Low silver-copper alloy board for thin slab continuous casting crystallizer and manufacturing method thereof

A thin slab continuous casting and silver-copper alloy technology, which is applied in the field of non-ferrous metal processing, can solve the problems of easy fatigue deformation, rising surface temperature of crystallizer copper plate, small cross-section, etc., and achieve the effect of improving comprehensive performance

Active Publication Date: 2011-03-09
HENAN TONGYU METALLURGY MATERIALS GRP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Compared with traditional slab continuous casting, thin slab continuous casting has small cross-section, fast solidification, high casting speed, and large amount of liquid steel injected into the mold per unit time, which makes the surface temperature of the copper plate in the mold rise quickly. It bears a large heat transfer intensity, so at present, copper alloys with better thermal conductivity containing 0.07-0.12% silver by weight and 0.004-0.015% phosphorus by

Method used

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  • Low silver-copper alloy board for thin slab continuous casting crystallizer and manufacturing method thereof
  • Low silver-copper alloy board for thin slab continuous casting crystallizer and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] CuAgMoLaBeSiB alloy is smelted with the following raw materials: high-purity electrolytic copper, No. 1 pure silver, copper-4% molybdenum master alloy, copper-5% lanthanum master alloy, copper-4% beryllium master alloy, copper-5% boron master alloy, crystallization silicon. The alloy composition is shown in Example 1 of Table 1.

[0020] (1).Vacuum melting and casting: use 5 tons of vacuum induction melting furnace for melting. The electrolytic copper is put into the graphite crucible, and the crystalline silicon, pure silver, copper-molybdenum master alloy, copper-beryllium master alloy, copper-lanthanum master alloy and copper-boron master alloy are put into the alloy silo according to the order of feeding. Melt under a vacuum of 20Pa. After melting, the molten copper at 1170°C is refined under a vacuum of 5Pa for 35 minutes. The temperature of copper water reaches 1250°C. Argon is poured into the vacuum furnace to 3000Pa, and crystalline silicon is added under an ar...

Embodiment 2

[0032] CuAgZrNbYBMgBe alloy is smelted with the following raw materials: high-purity electrolytic copper, No. 1 pure silver, zirconium sponge, magnesium metal, copper-4% niobium master alloy, copper-5% yttrium master alloy, copper-5% boron master alloy, copper- 4% beryllium master alloy. The alloy composition is shown in Table 1, Example 2.

[0033] (1) Vacuum melting and casting: Melting is carried out in a 5-ton vacuum induction melting furnace. Put the electrolytic copper into the graphite crucible, and put the metal magnesium, pure silver, copper-4% niobium master alloy, copper-4% beryllium master alloy, sponge zirconium, copper-5% yttrium master alloy, copper-5% boron according to the feeding order The intermediate alloy is loaded into the alloy silo. Melting under a vacuum of 15Pa, after melting, the molten copper reaching 1140°C is refined under a vacuum of 10Pa for 40 minutes, the temperature of copper water reaches 1260°C, and argon is poured into the vacuum furnace...

Embodiment 3

[0045] CuAgTiNbCeMgLi alloy is smelted with the following raw materials: high-purity electrolytic copper, No. 1 pure silver, titanium sponge, magnesium metal, copper-4% niobium master alloy, copper-5% cerium master alloy, copper-6% lithium master alloy. The alloy composition is shown in Table 1, Example 3.

[0046] (1) Vacuum melting and casting: a 5-ton vacuum induction melting furnace is used for melting and casting. First put the electrolytic copper into the graphite crucible, and put the copper-lithium master alloy, pure silver, copper-niobium master alloy, sponge titanium, metal magnesium, and copper-cerium master alloy into the alloy silo according to the order of feeding. Melting under a vacuum of 18Pa, after melting, the molten copper reaching 1160°C is refined under a vacuum of 2Pa for 30 minutes, the temperature of copper water reaches 1270°C, and argon is poured into the vacuum furnace to 2100Pa, and copper is added under an argon atmosphere — Pre-deoxidation melti...

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Abstract

The invention concretely provides a low silver-copper alloy board for a thin slab continuous casting crystallizer and a manufacturing method thereof. The low silver-copper alloy board comprises the following chemical components in percentage by weight: 0.08-0.12% of Ag, 0.008-0.11% of one or more of Mo, Ti, Nb and Zr, 0.01-0.08% of one or more of Y, La, Ce and RE (mixed rare earth), 0.005-0.09% of one or more of Mg, Be, Si, B and Li and the balance of Cu. After a trace amount of silver is added into copper and a trace amount of one or more of Mo, Ti, Nb and Zr is added into the copper simultaneously, very small influence is generated on electrical conductivity and thermal conductivity of the alloy, the oxidation resistance and the corrosion resistance of the alloy are improved, the strength of the alloy is increased, and the alloy becomes more tough, heat-resistant and wear-resistant.

Description

technical field [0001] The invention belongs to the technical field of nonferrous metal processing, in particular to a low-silver copper alloy sheet material for a thin slab continuous casting crystallizer and a manufacturing method thereof. technical background [0002] With the adoption of high-efficiency continuous casting technology (CSP, FTSC, ASP, etc.), continuous casting equipment is constantly developing towards high casting speed, and the design casting speed of thin slab continuous casting machine has reached 6.0m / min. Compared with traditional slab continuous casting, thin slab continuous casting has small cross-section, fast solidification, high casting speed, and large amount of liquid steel injected into the mold per unit time, which makes the surface temperature of the copper plate in the mold rise quickly. It bears a large heat transfer intensity, so at present, copper alloys with better thermal conductivity containing 0.07-0.12% silver by weight and 0.004-0...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C1/03B22D11/04
Inventor 王庆来陈守杰金玉宇
Owner HENAN TONGYU METALLURGY MATERIALS GRP
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