The utility model discloses a packaging structure and a
radio frequency module, and relates to the technical field of
radio frequency module packaging. A
metal array composed of
metal bodies is arranged around a to-be-shielded device, and a
metal shielding layer is connected with one end, exposed out of a first plastic
package layer, of each metal body and is connected with a substrate, so that cavity-divided shielding of the to-be-shielded device is realized, a complicated internal shielding structure is not needed, and a special process flow is not needed, and therefore, the shielding of the to-be-shielded device among all chips can be realized. Or the
chip is shielded from the outside, a metal body can be freely arranged according to the position needing to be shielded, and the quality of the
chip is not influenced; a metal array composed of vertical metal bodies is arranged around a to-be-shielded device, a shielding line arc is arranged on the metal bodies, and the shielding line arc spans the to-be-shielded device and forms a shielding cavity with the metal array, so that space waste caused by an arc line can be reduced; the number of
layers of the metal arrays is increased, so that the metal bodies of the adjacent
layers of metal arrays are distributed in a staggered mode, and / or the distribution density of shielding wire arcs is increased, and the
electromagnetic shielding effect can be further enhanced.