Composite cable containing electromagnetic shielding material and manufacturing method thereof
By using a double helix shielding layer combined with semiconductor and graphene in the cable, the problem of severe heat generation, oscillation and signal interference in the strong magnetic field is solved, and an efficient electromagnetic shielding effect is achieved.
Patent Information
- Application Number
- CN202510010347.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-03
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2045-01-03
AI Technical Summary
Existing cables are prone to heat, oscillation and severe signal interference in strong magnetic fields, making it difficult to meet high shielding requirements.
A shielding body is made by combining semiconductors and graphene to form a shielding layer with a double helix structure, and a shielding layer is embedded in the insulating sheath. The shielding body is connected by carbon nanotubes to improve the conductivity and thickness of the shielding layer.
Effectively isolate external electromagnetic interference signals, reduce electromagnetic wave radiation, improve the electromagnetic shielding effect of the cable, and quickly introduce it into the ground when grounded, reducing the heat and oscillation problems of the cable.
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Figure CN119400509A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of cable manufacturing, and in particular to a composite cable containing electromagnetic shielding material and a manufacturing method thereof. Background Art
[0002] Wires are used to transmit electricity and electrical signals, and are mainly composed of a wire core and an insulating sheath wrapped around the wire core. The wire core is mainly made of metal copper, which has the advantages of low resistance, good conductivity, corrosion resistance and good stability. In the transmission of signals, two copper wires with insulating protective layers are usually twisted together at a certain density. The radio waves radiated by each wire during transmission will be offset by the radio waves emitted by the other wire, reducing the degree of signal interference. This twisted pair is more commonly used in network cables. In some use occasions with relatively high shielding requirements, it is obviously not possible to meet the shielding requirements. When the wire is used in an occasion with high magnetic field strength, the wire is prone to heat up, and the magnetic field force generated by the current passing through the magnetic field causes the wire to produce a certain oscillation, and the electromotive force is generated to cause the voltage to rise, which affects the normal transmission of the signal and the service life of the wire. Therefore, it is necessary to seek a shielded wire that can overcome the use in a strong magnetic field and has a good shielding effect on the magnetic field. Summary of the invention
[0003] The purpose of the present invention is to provide a composite cable containing electromagnetic shielding material and a method for manufacturing the same, by combining semiconductors with graphene to make a shielding body, which is then wound to form a double helix structure to form a shielding layer, thereby constructing a barrier to isolate electromagnetic interference and playing the role of electromagnetic shielding.
[0004] In order to solve the above technical problems, the technical solution provided by the present invention is: a composite cable containing electromagnetic shielding material, comprising an insulating sheath, a conductive core and a shielding layer, the insulating sheath wraps the conductive core, the shielding layer is embedded in the insulating sheath, the shielding layer comprises a semiconductor and graphene, the semiconductor is in a strip shape, the strip semiconductor is heated to a molten state in a furnace, graphene is coated on the surface of the molten semiconductor, and a shielding body of the semiconductor and graphene is obtained by cooling, every two shielding bodies are intertwined to form a spatial double helix structure, and a plurality of shielding bodies with double helix structures are woven to form a woven belt structure, wherein the graphene is in a honeycomb lattice sheet structure, the graphene forms a dense covering layer on the surface of the semiconductor, the number of graphene stacking layers is 5-8 layers, and the semiconductor heating temperature is 1415°C~1500°C; and a polyurethane coating is coated on the surface of the shielding layer; the gaps between the shielding bodies are connected by spaced carbon nanotubes, wherein the carbon nanotubes and the shielding bodies are connected by conductive silver glue or ultrasonic nano welding.
[0005] The present invention adopts the above technical solution, and semiconductors and graphene are combined into a group, which are intertwined with each other, and then multiple groups of intertwined semiconductors and graphene are intertwined and combined to form a spiral braided belt-shaped shielding layer. The spiral structure formed by each group of shielding bodies is provided with carbon nanotubes for connection, so that the entire braided belt-shaped shielding layer is conductive and forms a spatial structure, so that the thickness of the shielding layer is increased, and the electromagnetic wave energy can be better reflected and weakened, the conductivity of the shielding layer is improved, and the external interference signal is better introduced into the earth. The shielding layer is applied to wires and cables, and the shielding layer can form a barrier to shield the magnetic field. Based on the reflection, absorption and skin effect of electromagnetic waves, it is grounded during use to introduce external interference signals into the earth. The polyurethane coating also has an absorbing effect, which can absorb or greatly weaken the electromagnetic wave energy received on its surface, thereby improving the electromagnetic shielding effect. The composite cable of the present invention is composed of a semiconductor and a graphene group, which are wound together, and then a plurality of groups of wound semiconductors and graphene are wound and combined to form a spiral braided belt structure, which is embedded in an insulating sheath and surrounds the outer periphery of the conductive core to form a barrier to shield the magnetic field. The barrier is based on the reflection, absorption and skin effect of electromagnetic waves and is grounded during use to introduce external interference signals into the earth, thereby improving the electromagnetic shielding effect.
