Array substrate mother board, array substrate, display device, and manufacturing method thereof

A technology for array substrates and display devices, which is applied in the direction of identification devices, instruments, semiconductor devices, etc., and can solve problems such as bad dots and lines

Inactive Publication Date: 2018-09-21
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present disclosure is to provide an array substrate and its detection method, an array substrate mother board and a display

Method used

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  • Array substrate mother board, array substrate, display device, and manufacturing method thereof
  • Array substrate mother board, array substrate, display device, and manufacturing method thereof
  • Array substrate mother board, array substrate, display device, and manufacturing method thereof

Examples

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Embodiment Construction

[0036] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of example embodiments to those skilled in the art. The drawings are merely schematic illustrations of the present disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and thus repeated descriptions thereof will be omitted.

[0037] Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided in order to give a thorough understanding of embodiments of the present disclosure. However, those skilled in ...

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Abstract

The disclosure provides an array substrate mother board, an array substrate, a display device, and a manufacturing method thereof, and belongs to the technical field of display. The array substrate mother board has a plurality of array regions. Each of the array regions includes a display region and a signal introduction region. The signal introduction region includes: a binding region adjacent tothe display region; and a switch circuit region including a plurality of switching transistors in a predetermined area between the binding region and a cutting line, wherein the cutting line is a dividing line for cutting adjacent array regions; the control ends of the switching transistors are connected to a control signal line; the first end and the second end of each switching transistor are connected to a test signal line of the bonding region and a test signal line of the adjacent array region, respectively. The array substrate mother board can solve the short circuit of a cutting section caused by cutting in the prior art by using the switching transistors.

Description

technical field [0001] The present disclosure relates to the field of display technology, in particular, to an array substrate motherboard, an array substrate, a display device and a manufacturing method thereof. Background technique [0002] Flexible displays are made of soft materials that can be shaped and bent. Compared with traditional display screens, flexible display screens have obvious advantages. Not only are they thinner and thinner in size, but they also consume less power than traditional display screens, which helps to improve the battery life of the device. At the same time, based on its bendable and flexible characteristics , so it has become more and more widely used in recent years. [0003] If the flexible display is cut using the traditional cutting method, the glass substrate used to carry the flexible display panel is first cut with a cutting knife, and then the flexible film layer is cut manually with a knife. This cutting method is easy to cause Bur...

Claims

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Application Information

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IPC IPC(8): H01L27/32G09F9/30
CPCG09F9/301H10K59/40H10K59/12H10K59/131
Inventor 代科莫再隆周刚李林宣
Owner BOE TECH GRP CO LTD
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