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829results about How to "Avoid short circuit problems" patented technology

Bipolar plate capable of doing work on double surfaces and high-energy battery thereof

The invention relates to a bipolar battery used for an electric vehicle, in particular to a bipolar plate lead-acid battery, which solves the problems that battery cells of the traditional bipolar battery cannot be sealed and the bipolar plate does work on a single surface. In the invention, a hydrophobic material is utilized as a substrate, a conductive needle is embedded in the substrate, blanket film layers are added on two surfaces of the substrate, a positive and negative active substance layers are respectively coated outside the blanket film layers to form a bipolar plate, a common air chamber is arranged in the bipolar battery formed by the bipolar plate and provided with a pressure reducing valve. The structure ensures that the battery does not has short circuit and can still work normally when the battery cells in the battery are not in a sealed state, thereby paving a way for commercial application of the bipolar battery; moreover, because the bipolar plate in the battery does work on double surfaces, the bipolar battery capacity is improved by more than 30%, the gravimetric specific energy of the bipolar plate lead-acid battery can exceed 80Wh/kg which approaches to the level of a lithium battery but the cost of the bipolar plate lead-acid battery is less than one quarter of that of a lithium battery; and the bipolar battery can work when the internal pressure of the battery is below 30kPa, and is sealed and environmentally-friendly in use. The invention provides the bipolar plate capable of doing work on double surfaces and a high energy battery thereof.
Owner:夏振明

Display panel, manufacturing method and display device thereof

The invention discloses a display panel, and a manufacturing method and a display device thereof. By the adoption of the rendering technology, the pixel structure formed by multiple sub-pixels arranged closely is arranged in the display panel. The sub-pixels in each line are arranged in an aligned mode, all the sub-pixels in every two adjacent lines are staggered by the positions of X sub-pixels in the line direction, 0 is smaller than 1t, X is larger than 1t, and each sub-pixel and the adjacent sub-pixel are different in color. On this basis, the gaps among all the sub-pixels are utilized for setting touch signal lines on layers different from a data line, the touch signal lines are specifically arranged between a pixel electrode and a public electrode layer, and in this way, the touch signal lines are connected with the public electrode layer reused to serve as the touch detecting electrode. The touch signal lines and the data line are arranged on the different layers, the aperture rate will not be occupied, and the lighting effect environmental difference caused by the touch signal lines arranged between the sub-pixels is avoided. Moreover, as the data line and the touch signal lines are located on the different layers, short circuit between the data line and the touch signal lines can be avoided.
Owner:BOE TECH GRP CO LTD +1

Heat recovery steam generator flue gas denitration apparatus

The invention discloses a heat recovery steam generator flue gas denitration apparatus, which belongs to the industrial tail gas purification equipment field. The apparatus comprises an evaporator provided in the heat recovery steam generator, a multistage heating surface is provided along a flue gas flow channel, the temperature is gradually reduced along the flue gas direction, the apparatus also comprises a denitration reactor, a reducing agent injection system and a preparation system for providing a reducing agent to the reducing agent injection system, a catalyst is provided in the reactor, the denitration reactor is arranged between adjacent two stages heating surfaces of the evaporator, the temperature in two stages heating surfaces is the optimum reaction temperature for catalyst denitration, the reducing agent injection system uniformly injects the reducing agent through the section of the flue gas flow channel, and is arranged on the upstream of the denitration reactor along the flue gas flow direction and possesses several stages heating surfaces to the denitration reactor. According to the invention, the problem of NOx discharge in flue gas of a gas turbine combined cycle unit and an industrial exhaust-heat boiler can be solved, and the SCR denitration requirements with low dust, low NOx concentration and high denitration efficiency can be solved.
Owner:DONGFANG BOILER GROUP OF DONGFANG ELECTRIC CORP

Array substrate, manufacturing method of array substrate and display device

The invention provides an array substrate, a manufacturing method of the array substrate and a display device. The manufacturing method includes the steps that photoresist is coated to an insulating layer covering a conductive pattern or a semiconductor pattern; exposing is carried out to at least form a photoresist partial reserving area and a photoresist complete removing area; etching is carried out to at least partially remove the portion, corresponding to the photoresist complete removing area, of the insulating layer so as to form a middle hole; etching is carried out again to form a first via hole, a second via hole is formed in the position of the middle hole, and the portions, where the first via hole and the second via hole are formed, of the conductive pattern or the semiconductor pattern are exposed, wherein the depth of the first via hole is smaller than the depth of the second via hole. By means of the array substrate, the manufacturing method of the array substrate and the display device, on the premise that the number of times of composition processes of the array substrate is not increased, the condition that when a shallow hole and a deep hole are etched at the same time, an oxide semiconductor layer and a gate insulating layer at the position of the shallow hole are punctured through etching due to long-time etching, so that a single line and a gate line are in short circuit is avoided.
Owner:HEFEI XINSHENG OPTOELECTRONICS TECH CO LTD +1