[0006] In the composite cable containing electromagnetic shielding material, the polyurethane coating mixed with adhesive is coated on the surface of the shielding layer. The polyurethane coating plays a role in absorbing electromagnetic wave energy and weakening the radiation of electromagnetic waves.
[0007] In the composite cable containing electromagnetic shielding material, the cross section of the semiconductor is circular, the cross section of the graphene is annular, and the thickness of the graphene is greater than or equal to the radius of the semiconductor. The combination of graphene and semiconductor improves the performance of absorbing and scattering electromagnetic waves, prevents electromagnetic waves from penetrating and causing a reaction electric field, thereby achieving the effect of electromagnetic shielding. When electromagnetic waves pass through graphene, the electrons of the graphene are excited and undergo energy level transitions, dissipating part of the electromagnetic energy.
[0008] When the semiconductor and graphene are used to make the shielding body of the composite cable containing electromagnetic shielding material, the same volume of semiconductor and graphene can be pressed together at high temperature to form a strip-shaped shielding body, wherein the ratio of semiconductor to graphene is 1:1. The shielding body is made by pressing half of the semiconductor and graphene at high temperature, providing different manufacturing processes.
[0009] The above-mentioned composite cable containing electromagnetic shielding material, the insulating sheath includes an inner insulating layer, a heat dissipation layer, a waterproof layer and an outer insulating layer arranged in sequence from the inside to the outside, wherein the inner and outer insulating layers are made of polyethylene material, and the shielding layer is arranged between the heat dissipation layer and the waterproof layer.
[0010] In the composite cable containing electromagnetic shielding material, the conductive core is made of a metal copper core and a graphene core, and the graphene core surrounds the outer periphery of the metal copper core. Adding graphene material can improve the conductivity of the conductive core.
[0011] The above-mentioned composite cable containing electromagnetic shielding material, the conductive core is composed of two metal copper cores, the surfaces of the two metal copper cores are coated with graphene coating, the two metal copper cores are insulated from each other and are intertwined to form a twisted pair.
[0012] In the composite cable containing electromagnetic shielding material, the two ends of the carbon nanotubes are supported on two shielding bodies, and each group of shielding bodies is connected by metal foil, so that the shielding layer is enclosed as a whole to form a hollow tubular structure, and the metal foil is connected to the two ends of the shielding body, and the shielding body is stacked on the shielding layer to form a grid structure of several layers. The metal foil is a flexible conductive material, and after connecting multiple groups of shielding bodies, the overall flexibility and conductivity of the shielding layer can be guaranteed. When the shielding layer is grounded during use, after the outer layer of the insulating sheath is opened, the shielding layer can be stretched to a certain extent, which is convenient for operation.
[0013] Another technical solution provided by the present invention is: a method for manufacturing the composite cable containing the electromagnetic shielding material, which is manufactured by the following steps: Step S01: weaving and winding the graphene core around the outer periphery of the metal copper core, pressing them tightly or heating and fusing them into one, to obtain a conductive core; Step S02: immersing the conductive wire core in polyethylene material, covering it with an inner insulating layer, and then covering it with a heat dissipation layer made of high-temperature silicon sulfide after the inner insulating layer is cooled; Step S03: heating the semiconductor to 1415°C-1500°C in a furnace to form a molten state on its surface, spraying graphene on the surface of the semiconductor, and obtaining a shielding body of the semiconductor and graphene after cooling, connecting the two ends of the carbon nanotubes to two of the shielding bodies by means of conductive silver glue bonding or ultrasonic nano welding, and then rotating them to form a spatial double helix structure, weaving the shielding body with a spatial double helix structure to form a hollow braided belt and sheathing it on the periphery of the heat dissipation layer as a shielding layer; Step S04: Coat the surface of the shielding layer with a polyurethane coating and a waterproof glue in sequence, immerse the wire in a polyethylene material after solidification, and take it out and solidify to form an outer insulation layer.
