A rotation type
reflow soldering furnace comprises a furnace body, a furnace door, an
impeller, a
rotation control device, a tray, a tray position adjusting device, a
vacuum pump and a temperature controller. The rotation type
reflow soldering furnace is characterized in that the furnace body is formed by intersection of a cylinder and a cuboid equal in height, the furnace door is arranged on the wall of the furnace body, the furnace body is divided into a loading zone, a heating zone, a buffering zone and a cooling zone, a
hot plate is arranged in the heating zone, a
cold plate is arranged in the cooling zone, the
impeller is arranged in the furnace body and connected with the
rotation control device in a circuit manner, a to-be-soldered
electronic component and a solder tray are placed between two blades, a vacuum
pipe is connected with the heating zone via a pipeline, and the temperature controller is connected with the
hot plate and the
cold plate via circuits. The rotation type
reflow soldering furnace has the advantages that the rotation type reflow
soldering furnace has an independent
heating system and an independent cooling
system, and can perform non-interfering heating and cooling processes in a vacuum or protective
atmosphere, repeated heating and cooling is not needed, and accordingly
soldering time can be saved,
power consumption is reduced, and working efficiency and
soldering quality are improved.