High-strength high-conductivity oxidation-resisting low-silver copper-base alloy and preparation thereof
A silver-copper alloy powder, anti-oxidation technology, applied in the direction of metal/alloy conductors, etc., can solve the problems of comprehensive performance that cannot meet special requirements, low strength, hardness and softening temperature, and accelerated oxidation, so as to improve anti-oxidation ability, cold Effects of improved hot workability and increased densification
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0031]Gas-atomized copper alloy powder containing 0.1% Ag and 0.2RE (mixed rare earth) (through 150 mesh sieve), mixed with 0.5% diamond and 0.08% graphitized nano-carbon fiber (copper-coated surface) in a high-energy ball mill, the ball The material ratio is 8:1, vacuumize, protect with argon, and ball mill for 3 hours; the prepared low-silver-copper mixed powder is placed in a graphite mold with an inner diameter of 100 mm, and placed in a vacuum hot-press furnace, and the high-temperature vacuum reaches 0.09Pa, heat up to 500°C for annealing for 1 hour, heat up to 820°C, hot-press until dense, hold the pressure for 20 minutes, remove the pressure, feed argon to 350Pa, heat up to 880°C, sinter for 2 hours, when cooled to At 750°C, put it into an extruder with an extrusion ratio of 20:1; test the oxidation, strength and electrical conductivity of the extruded wire;
[0032] As a comparative example, Cu+1.0% diamond, Cu+0.2% RE, Cu+0.2% RE+1.0% diamond, Cu+0.1% Ag+0.2% RE+0.5%...
Embodiment 2
[0035] Using copper alloy powder containing 0.1% Ag, 0.3% Y and 1.3% Al, prepared by water atomization, low-silver copper alloy powder (through 150 mesh sieve), hydrogen reduction at 450 ° C, and 0.8% diamond and 0.08% graphite Vacuumize nano-carbon fibers (surface copper-plated) in a three-dimensional powder mixing machine, pass through argon protection, and mix for 30 minutes; the prepared low-silver copper mixed powder is placed in a graphite mold with an inner diameter of 100mm, and placed in a vacuum hot press In the furnace, the high-temperature vacuum can reach 0.5Pa, heat up to 770°C, hot-press until dense, hold the pressure for 20 minutes, remove the pressure, feed argon to 350Pa, heat up to 850°C, sinter for 2 hours, when cooled to At 770°C, repeat hot pressing, then heat up to 850°C for sintering for 2 hours. When the temperature drops to 730°C, put it into an extruder with an extrusion ratio of 15:1 and extrude it into a plate. After 20% cold rolling , annealing, c...
Embodiment 3
[0037] Copper added
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com