[0014] Due to the adoption of the above-mentioned manufacturing method, in the electromagnetic shielding composite cable of the present invention, the high electron mobility of graphene on the metal copper core can reduce electron scattering in copper and reduce resistance, thereby significantly improving the conductivity of the material; the high-temperature silicon sulfide achieves the heat dissipation effect while also having flame retardant properties; the shielding layer utilizes a spiral woven belt structure constructed by weaving semiconductors and graphene to form an electromagnetic shielding barrier, which effectively isolates external electromagnetic interference signals; the polyurethane coating absorbs electromagnetic waves and reduces the energy of electromagnetic waves radiated to the cable; the waterproof layer is coated on the surface of the shielding layer to play a waterproof role, and finally an outer insulating layer is covered on the outer periphery of the waterproof layer to achieve the last layer of insulation of the cable.
[0015] The beneficial effects achieved by the present invention are as follows: after the semiconductor is heated to a molten state, powdered graphene is coated on its surface, the graphene and the semiconductor are fused into one, the graphene forms a dense covering layer on the semiconductor surface, which can absorb and reflect electromagnetic waves radiated on its surface, and weaken the energy of the electromagnetic waves. Then the semiconductor and the graphene form a shielding body, and every two shielding bodies are connected by spaced carbon nanotubes, and are wound to form a spatial double helix structure, and then multiple groups of shielding bodies with double helix structures are combined to form a braided belt, so that the thickness of the shielding layer is increased, and the high conductivity of carbon nanotubes and graphene is used to ground during use, and the electromagnetic waves radiated to the surface of the cable will be reflected and absorbed, and the current generated on the shielding layer will be quickly introduced into the earth, so as to achieve high shielding performance. The polyurethane coating coated on the surface of the shielding layer is an absorbing material, which further absorbs and weakens the energy of electromagnetic wave radiation. The semiconductor is heated to 1415°C to 1500°C, which exceeds the melting point of the semiconductor, so that the semiconductor surface begins to form a molten state, and the graphene powder can be evenly distributed on the semiconductor surface and firmly combined after cooling. The present invention utilizes semiconductors and graphene to weave a spiral braided belt, which is wrapped around the outer circumference of the conductive core to form an electromagnetic shielding barrier. Graphene has good conductivity and can introduce external interference signals into the earth, thereby improving the electromagnetic shielding effect of the cable. The cable of the present invention can be used in network cables, control cables, audio and video transmission, industrial control and other fields. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 is a schematic diagram of the cross-sectional structure of a composite cable according to an embodiment of the present invention; Figure 2 is a schematic cross-sectional structure diagram of another embodiment of the present invention; Figure 3 It is a schematic diagram of the structure of the semiconductor and graphene combined to form a double helix shape of the present invention; Figure 4 is a schematic diagram of a partial structure of a shielding layer according to an embodiment of the present invention; Figure 5 is a schematic structural diagram of a shielding body according to an embodiment of the present invention; Figure 6 is a schematic structural diagram of a shielding body according to another embodiment of the present invention; Figure 7 The above is a flow chart of a method for manufacturing a composite cable according to an embodiment of the present invention.
[0017] Explanation of the reference numerals: insulating sheath 1, conductive core 2, shielding layer 3, inner insulating layer 11, heat dissipation layer 12, waterproof layer 13, outer insulating layer 14, metal copper core 21, graphene core 22, graphene coating 23, semiconductor 31, graphene 32, carbon nanotube 33, polyurethane coating 34, metal foil 35, shielding body 3a. DETAILED DESCRIPTION
[0018] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0019] Reference Figures 1 to 6As shown, a composite cable containing electromagnetic shielding material includes an insulating sheath 1, a conductive core 2 and a shielding layer 3, wherein the insulating sheath 1 wraps the conductive core 2, and the shielding layer 3 is embedded in the insulating sheath 1, and the shielding layer 3 includes a semiconductor 31 and graphene 32, wherein the semiconductor 31 is in a strip shape, and the strip-shaped semiconductor 31 is heated in a furnace to be molten, and the graphene 32 is coated on the surface of the molten semiconductor 31, and the shielding body 3a of the semiconductor 31 and the graphene 32 is obtained by cooling, and every two shielding bodies 3a are intertwined to form a spatial double helix structure, and a plurality of shielding bodies 3a with a double helix structure are woven to form a braided belt-shaped shielding layer 3, wherein the graphene forms a dense covering layer on the surface of the semiconductor, and the graphene is in a sheet structure of a honeycomb lattice, and the number of graphene stacked layers is 5-8 layers, and the heating temperature of the semiconductor 31 is 1415°C~1500°C; and a polyurethane coating 34 is coated on the surface of