, repeated heating and cooling is not needed, and accordingly soldering time can be saved, power consumption is reduced, and working efficiency and soldering quality are improved.