Equipment and method for efficiently welding chips of double-interface intelligent cards

Abstract

The invention discloses equipment and a method for efficiently welding chips of double-interface intelligent cards. The equipment for efficiently welding the chips comprises a card transfer mechanism, a chip transportation mechanism, chip turnover mechanisms, an antenna correcting device, welding devices and a turntable. The card transfer mechanism is used for transferring each to-be-welded card to a card access station and fetching each welded card from the card access station, the chip transportation mechanism is used for transporting each chip to the card access station, the chip turnover mechanisms are used for turning the chips in horizontal states so that the chips can be in vertical states, the antenna correcting device is used for correcting the perpendicularity of the ends of each antenna, the welding devices are used for welding the ends of the antennas at corresponding welding spots of the chips, the turntable has an intermittent precision stopping function, a plurality of working units which are circumferentially and uniformly distributed are arranged on the turntable, and a card positioning mechanism and the corresponding chip turnover mechanism which can intermittently rotate along with the turntable are arranged in each working unit; working stations which are circumferentially and uniformly distributed are fixedly arranged at the outer periphery of the turntable, and the quantity of the working stations is identical to that of the working units. The equipment and the method have the advantages of high welding efficiency, good welding quality, convenience in use and maintenance and the like.

Description

technical field [0001] The invention relates to smart card production equipment and methods, in particular to a dual-interface smart card chip welding equipment and welding method. Background technique [0002] In the production process of the dual-interface smart card, the two ends of the embedded antenna in the card (that is, the antenna described in the present invention) are led out to conduct welding with the corresponding solder joints of the chip, and then the chip is installed and fixed in the dug groove , which can form a dual-interface card that can read and write chips in both contact and non-contact ways, which is one of the mainstream methods in the card making industry at present. Welding the two ends of the lead-out antenna to the corresponding solder joints of the chip is the most difficult and highest quality link. The main process of soldering is: 1. Before soldering, mill off the corresponding positions of the two ends of the antenna that need to be solde...

AI Technical Summary

Problems solved by technology

[0004] 1. When the card arrives at the welding station, it is necessary to complete the card positioning, wire clamping and chip transfer (auxiliary time) before welding (welding time). The welding time of each card is equal to the auxiliary time, welding time and card transportation The sum of time, long welding hours and low production efficiency

[0005] 2. The card conveying is usually driven by the timing belt and the shifting teeth. When the card reaches the welding station, if the card is not positioned first, because the timing belt is tough, the positioning accuracy is not high, and the phenomenon of welding position deviation is prone to occur. It is easy to produce waste products and affect product quality

[0006] 3. Since the welding device and the antenna clamping device are both arranged at the welding station, the space between them is small, so it is troublesome to clean the clamping jaws of the antenna clamping device and the welding head of the welding device, and the equipment needs to be stopped. It can only be carried out when it is down, which will affect the production efficiency

Especially for the welding head of the welding device, after working for a period of time, an oxide layer will form on the surface of the welding head. If it is not cleaned in time, it will affect the heat transfer of the welding head, thereby affecting the welding quality, resulting in virtual welding and desoldering. At this time, it must be timely Stop the machine for cleaning, or re-set the parameters of the welding equipment, prolong the welding time, and affect the production; especially, when it is found that the welding quality is affected by the excessive thickness of the oxide layer, there have been problems in the welding of some cards, which makes this part of the cards scrapped

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