the shielding layer 3; wherein the polyurethane coating 34 is preferably coated on the surface of the shielding body 3a. The gaps between the shielding bodies 3a are connected by the carbon nanotubes 33 arranged at intervals, wherein the carbon nanotubes 33 and the shielding bodies 3a are connected by conductive silver glue or ultrasonic nano welding. The semiconductor 31 of this embodiment adopts crystalline silicon, whose melting point is 1410°C. When it is heated above its melting point, the semiconductor 31 gradually forms a molten state, and then it is stretched into a strip by a stretching machine, and graphene powder is coated on the surface of the semiconductor 31 in the molten state, so that the graphene powder is attached to the surface of the semiconductor 31. After cooling and solidification, the graphene and the semiconductor are tightly combined to form the shielding body 3a. When the carbon nanotubes 33 and the shielding body 3a are connected, they can be bonded by a silver powder-containing glue with conductive function at a certain curing temperature, and the conductivity can be guaranteed; high-frequency vibration waves can also be used to transmit to the surfaces of the two objects to be welded, and under pressure, the surfaces of the two objects are rubbed against each other to form a fusion between the molecular layers, thereby completing the connection between the carbon nanotubes 33 and the shielding body 3a. After the carbon nanotubes 33 are connected to the shielding body 3a, every two shielding bodies 3a are grouped together, and then a double helix structure is formed by weaving and winding. Then, multiple groups of shielding bodies 3a with double helix structures are woven to form a braided belt-shaped shielding layer 3. The carbon nanotubes have good mechanical properties, and the tensile strength reaches 50 to 200 GPa, which is 100 times that of steel. The carbon nanotubes have high hardness and good flexibility and can be stretched. The shielding layer 3 has a firm structure and is not easily scratched by a blade when the cable sheath is peeled off. When grounding at the head end or the tail end, it can be stretched and wound to ground, so that the shielding layer 3 has good structural firmness and operability.
[0020] In this embodiment, the semiconductor 31 is heated to 1415°C, the surface of the semiconductor 31 begins to soften and slowly forms a molten state, the semiconductor 31 is stretched into a strip by the aforementioned stretching machine, and the temperature of the semiconductor 31 is continued to rise to 1500°C, at which time the surface of the semiconductor 31 enters a molten state, and the semiconductor fluidity on the surface is higher. Then, graphene powder is sprayed on the semiconductor so that the graphene is better combined with the semiconductor.
[0021] Graphene is an allotrope of carbon, with carbon atoms bonded in sp² hybridization to form a single-layer hexagonal honeycomb lattice graphene. Fullerene (C60), graphene quantum dots, carbon nanotubes, nanobelts, multi-walled carbon nanotubes and nanohorns can be constructed using this crystal structure. Stacked graphene layers (greater than 10 layers) form graphite, and the layers are held together by van der Waals forces, with a crystal plane spacing of 0.335 nanometers. The number of layers of graphene stacked in this embodiment is 5-8 layers.
[0022] In this embodiment, two shielding bodies 3a are placed at intervals and connected by the spaced carbon nanotubes 33, and then the two connected shielding bodies 3a are rotated to spiral continuously, and finally form a double helix structure, such as Figure 3 As shown. The shielding body 3a with a double helix structure forms a three-dimensional structure in space, and is then woven and formed by a warp knitting machine, so that multiple groups of shielding bodies 3a with double helix structures are intertwined and combined to form a braided shielding layer 3. Among them, the shielding layer 3 is hollow, and the conductor core is used to pass through it, and the shielding layer 3 has an electromagnetic shielding effect. The shielding layer 3 of this embodiment can construct an electromagnetic shielding barrier in space, and due to the double helix structure of the shielding body 3a, the thickness of the shielding layer 3 can be increased when it is made into a braided belt, thereby enhancing its ability to shield electromagnetic interference. Among them, the shielding bodies 3a that form the braided belt can be connected by contact conduction, and multiple groups of shielding bodies 3a are intertwined and connected with each other.
[0023] The polyurethane coating 34 is mixed with an adhesive and coated on the surface of the shielding layer 3. Polyurethane is an absorbing material that can absorb the electromagnetic wave energy radiated from its surface, weaken the energy of electromagnetic radiation, and assist the shielding layer 3 in shielding electromagnetic interference.
[0024] The cross section of the semiconductor 31 is circular, the cross section of the graphene 32 is annular, and the thickness of the graphene 32 is greater than or equal to the radius of the semiconductor 31 .
[0025] like Figure 6As shown, in other embodiments, when the semiconductor 31 and the graphene 32 are made into the shielding body 3a, the semiconductor 31 and the graphene 32 of the same volume can also be pressed together at high temperature to form a strip-shaped shielding body 3a, wherein the composition percentage of the semiconductor 31 and the graphene 32 is 1:1. The semiconductor 31 can be heated to a semi-molten state, and then the graphene 32 is attached to the surface of the semiconductor 31, and a certain pressure is applied to combine them.
