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Sn0.3Ag0.7Cu lead-free solder paste and preparation method thereof

A technology of lead solder paste and solder, which is applied in the field of preparation of the above-mentioned Sn0.3Ag0.7Cu lead-free solder paste, can solve the problems of excessive solder paste residue, poor film-forming property, and insufficient viscosity, etc., and achieve chemical protection against moisture and contact Excellent denaturation and good printing performance

Inactive Publication Date: 2015-07-22
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a Sn0.3Ag0.7Cu lead-free solder paste, which solves the problems of insufficient viscosity and low activity of the existing solder paste due to the reduction of rosin content, and the problem that there are many solder paste residues but poor film-forming properties. question

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Step 1, weigh 10% flux and 90% respectively according to mass percentage 3 # Sn0.3Ag0.7Cu alloy powder, wherein the soldering flux weighs 23% KE-604 rosin, 20% rosin pentaerythritol ester, 17% adipic acid, 5% hydrogenated castor oil, 2% triethanolamine, 33% four Hydrogen furfuryl alcohol;

[0045] Step 2, add tetrahydrofurfuryl alcohol into the reaction kettle, add rosin pentaerythritol ester at the same time, heat to 75°C, and stir at constant temperature until the solution is uniform and transparent;

[0046] Step 3, cool down the solution obtained in step 2 to 65°C, add KE-604 rosin and adipic acid, and stir until the solution is uniform and transparent;

[0047] Step 4, cool down the solution obtained in step 3 to 55°C, add hydrogenated castor oil, and stir until the solution is uniform and transparent;

[0048] Step 5, stop heating the solution obtained in step 4, add triethanolamine, and continue to stir for 15 minutes after it is cooled to room temperature to o...

Embodiment 2

[0051] Step 1, weigh 11% soldering flux and 89% 4 respectively according to mass percentage #Sn0.3Ag0.7Cu alloy powder, in which the soldering flux weighs 25% KE-604 rosin, 18% rosin pentaerythritol ester, 15% sebacic acid, 10% hydrogenated castor oil, 1% triethanolamine, 31% four Hydrogen furfuryl alcohol;

[0052] Step 2, add tetrahydrofurfuryl alcohol into the reaction kettle, add rosin pentaerythritol ester at the same time, heat to 75°C, and stir at constant temperature until the solution is uniform and transparent;

[0053] Step 3, cool down the solution obtained in step 2 to 65°C, add KE-604 rosin and sebacic acid, and stir until the solution is uniform and transparent;

[0054] Step 4, cool down the solution obtained in step 3 to 55°C, add hydrogenated castor oil, and stir until the solution is uniform and transparent;

[0055] Step 5, stop heating the solution obtained in step 4, add triethanolamine, and continue to stir for 15 minutes after it is cooled to room tem...

Embodiment 3

[0058] Step 1, weigh 9% soldering flux and 91% 3 respectively according to mass percentage # Sn0.3Ag0.7Cu alloy powder, in which flux weighs 20% KE-604 rosin, 15% rosin pentaerythritol ester, 20% azelaic acid and sebacic acid with a mass ratio of 1:1, 6% hard Lipid amide, 3% triethanolamine, 36% tetrahydrofurfuryl alcohol;

[0059] Step 2, add tetrahydrofurfuryl alcohol into the reaction kettle, add rosin pentaerythritol ester at the same time, heat to 75°C, and stir at constant temperature until the solution is uniform and transparent;

[0060] Step 3, cool down the solution obtained in step 2 to 65°C, add KE-604 rosin, azelaic acid and sebacic acid, and stir until the solution is uniform and transparent;

[0061] Step 4, cool down the solution obtained in step 3 to 55°C, add hydrogenated castor oil, and stir until the solution is uniform and transparent;

[0062] Step 5, stop heating the solution obtained in step 4, add triethanolamine, and continue to stir for 15 minutes ...

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PUM

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Abstract

The invention discloses Sn0.3Ag0.7Cu lead-free solder paste. The Sn0.3Ag0.7Cu lead-free solder paste particularly comprises, by mass, 9-11% of scaling powder and 89-91% of soldering tin powder. The scaling powder comprises, by mass, 20-25% of rosin, 15-20% of film-forming agent, 15-20% of active agent, 5-10% of thixotropic agent, 1-3% of acidity regulator and the balance solvent. The invention further discloses a preparation method of the Sn0.3Ag0.7Cu lead-free solder paste. The method comprises the steps that the solvent and the film-forming agent are stirred at 75 DEG C to be transparent, and the mixture is cooled to be at the temperature of 65 DEG C, added with the film-forming agent, cooled to be at the temperature of 55 DEG C and added with the active agent to be stirred to be transparent; the mixture is cooled to be at 55 DEG C and added with the thixotropic agent to be stirred to be transparent; the mixture is cooled to be at normal temperature and added with the acidity regulator to be stirred for 15 min, and then the mixture and solder powder are mixed and stirred to obtain the Sn0.3Ag0.7Cu lead-free solder paste. The solder paste is good in printing technology and welding performance, residues left after welding evenly cover the surface welding spots, and the effects of electrical insulation, welding spot protection and the like are achieved.

Description

technical field [0001] The invention belongs to the technical field of surface mounting of electronic circuits, and relates to a Sn0.3Ag0.7Cu lead-free solder paste, and also relates to a preparation method of the above-mentioned Sn0.3Ag0.7Cu lead-free solder paste. Background technique [0002] The miniaturization of electronic products makes surface mount technology (SMT) occupy a dominant position in the assembly process of electronic components. In surface mount technology, solder paste, as a key connection material, directly affects the reliability of electronic interconnection. High-quality solder paste products should have good printing processability, soldering reliability, and storage stability. In addition, it is also required that the solder paste has less residue after soldering, is non-corrosive, and the residue is light in color, soft in quality, and has a protective effect on solder joints. [0003] Rosin can greatly promote the soldering performance of sold...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/363
CPCB23K35/262B23K35/362
Inventor 赵麦群韩帅宋娜
Owner XIAN UNIV OF TECH
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