Method for treating nickel-containing electroplating wastewater and recovering nickel by electrolysis

InactiveCN101717135AReduce the side reaction of hydrogen electrolysis on the cathode plateStrong acidWater contaminantsWaste water treatment from metallurgical processGraphite electrodeTitanium
The invention discloses a method for treating nickel-containing electroplating wastewater and recovering nickel by electrolysis. The method has the characteristics of simple process, no secondary pollution, high removal rate and recyclable deposited metallic nickel. The nickel-containing electroplating wastewater is subjected to electrolysis treatment by an electrolysis treatment nickel-containing electroplating wastewater device, which comprises an electrolytic bath and an electrolyte stirring apparatus, wherein the anode adopts a titanium-based platinum electrode; the cathode adopts a nickel electrode or a graphite electrode; and a pH meter is arranged in the electrolytic bath. The method for treating the nickel-containing electroplating wastewater by electrolysis comprises the following steps: before the electrolysis treatment, putting the nickel-containing electroplating wastewater serving as an electrolyte into the electrolytic bath, and adding alkali solution into the electrolyte to adjust the pH value of the electroplating wastewater; and adding the aqueous alkali into the electrolyte during the electroplating to adjust the pH value of the electrolyte to between 6.0 to 9.0, and recycling the nickel precipitated from a negative plate by measuring the charge accumulation amount of the electrolyte.
Owner:ZHEJIANG NORMAL UNIVERSITY

High-current USB Type C socket and manufacturing method thereof

The invention relates to a high-current Type C socket, which comprises a metal medium plate, a first terminal group, a second terminal group and an insulating body, wherein the metal medium plate is provided with a main body portion, the first terminal group and the second terminal group are respectively located at the upper side and the lower side of the metal medium plate in a symmetrical manner, and the first terminal group, the second terminal group and the metal medium plate are molded into an integral whole by the insulating body. The first terminal group and the second terminal group respectively comprise two first grounding terminals, two second grounding terminals, a plurality of first signal terminals, two first power supply terminals, a plurality of second signal terminals and two second power supply terminals, wherein the two first grounding terminals and the two second grounding terminals are located at the outmost side, the plurality of first signal terminals and the two first power supply terminals are located between the two first grounding terminals, the plurality of second signal terminals and the two second power supply terminals are located between the two second grounding terminals, the thickness of the first power supply terminals and the second power supply terminals is greater than the thickness of the first signal terminals and the second signal terminals, and the main body portion of the metal medium plate is provided with strip-shaped holes at the positions corresponding to the first power supply terminals and the second power supply terminals. The high-current USB Type C socket can effectively support high-current charging.
Owner:SHENZHEN EVERWIN PRECISION TECH

TFT, TFT array substrate, manufacturing method of TFT array substrate and display device

The embodiment of the invention provides a TFT, a TFT array substrate, a manufacturing method of the TFT array substrate and a display device. The TFT, the TFT array substrate, the manufacturing method of the TFT array substrate and the display device solve the problem that a grid insulation layer is prone to breakdown in terms of the structure of an existing bottom grid type TFT array substrate. A source electrode of the TFT comprises a first source electrode part, a drain electrode of the TFT comprises a first drain electrode part, the first source electrode part, the first drain electrode part and an active layer of the TFT are arranged on the same layer, and the first source electrode part and the first drain electrode part are located on the two sides of the active layer respectively and make direct contact with the active layer respectively. Because the first source electrode part and a grid electrode are not overlapped or very slightly overlapped and the first drain electrode part and the grid electrode are not overlapped or very slightly overlapped, capacitors will not be formed generally, and the phenomenon that the grid insulation layer is subjected to breakdown because the voltage of the source electrode or the voltage of the drain electrode is too large or the number of electrostatic charges gathering on the source/drain electrode is too large is avoided.
Owner:BOE TECH GRP CO LTD