[0026] Combination Figure 1-6 As shown, the shielding layer 3 is arranged around the conductive core 2 and embedded in the insulating sheath 1, acting as a barrier. The single semiconductor 31 and graphene 32 of each group are intertwined and spiraled to form a double helix structure. The double helix structure composed of multiple groups of semiconductors 31 and graphene 32 is then woven into a braided belt. The shielding layer 3 forms a braided belt structure and coaxially surrounds the conductive core 2, which can block external electromagnetic signal interference. At the same time, the graphene 32 is combined with the semiconductor 31 and grounded to connect the interference signal to the ground.
[0027] In different embodiments, the conduction between the semiconductor 31 and the graphene 32 is achieved in different ways. For example, each group of semiconductors and the graphene are contact-connected. In other embodiments, there is a gap between each group of semiconductors and the graphene, and the gaps are connected by carbon nanotubes arranged at intervals. The semiconductor 31 is used as a shielding layer, which can help the shielding layer 3 to evenly distribute the charge, and cooperate with the highly conductive graphene 32 to guide the interference current generated by electromagnetic radiation into the ground.
[0028] The semiconductor 31 and the graphene 32 are spiraled to form a double helix structure. When multiple groups of semiconductors 31 and graphene 32 with double helix structures are combined to form a braided belt-shaped shielding layer 3, the thickness of the shielding layer 3 can be increased, thereby improving the electromagnetic shielding performance.
[0029] The shielding principle of the shielded cable is based on the reflection, absorption and skin effect of electromagnetic waves. The shielding layer of the shielded cable can have a metal braided mesh or copper foil, which can be grounded to introduce external interference signals into the earth, thereby reducing interference to the cable. In the embodiment of the present invention, the semiconductor 31 can play a role in uniformly distributing the electric field, reducing the local electric field strength, and avoiding excessive electric field strength; the graphene 32 is combined on the semiconductor 31, wherein the graphene 32 can be made into a strip shape and adapted to the shape of the semiconductor 31, and the graphene 32 and the semiconductor 31 are combined to form a double helix structure, thereby forming the shielding layer 3 of the cable. The high conductivity of the graphene 32 is used to increase the conductivity of the shielding layer 3, reduce its resistance, and introduce external electromagnetic interference signals into the earth. The cable transmits electrical signals in an environment with high magnetic field strength, and the current in the magnetic field will generate a force, so that the cable will generate a certain amplitude, and the shielding layer 3 of the cable is a conductor, which cuts the magnetic induction lines in the magnetic field during vibration, and the conductor moves in the magnetic field to generate a certain magnetic induction current. The present invention combines a semiconductor 31 and graphene 32 to form a double helix structure, and then weaves multiple groups of semiconductors 31 and graphene 32 in a double helix structure to form a shielding layer 3 with a braided belt structure, so that the shielding layer 3 has a large thickness. On the one hand, it reflects the electromagnetic waves outside the cable, and on the other hand, it uses the high conductivity of the graphene 32 to quickly conduct the magnetic induction current generated by it into the earth after grounding.
[0030] The commonly used shielding layer in cables is a metal braided mesh or copper foil, which reflects external electromagnetic waves and prevents them from entering the interior of the cable, thereby reducing the introduction of external interference signals. The shielding layer can also have an absorption effect. The eddy current of the shielding layer will consume the energy of the electromagnetic waves and convert it into heat energy, thereby reducing the intensity of the interference signal. High-frequency electromagnetic waves are more concentrated on the surface of the conductor. The shielding layer can effectively prevent high-frequency electromagnetic waves from penetrating, further reducing interference.
[0031] In the present invention, the shielding layer 3 is composed of semiconductor 31 and graphene 32. The semiconductor 31 and graphene 32 are first combined to form a double helix structure, and are also connected by contact or carbon nanotubes 33, and then a plurality of groups of semiconductors 31 and graphene 32 with double helix structures are combined to weave into a shielding layer 3 in the shape of a braided belt, so that the shielding layer 3 of the present invention has a large thickness, and forms a shielding net on the periphery of the conductive core 2. When the cable is running in an environment with high magnetic field intensity, external electromagnetic waves cannot penetrate the shielding layer 3, and eddy currents are formed on the surface of the shielding layer 3 to consume the energy of the electromagnetic waves radiated from the outside, convert them, and concentrate high-frequency electromagnetic waves on the surface of the shielding layer 3, and finally the interference signal is introduced into the earth through conversion through grounding, thereby achieving a good shielding effect.
[0032] In other embodiments, the semiconductor and graphene may be combined in other ways, such as coating the graphene on the semiconductor as a coating, or adding graphene powder to the semiconductor to change the conductivity of the semiconductor.
