45results about How to "No bridging" patented technology

A semiconductor package is provided, which includes a substrate unit having conductive pads and ESD protection pads formed on a bottom surface thereof; an encapsulant covering a top surface of the substrate unit; and a metal layer disposed on a top surface of the encapsulant and having connecting extensions formed on side surfaces of the substrate unit and the encapsulant for electrically connecting the ESD protection pads, wherein portions of the side surfaces of the substrate unit corresponding in position to the conductive pads are exposed from the metal layer so as to ensure that solder bumps subsequently formed to connect the conductive pads of the semiconductor package to a circuit board are not in contact with the metal layer, thereby effectively avoiding the risk of short circuits.

The invention discloses a cornered aluminum profile extruding die which comprises an upper die body and a lower die body. The upper die body comprises a die core. The lower die body comprises a welding chamber attached to the outer contour of a cornered aluminum profile. The upper die body and the lower die body are assembled together. A working zone used for forming the cornered aluminum profile is formed between the die core of the upper die body and the welding chamber of the lower die body. The portion, on the periphery of the die core, of the upper die body is provided with four dividing holes corresponding to the four edges of the cornered aluminum profile. A dividing bridge is arranged between every two adjacent dividing holes. The dividing holes are of a parallel inclined structure. The dividing holes are partially overlapped with the die core in the vertical direction. The overlapped area S5 of the dividing holes corresponding to the adjacent arc edge of the cornered aluminum profile and the die core is smaller than or equal to 1.5 times the overlapped area S6 of the dividing holes corresponding to the straight edges and the die core. According to the cornered aluminum profile extruding die, the die strength is greatly improved, die machining is simplified and facilitated, the production cost is greatly reduced, the phenomenon that bridge fracture occurs soon after the die is placed on a machine is avoided, the service life of the die is greatly prolonged.

The invention provides electrocondution slurry for a solar cell and a manufacturing method of the electrocondution slurry. The electrocondution slurry comprises electrocondution metal powder, inorganic glass powder and an organic carrier. D50 of the inorganic glass powder is 100-300nm, D10 of the inorganic glass powder is 10-70nm, and D90 of the inorganic glass powder is 400-700nm. The inorganic glass powder is manufactured through a sol-gel method, glass powder with a particle size smaller than 1 micron is obtained accidentally, the size distribution of the glass powder is even, and meanwhile doping is even. The manufactured electrocondution slurry is free of a cross phenomenon in the process that the solar cell is manufactured and sintered, the adhesive force of the electrocondution slurry and a silicon layer and the welding strength of the electrocondution slurry and a welding belt are greatly improved, and sintering temperature is low.

The method comprises: providing a substrate on which a polycrystalline silicon layer has been already formed; forming a mask layer on the polycrystalline silicon layer; forming the spacer on the sidewall of the mask layer; using the mask layer having the spacer as the mask to remove a portion of polycrystalline silicon layer so as to expose the substrate; forming a insulating layer on the substrate filling out the opening, and the insulating layer and the mask layer has different etching selection; removing the mask layer to exposed the polycrystalline silicon layer; forming a metal silicides layer on the surface of the polycrystalline silicon layer.

The invention is an electron industry solder paste made up of alloy solder powder and solder agent. The weight percentage of alloy solder powder is 85-94%^, the weight percentage of solder agent is 6-15%. The solder agent includes resin, solvent, fluid deformation regulator, activator, stabilizer, the content of resin accounts for 40-60% of solder agent, the content of solvent is 30-50% of solder agent weight, the content of fluid deformation regulator is 1-10%, and the content of activator is 0.2-15% of the solder agent, the content of stabilizer is 0.01-10% of solder agent. In order to upgrade the humidity of the solder paste, the activator uses fluorin carboxylic acid or organic compound containing fluorin carboxylic acid ester. In order to upgrade the stability of the solder paste, the stabilizer uses trophy arene compound. Additionally, the solder agent also can be added in fluorin surface activator, in order to upgrade the stability of the solder paste.