Ball grid array (BGA) balling single-point repair method

A technology of rework and reballing, which is applied to electrical components, circuits, manufacturing tools, etc. It can solve the problems of low success rate of rework, missing solder balls, damaged devices, etc., so as to improve the pass rate of rework and reduce soldering time , The effect of reducing the influence of device life

Active Publication Date: 2013-08-07
JIANGNAN INST OF COMPUTING TECH
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  • Description
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AI Technical Summary

Problems solved by technology

[0009] However, since the "flux" assumes a liquid state when the temperature rises, it is easy to cause solder balls to move and cause soldering defects such as "missing ball" and "bias".
Moreover, this traditional rework method causes the whole device to be heated once more, and the overall heating will inevitably have a certain impact on the service life of the device. Not high, it will damage the device in severe cases

Method used

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  • Ball grid array (BGA) balling single-point repair method
  • Ball grid array (BGA) balling single-point repair method
  • Ball grid array (BGA) balling single-point repair method

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Embodiment Construction

[0029] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings.

[0030] image 3 A flow chart of a BGA single-point rework method for ball planting according to a preferred embodiment of the present invention is schematically shown.

[0031] Specifically, as image 3 As shown, the BGA ball planting single-point repair method according to a preferred embodiment of the present invention includes:

[0032] The first step S1 : removing the oxide layer and pollutants on the surface of the BGA pad of the drain ball (referred to as the “drain ball pad” in this specification) on the bottom surface 100 of the BGA chip. For example, pollutants include dust.

[0033] Second step S2: Take paste flux and apply it on a single drain ball pad. For example, use a needle to dip a small amount of cream flux into the cream s...

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Abstract

The invention provides a ball grid array (BGA) balling single-point repair method. The BGA balling single-point repair method includes: step one, removing an oxide layer and pollutants on the surface of a ball leaking pad on the bottom surface of a BGA chip; step two, taking paste scaling powder, and spreading the paste scaling powder on the ball leaking pad; step three, placing a solder ball with the diameter matched with that of the pad on the pad coated with the paste scaling powder in the step two; step four, heating the position where the solder ball is placed by using a heat gun in a mode that output air of the heat gun is perpendicular to the bottom surface of the BGA chip; and step five, closing the heat gun after the solder ball is melted, and detecting whether repair is successful after the heat gun is closed.

Description

technical field [0001] The invention relates to semiconductor packaging technology, more specifically, the invention relates to a single-point rework method for BGA ball planting. Background technique [0002] Ball Grid Array (BGABall Grid Array) is a packaging method for integrated circuits. The ball grid array has the advantages of good coplanarity, large number of I / Os, high assembly density, good electrical and thermal properties, and self-calibration function during soldering, and is more and more widely used. [0003] Such as figure 1 As shown, arrayed solder balls 10 are arranged on the bottom surface 100 of the BGA chip, and individual solder balls may be missing during ball planting, transportation and storage. figure 2 It is a schematic diagram schematically showing the phenomenon of "missing balls" in the arrayed solder balls arranged on the bottom surface of the BGA chip. Such as figure 2 As shown, the position of the pad 20 lacks the solder ball that shoul...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/012B23K1/20H01L21/60
Inventor 张涛吴小龙孙忠新高锋刘晓阳王彦桥梁少文
Owner JIANGNAN INST OF COMPUTING TECH
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