[0033] In this embodiment, the semiconductor is made of one of gallium arsenide, silicon, cadmium sulfide, and gallium phosphide. Each semiconductor and graphene is in the shape of a round bar, and the grid formed on the surface is circular, elliptical, triangular or rectangular. The surface of the shielding layer 3 is in the shape of a grid, so that the shielding layer 3 presents a grid form, and when it surrounds the outer periphery of the conductive core, it forms a shielding net, which can be stretched during grounding operations. Compared with rectangles of the same length, the circular graphene and semiconductor have a larger area of a circular cross-section, and the resistance of the conductor is calculated as R=ρ*L / S, where R is resistance, ρ is resistivity, L is the conductor length, and S is the cross-sectional area of the conductor. When graphene and semiconductors are used as conductors, their resistivity ρ is determined. Under the same length L, the larger the cross-sectional area S, the smaller the resistance R. Therefore, setting the graphene and semiconductor into a round bar shape is conducive to reducing the resistance value of the shielding layer.
[0034] In this embodiment, the insulating sheath 1 includes an inner insulating layer 11, a heat dissipation layer 12, a waterproof layer 13 and an outer insulating layer 14 arranged in sequence from the inside to the outside, wherein the inner insulating layer 11 and the outer insulating layer 14 are made of polyethylene material, and the shielding layer 3 is embedded between the heat dissipation layer 12 and the waterproof layer 13.
[0035] The conductive core 2 is made of a metal copper core 21 and a graphene core 22, and the graphene core 22 surrounds the outer periphery of the metal copper core 21. The graphene material has high conductivity and is combined with the metal copper core 21 to improve the conductivity of the conductive core 2. In other embodiments, the graphene material can also be added to the metal copper liquid to infiltrate the graphene into the copper core to improve the conductivity of the copper core. In addition, graphene also has high corrosion resistance and heat resistance, improves the electric field distribution of the metal copper core 21, reduces the breath between the conductor and the insulating layer, and thus reduces the electric field concentration phenomenon.
[0036] like Figure 2 As shown, the conductive wire core 2 is composed of two metal copper cores 21, and the surfaces of the two metal copper cores 21 are coated with a graphene coating 23. The two metal copper cores 21 are insulated from each other and intertwined to form a twisted pair. Due to the twisted design of the twisted pair, the electromagnetic field between the copper wires formed by the two metal copper cores 21 will cancel each other out, thereby reducing the sensitivity to external interference and playing a shielding role. In addition, the twisting of the twisted pair can also help eliminate its own internal interference and external noise interference, thereby improving the reliability of data transmission.
[0037] like Figure 4As shown, in this embodiment, the two ends of the carbon nanotube 33 are supported on two shielding bodies 3a, and each group of shielding bodies 3a is connected by a metal foil 35, so that the shielding layer 3 is enclosed as a whole to form a hollow tubular structure, and the metal foil 35 is connected to the two ends of the shielding body 3a, and the shielding body 3a is stacked on the shielding layer 3 to form a plurality of layers of grid structure. In this embodiment, the shielding layer 3 is composed of three or more layers of double-helix shielding bodies 3a, and the shielding bodies 3a are stacked so that there is no large gap inside the shielding layer 3 to leak electromagnetic waves and allow the electromagnetic waves to directly penetrate the shielding layer 3. The shielding layer 3 of the hollow tubular structure surrounds the conductive core 2 to form a barrier to shield the electromagnetic interference in the strong magnetic environment from the outside of the shielding layer 3. The metal foil 35 is made of metal material and is extended into a thin metal sheet to connect each group of shielding bodies 3a to construct a spatial tubular shielding layer 3 structure. The holes formed by the gaps between the shielding bodies 3a indicate that the shielding layer 3 can be stretched after the outer skin of the insulating sheath 1 of the cable is stripped, and has a certain shrinkage to ground the shielding layer 3. In addition, the surface of the shielding layer 3 is dense, which can strongly absorb and reflect electromagnetic wave energy.
[0038] Reference Figure 7 As shown, the embodiment of the present invention also discloses a method for manufacturing the electromagnetic shielding composite cable described in the above specific embodiment, which is manufactured by the following steps: Step S01: weaving and winding the graphene core around the outer periphery of the metal copper core, pressing them tightly or heating and fusing them into one, to obtain a conductive core; Step S02: immersing the conductive wire core in polyethylene material, covering it with an inner insulating layer, and then covering it with a heat dissipation layer made of high-temperature silicon sulfide after the inner insulating layer is cooled; Step S03: heating the semiconductor to 1415°C-1500°C in a furnace to form a molten state on its surface, spraying graphene on the surface of the semiconductor, and obtaining a shielding body of the semiconductor and graphene after cooling, connecting the two ends of the carbon nanotubes to two of the shielding bodies by means of conductive silver glue bonding or ultrasonic nano welding, and then rotating them to form a spatial double helix structure, weaving the shielding body with a spatial double helix structure to form a hollow braided belt and sheathing it on the periphery of the heat dissipation layer as a shielding layer; Step S04: Coat the surface of the shielding layer with a polyurethane coating and a waterproof glue in sequence, immerse the wire in a polyethylene material after solidification, and take it out and solidify to form an outer insulation layer.