Method for preparing integrated quasi-solid zinc ion battery

The invention relates to a method for preparing an integrated quasi-solid zinc ion battery and relates to the technical field of batteries. The method is characterized by using a hydrogel as a substrate, and embedding the positive electrode material and the negative electrode material of the zinc ion battery in the hydrogel substrate to realize the integrated structure of the battery, thereby avoiding the problems such as interfaces, compatibility and short circuits caused by the layered assembly of the positive electrode, the diaphragm and the negative electrode of a traditional battery. Themethod uses the hydrogel as the gel electrolyte of the zinc ion battery, embeds the flexible zinc negative electrode prepared by electro-deposition, and then chemically polymerizes a polymer materialin situ on the surface of the gel electrolyte as a positive electrode. The integrated quasi-solid zinc ion battery with a customized shape can effectively reduce the interface impedance inside the battery and promotes the rapid transmission of electrolyte ions inside the electrode. The most important thing is that such design can provide more positive electrode material loading area for the battery, which greatly increases the energy density of the battery. The invention is used in the field of batteries.
Owner:HARBIN INST OF TECH

Pressing method for sandwich aluminum-base printed circuit board

The invention discloses a pressing method for a sandwich aluminum-base printed circuit board. The pressing method comprises the following steps of: S1, drilling a through hole in an aluminum substrate and filling the through hole with resin; S2, performing wire drawing treatment on upper and lower surfaces of the aluminum substrate to form wavelike circuits; S3, attaching semi-cured sheets to the upper and lower surfaces of the aluminum substrate and then covering the semi-cured sheets with a copper foil layer; and S4, pressing the aluminum substrate to which the semi-cured sheets are attached and which is covered by the copper foil layers to prepare the sandwich aluminum-base printed circuit board. According to the pressing method, the wire drawing treatment is performed on the upper and lower surfaces of the aluminum substrate to enhance the binding force of the semi-cured sheets and the upper and lower surfaces of the aluminum substrate; temperature and pressure in a pressing process are controlled, so that the surfaces of the entire aluminum substrate can be filled better by the semi-cured sheets; and the resin is filled in the through hole in the aluminum substrate, and an in-hole hole is drilled in the sandwich aluminum-base printed circuit board after pressing, so that connection of lines between the upper and lower copper foils is realized, and the problem of short circuiting due to conduction of an outer layer circuit and the aluminum substrate caused by resin cavitation in the through hole of the aluminum substrate is solved.
Owner:SHENZHEN SUNTAK MULTILAYER PCB +1

Magnetic-coupling resonant wireless power transmission system and method

The invention provides a magnetic-coupling resonant wireless power transmission system and method. The system comprises a transmitting device and a receiving device. The transmitting device comprises a transmitting terminal LC (inductor-capacitor) resonant network, a power supply and a self-resonant control circuit; the power supply charges the transmitting terminal LC resonant network; after the self-resonant control circuit is charged, the power supply is disconnected; the transmitting terminal LC resonant network automatically resonates and oscillates under inherent self-frequency; a resonant coil in the transmitting terminal LC resonant network transmits energy out in a form of electromagnetic wave; the receiving device comprises a receiving terminal LC resonant network and an adaptive regulating circuit; a resonant coil in the receiving terminal LC resonant network senses the electromagnetic wave and generates resonant oscillation; the adaptive regulating circuit allows the receiving terminal LC resonant network and the transmitting terminal LC resonant network to generate magnetic-coupling resonance by regulating the inherent frequency of the receiving terminal LC resonant network. The problems such that in the traditional wireless power transmission scheme, high-frequency control is difficult and adaptability is poor are solved.
Owner:WUHAN TAIKE ELECTRIC

Folding-resistant one-dimensional fibrous flexible energy storage device and preparation method thereof

The invention discloses a folding-resistant one-dimensional fibrous flexible energy storage device and a preparation method thereof. The preparation method comprises the following steps: at least by adopting an electrostatic spinning mode or a 3D printing mode, a first nano-fiber membrane used as a diaphragm on a surface of a first electrode in situ is formed, and the first nano-fiber membrane isused to wrap the first electrode; and the first electrode provided with the diaphragm in a wrapped way is assembled and combined with matched electrolyte and a second electrode to form the flexible energy storage device. According to the invention, the nano-fiber membrane is wrapped on the electrode of the flexible energy storage device in situ by adopting the electrostatic spinning way, the 3D printing way, and so on, so that the structure and the composition height of the membrane are controllable, and the membrane has very strong adsorbability and high flexibility; and especially, after theflexible energy storage device is repeatedly folded, the membrane can still be tightly combined with the electrode, so that the problem of short circuit caused by mutual contact of the electrodes canbe prevented, and the folding resistance and the electrochemical stability of the flexible energy storage device are greatly improved.
Owner:SUZHOU INST OF NANO TECH & NANO BIONICS CHINESE ACEDEMY OF SCI

