A rotation type 
reflow soldering furnace comprises a furnace body, a furnace door, an 
impeller, a 
rotation control device, a tray, a tray position adjusting device, a 
vacuum pump and a temperature controller. The rotation type 
reflow soldering furnace is characterized in that the furnace body is formed by intersection of a cylinder and a cuboid equal in height, the furnace door is arranged on the wall of the furnace body, the furnace body is divided into a loading zone, a heating zone, a buffering zone and a cooling zone, a 
hot plate is arranged in the heating zone, a 
cold plate is arranged in the cooling zone, the 
impeller is arranged in the furnace body and connected with the 
rotation control device in a circuit manner, a to-be-soldered 
electronic component and a solder tray are placed between two blades, a vacuum 
pipe is connected with the heating zone via a pipeline, and the temperature controller is connected with the 
hot plate and the 
cold plate via circuits. The rotation type 
reflow soldering furnace has the advantages that the rotation type reflow 
soldering furnace has an independent 
heating system and an independent cooling 
system, and can perform non-interfering heating and cooling processes in a vacuum or protective 
atmosphere, repeated heating and cooling is not needed, and accordingly 
soldering time can be saved, 
power consumption is reduced, and working efficiency and 
soldering quality are improved.