[0039] Step S01 is a step of making a conductive core. In step S01, the graphene core 22 is in the shape of a round strip and is wound around the outer periphery of the metal copper core 21. The graphene core 22 is then heated to raise the temperature of the metal copper core 21 to 1090° C., which exceeds its melting point. The surface of the metal copper core 21 begins to soften. The graphene core 22 wound around the metal copper core 21 is then pressed and bonded to the metal copper core 21 to complete the production of the conductive core 2. Step S02 is to coat the inner insulating layer 11 and the heat dissipation layer 12 on the conductive core, heat the polyethylene material into a molten liquid state, immerse the conductive core 2 in and pass through the polyethylene material, so that the polyethylene covers the surface of the conductive core 2, and then cool and form, and then coat the heat dissipation layer 12 on the inner insulating layer 11 in the same way, wherein the heat dissipation layer 12 can be made of high-temperature sulfide silicon; Step S03 is the preparation of the shielding layer. In step S03, the semiconductor begins to melt at a temperature of 1410°C. In this implementation step, the semiconductor is heated to 1415°C or above, so that the surface of the semiconductor 31 is melted, and then the powdered graphene is sprayed on the surface of the semiconductor 31, so that the surface of the semiconductor 31 is covered with graphene 32, and the graphene 32 is wrapped around the periphery of the semiconductor 31 after cooling and solidification, so as to form a shielding body 3a for preparing the shielding layer 3; then, every two shielding bodies 3a are used, and then carbon nanotubes 33 are connected between the two shielding bodies 3a by conductive silver glue bonding or ultrasonic nano welding, and then one end of the two shielding bodies 3a is rotated by a warp knitting machine or other equipment about the center line of the distance between them, and a spatial double helix structure is formed; then, multiple groups of shielding bodies with double helix structures are woven to form a braided belt, so that the braided belt has a thicker thickness and can be stacked with more layers, and the braided belt is used as the shielding layer 3 and is mounted on the periphery of the heat dissipation layer 12; In step S04 , finally, a polyurethane coating 34 of absorbing material is coated on the surface of the shielding layer 3 to further absorb the energy of electromagnetic waves, and then waterproof glue is coated to form a waterproof layer 13 and polyethylene rubber is coated to complete the coating of the outer insulating layer 14 .
[0040] In step S03, after the braided shielding layer 3 is braided, metal foils 35 may be passed through both ends of the shielding layer 3 to connect each double helix structure shielding body 3a to each other, thereby forming a hollow braided belt.
[0041] The electromagnetic shielding composite cable prepared by the method has composite semiconductor and graphene as the shielding layer, has high shielding performance and conductive performance, and is suitable for industrial control, signal transmission, long-distance power transmission and other fields.
[0042] In other embodiments, when manufacturing the conductive core, a graphene coating 23 is coated on the surface of the metal copper core 21 to replace the braided and wound graphene core 22 .
[0043] In the specific implementation of the present invention, the graphene core 22 is woven and wound around the outer periphery of the metal copper core 21, and then the graphene core 22 and the metal copper core 21 are tightly connected by pressing, or the graphene core 21 is combined together by heating the metal copper core 21, that is, the surface of the metal copper core 21 is melted by heating to form a molten state, and the graphene core 22 is fused to the surface of the metal copper core 21, and after cooling and solidification, the metal copper core 21 and the graphene core 22 are tightly combined.
[0044] Then, the insulating sheath 1 is covered on the conductive core 2. Polyethylene material is molded on the outer surface of the conductive core 2 to form an inner insulating layer 11, and high-temperature sulfide silicon is coated on the outer surface of the inner insulating layer 11 to form a heat dissipation layer 12. Then, the braided shielding layer 3 is sleeved on the outer surface of the heat dissipation layer 12, wherein the shielding layer 3 is kept coaxial with the conductive core 2. Then, waterproof glue is coated on the surface to form a waterproof layer 13, and finally, polyethylene material is molded on the outer surface of the waterproof layer 13 to form an outer insulating layer 14.