Etching method of double magnetic tunnel junctions

The present invention relates to an etching method of double magnetic tunnel junctions. The etching method of double magnetic tunnel junctions comprises the following steps: a hard template and a hard template buffer layer with required shapes are prepared through the photolithography at the portion requiring the maintenance of double magnetic tunnel junction stack; etching begins from a top electrode according to the shape of the hard template, etching the portion requiring etching is performed from the top electrode, the top electrode, a first antiferromagnetic layer and a first pinning layer are etched in turn, etching stops when reaching a first tunneling layer, and a first insulation layer is deposited; etching goes on from a free layer to a second tunneling layer and then stops, and a second insulation layer is deposited; and a second pinning layer and a second antiferromagnetic layer are etched until up to a bottom electrode, and finally residual hard template and hard template buffer layer are etched to obtain a final shape. Through adoption of a second insulation layer and a second insulation layer, the problems the short circuit is easy to happen during processing a double magnetic tunnel junctions and the like; and moreover, the double magnetic tunnel junction stack prepared by the etching method provided by the invention is not reliable to the occurrence of a short circuit phenomenon and is able to process and prepare an MRAM on the basis of the double magnetic tunnel junction stack.
Owner:CETHIK GRP

Two-dimensional array ultrasonic transducer based on three-dimensional ultrasonic imaging and preparation method for same

The invention relates to the technical field of three-dimensional ultrasonic imaging and discloses a two-dimensional array ultrasonic transducer based on the three-dimensional ultrasonic imaging and a preparation method for the same. The two-dimensional array ultrasonic transducer comprises an insulated resin frame, an electric-conduction backer board, a piezoelectric plate and a printing circuit board, wherein N*N hollow channels filled with an electric-conduction adhesive are formed in the insulated resin frame; the electric-conduction backer board is disposed on the insulated resin frame; the piezoelectric plate is located on the electric-conduction backer board and comprises N*N piezoelectric array elements; and N*N array row pins which are correspondingly disposed in the N*N hollow channels respectively are disposed on the printing circuit board. By the electric-conduction adhesive, the piezoelectric array elements are electrically connected to the array row pins, so that the problem in complex wiring technologies of the array elements of the two-dimensional ultrasonic transducer is solved, and preparation cost is reduced. Meanwhile, the short-circuited problem happening when an interval between every two piezoelectric array elements is too small during wiring is avoided. In addition, the electric-conduction backer board can absorb useless sound waves on the back face of the piezoelectric plate, so that quality of the two-dimensional array ultrasonic transducer can be improved greatly.
Owner:THE HONG KONG POLYTECHNIC UNIV SHENZHEN RES INST

Insulating polymer based electromagnetic shielding material and preparation method thereof

The invention relates to the technical field of electromagnetic shielding materials, and in particular relates to an insulating polymer based electromagnetic shielding material and a preparation method thereof. The shielding material provided by the invention is of a multi-layer structure with five to seven layers, wherein the middle layer is a reflecting type shielding layer; a secondary outer layer consists of one or two wave-absorbing type shielding layers; the outermost layers are insulating layers. The wave-absorbing type shielding layers are in special functional distribution by controlling the thickness of each functional layer and filling different conductive filling materials into different layers with the combination of the curtain coating layering of the wave-absorbing type shielding layers, and the overall electromagnetic shielding property of the material can be conveniently adjusted. Due to design and construction of the insulating layers on two sides of the material, the defect that the insulation property is affected as the surface of the material is conductive is avoided. The insulating polymer based electromagnetic shielding material provided by the invention can be applied to the fields such as electronic appliances, microelectronic devices and chemical products which require that the material is insulating and has the electromagnetic shielding function.
Owner:BEIJING TECHNOLOGY AND BUSINESS UNIVERSITY

Array substrate, manufacturing method thereof and display device

The invention relates to an array substrate, a manufacturing method thereof and a display device. The array substrate comprises a display area and a non-display area. A peripheral circuit is arrangedin the non-display area, and the peripheral circuit comprises a test area, a binding area and a cutting area. A test signal line is arranged in the test area and used for providing a test signal. Thebinding area is close to the display area, and the binding area and the test area are electrically connected through a signal lead. The cutting area is arranged between the test signal area and the binding area. After finishing a cutting process in the cutting area, a cutting opening is formed in each signal lead, wherein the position of the cutting port of at least one signal lead is different from the positions of the cutting ports of other signal leads. Therefore, the distance between the cutting openings of the two adjacent signal leads is increased, the possibility that the two adjacent signal leads are connected together through metal chippings is reduced, the problem of short circuit between the two adjacent signal leads caused by laser cutting is avoided, and the yield of the panelis improved.
Owner:CHUZHOU HKC OPTOELECTRONICS TECH CO LTD +1
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