Rotation type reflow soldering furnace and soldering method thereof

Abstract

A rotation type reflow soldering furnace comprises a furnace body, a furnace door, an impeller, a rotation control device, a tray, a tray position adjusting device, a vacuum pump and a temperature controller. The rotation type reflow soldering furnace is characterized in that the furnace body is formed by intersection of a cylinder and a cuboid equal in height, the furnace door is arranged on the wall of the furnace body, the furnace body is divided into a loading zone, a heating zone, a buffering zone and a cooling zone, a hot plate is arranged in the heating zone, a cold plate is arranged in the cooling zone, the impeller is arranged in the furnace body and connected with the rotation control device in a circuit manner, a to-be-soldered electronic component and a solder tray are placed between two blades, a vacuum pipe is connected with the heating zone via a pipeline, and the temperature controller is connected with the hot plate and the cold plate via circuits. The rotation type reflow soldering furnace has the advantages that the rotation type reflow soldering furnace has an independent heating system and an independent cooling system, and can perform non-interfering heating and cooling processes in a vacuum or protective atmosphere, repeated heating and cooling is not needed, and accordingly soldering time can be saved, power consumption is reduced, and working efficiency and soldering quality are improved.

Description

technical field [0001] The invention relates to a welding equipment and method, in particular to a reflow welding furnace and a welding method thereof. Background technique [0002] As electronic component packages shrink in size and power levels increase, the need for void-free soldering arises. Since soldering in a low-oxygen or oxygen-free environment can reduce the generation of voids in the soldering process and improve the quality of welding, it is accordingly desirable to enable the reflow soldering process to be performed in a low-oxygen or oxygen-free environment. However, most of the current reflow soldering furnaces are soldered in an atmospheric environment, the generation of voids cannot be controlled, and the soldering quality is not high. [0003] In addition, for the small reflow soldering furnaces in the prior art, the whole process of reflow soldering is generally realized in one cavity space. Each soldering job needs to be heated from room temperature to...

AI Technical Summary

Problems solved by technology

But the heating zone and the cooling zone are connected, and the hot and cold air will interact or mix, which will have an adverse effect on the originally desired hot or cold environment.

This also affects the heating and cooling temperature field and causes a certain energy loss

[0004] Therefore, for the current vacuum reflow soldering furnaces with existing structures, since most of them use radiation for heat transfer, their convective heat transfer is not strong or there is no convective heat transfer, and there are disadvantages of slow heat transfer and low efficiency of radiation heating.

Moreover, these structures are difficult to reflow soldering in vacuum or protective atmosphere, because the loading and unloading of the welded parts in the assembly line welding cannot ensure that the welding equipment forms a vacuum environment and a protective atmosphere environment.

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