[0045] In summary, the present invention has been made into actual samples and tested for multiple times as described in the specification and the drawings. From the results of the test, it can be proved that the present invention can achieve its intended purpose, and its practical value is beyond doubt. The above embodiments are only used to illustrate the present invention, and are not intended to limit the present invention in any form. Any person with ordinary knowledge in the technical field, if it does not depart from the scope of the technical features of the present invention, uses the equivalent embodiments of the technical content disclosed by the present invention to make partial changes or modifications, and does not depart from the technical features of the present invention, all still fall within the scope of the technical features of the present invention.
Claims
1. A composite cable containing electromagnetic shielding material, comprising an insulating sheath, a conductive core and a shielding layer, wherein the insulating sheath wraps the conductive core, and the shielding layer is embedded in the insulating sheath, characterized in that: The shielding layer comprises a semiconductor and graphene, wherein the semiconductor is in a strip shape, the strip semiconductor is heated to a molten state in a furnace, graphene is coated on the surface of the molten semiconductor, and the semiconductor and graphene shielding body is obtained by cooling, wherein every two shielding bodies are intertwined to form a spatial double helix structure, and a plurality of shielding bodies with double helix structures are woven to form a woven belt structure, wherein the graphene is in a honeycomb lattice sheet structure, the graphene forms a dense covering layer on the surface of the semiconductor, the number of graphene stacking layers is 5-8 layers, and the semiconductor heating temperature is 1415°C~1500°C; and a polyurethane coating is coated on the surface of the shielding layer; the gaps between the shielding bodies are connected by spaced carbon nanotubes, wherein the carbon nanotubes and the shielding bodies are connected by conductive silver glue or ultrasonic nano welding.
2. The composite cable containing electromagnetic shielding material according to claim 1, characterized in that: The polyurethane coating mixed with the adhesive is coated on the surface of the shielding layer.
3. The composite cable containing electromagnetic shielding material according to claim 1, characterized in that: The cross section of the semiconductor is circular, the cross section of the graphene is annular, and the thickness of the graphene is greater than or equal to the radius of the semiconductor.
4. The composite cable containing electromagnetic shielding material according to claim 1, characterized in that: When the semiconductor and graphene are made into a shielding body, the semiconductor and graphene of the same volume can also be pressed together at high temperature to form a strip-shaped shielding body, wherein the composition percentage of the semiconductor and the graphene is 1:
1.
5. The composite cable containing electromagnetic shielding material according to claim 1, characterized in that: The insulating sheath comprises an inner insulating layer, a heat dissipation layer, a waterproof layer and an outer insulating layer which are arranged in sequence from the inside to the outside, wherein the inner and outer insulating layers are made of polyethylene material, and the shielding layer is arranged between the heat dissipation layer and the waterproof layer.
6. The composite cable containing electromagnetic shielding material according to claim 5, characterized in that: The conductive core is made of a metal copper core and a graphene core, and the graphene core surrounds the outer circumference of the metal copper core.
7. The composite cable containing electromagnetic shielding material according to claim 5, characterized in that: The conductive wire core is composed of two metal copper cores, the surfaces of the two metal copper cores are coated with graphene coatings, the two metal copper cores are insulated from each other and are intertwined to form a twisted pair.
8. The composite cable containing electromagnetic shielding material according to claim 1, characterized in that: The two ends of the carbon nanotubes are supported on two shielding bodies, and each group of shielding bodies is connected by metal foil, so that the shielding layer is enclosed as a whole to form a hollow tubular structure. The metal foil is connected to the two ends of the shielding body, and the shielding body is stacked on the shielding layer to form a grid structure of several layers.
9. A method for manufacturing a composite cable containing an electromagnetic shielding material as claimed in any one of claims 1 to 8, characterized in that: Prepared by the following steps: Step S01: weaving and winding the graphene core around the outer periphery of the metal copper core, pressing them tightly or heating and fusing them into one, to obtain a conductive core; Step S02: immersing the conductive wire core in polyethylene material, covering it with an inner insulating layer, and then covering it with a heat dissipation layer made of high-temperature silicon sulfide after the inner insulating layer is cooled; Step S03: heating the semiconductor to 1415°C-1500°C in a furnace to form a molten state on its surface, spraying graphene on the surface of the semiconductor, and obtaining a shielding body of the semiconductor and graphene after cooling, connecting the two ends of the carbon nanotubes to two of the shielding bodies by means of conductive silver glue bonding or ultrasonic nano welding, and then rotating them to form a spatial double helix structure, weaving the shielding body with a spatial double helix structure to form a hollow braided belt and sheathing it on the periphery of the heat dissipation layer as a shielding layer; Step S04: Coat the surface of the shielding layer with a polyurethane coating and a waterproof glue in sequence, immerse the wire in a polyethylene material after solidification, and take it out and solidify to form an outer insulation layer.
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