High-strength high-conductivity oxidation-resisting low-silver copper-base alloy and preparation thereof

A silver-copper alloy powder, anti-oxidation technology, applied in the direction of metal/alloy conductors, etc., can solve the problems of comprehensive performance that cannot meet special requirements, low strength, hardness and softening temperature, and accelerated oxidation, so as to improve anti-oxidation ability, cold Effects of improved hot workability and increased densification

Inactive Publication Date: 2007-10-17
INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the strength, hardness and softening temperature are too low, its comprehensive performance can no longer meet the special requirements of the development of science and technology for materials.
[0003] Also as a good conductor, the conductive copper alloy conductive working state is sometimes in low, medium and high temperature oxidizing atmosphere. The commonly used conductive copper, due to oxidation, the thickness of the oxide film on the contact surface of the conductive parts and the potential drop across the oxide film continue to increase. Larger, thicker oxide film will further increase the contact resistance, the temperature rise of the conductive parts will further increase, and the oxidation will continue to accelerate. When it reaches a certain critical value, it will cause failure

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031]Gas-atomized copper alloy powder containing 0.1% Ag and 0.2RE (mixed rare earth) (through 150 mesh sieve), mixed with 0.5% diamond and 0.08% graphitized nano-carbon fiber (copper-coated surface) in a high-energy ball mill, the ball The material ratio is 8:1, vacuumize, protect with argon, and ball mill for 3 hours; the prepared low-silver-copper mixed powder is placed in a graphite mold with an inner diameter of 100 mm, and placed in a vacuum hot-press furnace, and the high-temperature vacuum reaches 0.09Pa, heat up to 500°C for annealing for 1 hour, heat up to 820°C, hot-press until dense, hold the pressure for 20 minutes, remove the pressure, feed argon to 350Pa, heat up to 880°C, sinter for 2 hours, when cooled to At 750°C, put it into an extruder with an extrusion ratio of 20:1; test the oxidation, strength and electrical conductivity of the extruded wire;

[0032] As a comparative example, Cu+1.0% diamond, Cu+0.2% RE, Cu+0.2% RE+1.0% diamond, Cu+0.1% Ag+0.2% RE+0.5%...

Embodiment 2

[0035] Using copper alloy powder containing 0.1% Ag, 0.3% Y and 1.3% Al, prepared by water atomization, low-silver copper alloy powder (through 150 mesh sieve), hydrogen reduction at 450 ° C, and 0.8% diamond and 0.08% graphite Vacuumize nano-carbon fibers (surface copper-plated) in a three-dimensional powder mixing machine, pass through argon protection, and mix for 30 minutes; the prepared low-silver copper mixed powder is placed in a graphite mold with an inner diameter of 100mm, and placed in a vacuum hot press In the furnace, the high-temperature vacuum can reach 0.5Pa, heat up to 770°C, hot-press until dense, hold the pressure for 20 minutes, remove the pressure, feed argon to 350Pa, heat up to 850°C, sinter for 2 hours, when cooled to At 770°C, repeat hot pressing, then heat up to 850°C for sintering for 2 hours. When the temperature drops to 730°C, put it into an extruder with an extrusion ratio of 15:1 and extrude it into a plate. After 20% cold rolling , annealing, c...

Embodiment 3

[0037] Copper added

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PUM

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Abstract

A copper base alloy, which possesses high-strength, high conductivity, oxidation resistance and contains silver of low content, is characterized in that said high-strength high-conductivity oxidation-resistance low-silver copper base alloy is composed of low-silver copper base alloy powder, diamond powder of 0.2-1.0% and graphitized nanometer carbon fibre and is prepared through a powder metallurgy technological process, wherein said low-silver copper base alloy powder contains Ag of 0.08 -0.12%, Y, La and Ce of 0.05 -0.5% or one of misch metal or mixture of several misch metal. Said alloy in accordance with the present invention possesses higher intensity and hardness, stronger anti-crackle forming and stomatic expandability, and exhibits definite puddle welding resistance and better electroconductive performances at the same time.

Description

technical field [0001] The invention relates to a copper-based conductive material formula and a preparation process. Background technique [0002] The most notable feature of oxygen-free copper is that its electrical conductivity IACS>100 is an ideal conductive material and instrument material. Because the strength, hardness and softening temperature are too low, its comprehensive performance can no longer meet the special requirements for materials with the increasing development of science and technology. [0003] Also as a good conductor, the conductive copper alloy conductive working state is sometimes in low, medium and high temperature oxidizing atmosphere. The commonly used conductive copper, due to oxidation, the thickness of the oxide film on the contact surface of the conductive parts and the potential drop across the oxide film continue to increase. Large, thickened oxide film will further increase the contact resistance, the temperature rise of the conductiv...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C45/00C22C1/05B22F9/04B22F3/14C22F1/08H01B1/02
Inventor 李洪锡
Owner INST OF METAL RESEARCH - CHINESE ACAD OF SCI
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