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Clean-free solder paste low in ICT (in circuit testing) false positive rate

A technology with no-clean solder paste and false positive rate. It is used in welding media, welding/cutting media/materials, metal processing equipment, etc. It can solve the problem of high viscosity, deterioration of probe piercing residual contact solder metal performance, and impact on electronic assembly. Manufacturing industry production efficiency and other issues to achieve the effect of improving durability and avoiding test misjudgments

Inactive Publication Date: 2015-03-18
EUNOW ELECTRONICS TECH CO LTD SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the one hand, it will cause the ICT test probe to not easily pierce the residue and cause misjudgment due to the lack of contact with the solder metal; on the other hand, due to the high viscosity of the rosin residue, it will adhere to the ICT probe, especially for multi-claw crowns. The shape of the probe will worsen the performance of the probe piercing the residual solder metal, causing more ICT test misjudgments and seriously affecting the production efficiency of the electronic assembly manufacturing industry.

Method used

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  • Clean-free solder paste low in ICT (in circuit testing) false positive rate
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  • Clean-free solder paste low in ICT (in circuit testing) false positive rate

Examples

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Embodiment 1

[0032]

Embodiment 2

[0034]

[0035] Table 3 (comparative example)

[0036]

[0037] Can find out from the formula design of above embodiment 1 and embodiment 2 and comparative example:

[0038] ① As the part of rosin that imparts adhesive properties to the solder paste and prevents the re-oxidation of the PCB, the flux formulations of Examples 1 and 2 use fully hydrogenated rosin and / or polymerized rosin with a softening point lower than 110°C, while the traditional rosin in the comparative example The solder paste flux formula uses most of the high softening point acrylic modified rosin and a small part of low softening point hydrogenated rosin. The rosin system with low softening point endows the solder paste of the present invention in the reflow preheating process, and its flux has good flow characteristics; and in terms of rosin content, the rosin content of the flux formulations in Example 1 and Example 2 is 28% respectively And 25%, while the rosin content of the traditional formula...

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Abstract

The invention discloses clean-free solder paste low in ICT false positive rate. The clean-free solder paste low in ICT false positive rate comprises, by weight, 80%-91% of solder alloy powder and 9%-20% of flux. The key is that the flux is composed, by weight, of 10%-35% of rosin of the softening point below 110 DEG C, 40%-60% of composite solvent, 3%-10% of thixotropic agent of the melting point below 140 DEG C, 5%-15% of composition activator and 0.2%-1.5% of nonionic surface active agent. The solder alloy is a stannum-silver-copper alloy, a stannum-silver alloy, a stannum-copper alloy, a stannum-bismuth-copper alloy, a stannum-zinc alloy, a stannum-zinc-bismuth alloy, a stannum-plumbum alloy or a stannum-plumbum-silver alloy.

Description

Technical field: [0001] The invention relates to a no-clean solder paste used in the field of soldering materials for electronic assembly, in particular to a no-clean solder paste with a low misjudgment rate in ICT testing. Background technique: [0002] Surface mount technology --- SMT (Surface Mounting Technology), is currently the most popular technology and process in the electronic assembly industry. It is to realize the development of electronic products to high integration, high reliability, high precision and low cost. one of the key technologies. Among the many technologies involved in SMT, welding technology is the core technology of SMT. With the application of reflow soldering technology, solder paste has become the most important process material in SMT. Solder paste is a paste-like assembly material that uniformly stirs solder alloy powder into flux. It is sprayed onto the PCB pad by stencil printing or syringe, and enters the reflow furnace to realize solde...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/26
CPCB23K35/362B23K35/262
Inventor 罗登俊陈钦徐华侨廖永丰张义宾胡文学武新磊
Owner EUNOW ELECTRONICS TECH CO LTD SUZHOU
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